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CPC
H01L2224/8209

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/8209Vacuum

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package and methods of packaging thereof
- Patent number 10,297,583
- Issue date May 21, 2019
- Infineon Technologies AG
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and methods of packaging thereof
- Patent number 8,846,452
- Issue date Sep 30, 2014
- Infineon Technologies AG
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140284795
- Publication date Sep 25, 2014
- SK HYNIX INC.
- Sang Eun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package and Methods of Packaging Thereof
- Publication number 20140057393
- Publication date Feb 27, 2014
- INFINEON TECHNOLOGIES AG
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS