Vanadium [V] as principal constituent

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H01L2224/05672

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/05672Vanadium [V] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Silicon carbide device and method for forming a silicon carbide device
- Patent number 11,869,840
- Issue date Jan 9, 2024
- Infineon Technologies AG
- Ralf Siemieniec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor chip, method for producing a power semiconducto...
- Patent number 11,664,335
- Issue date May 30, 2023
- Semikron Elektronik GmbH & Co., KG
- Wolfgang-Michael Schulz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide device and method for forming a silicon carbide device
- Patent number 11,367,683
- Issue date Jun 21, 2022
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with patterned underbump metallization and polym...
- Patent number 11,335,659
- Issue date May 17, 2022
- ATI Technologies ULC
- Roden R. Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-destructive testing of integrated circuit chips
- Patent number 10,651,099
- Issue date May 12, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and power module, and manufacturing method of th...
- Patent number 10,522,638
- Issue date Dec 31, 2019
- Hitachi Power Semiconductor Device, Ltd.
- Masakazu Sagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoresist cleaning composition used in photolithography and a met...
- Patent number 10,072,237
- Issue date Sep 11, 2018
- VERSUM MATERIALS US, LLC
- Randy Li-Kai Chang
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Bonding structure for semiconductor package and method of manufactu...
- Patent number 9,984,993
- Issue date May 29, 2018
- Advanced Semiconductor Engineering, Inc.
- Min-Fong Shu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming pillar bumps on semiconductor wafers
- Patent number 9,831,201
- Issue date Nov 28, 2017
- Guy F. Burgess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device having scribe lines
- Patent number 9,728,477
- Issue date Aug 8, 2017
- Taiwan Semiconductor Manufacturing Company Ltd.
- Nien-Fang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing of thick metal pads
- Patent number 9,673,157
- Issue date Jun 6, 2017
- Infineon Technologies AG
- Paul Ganitzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having solder joint and method of forming the...
- Patent number 9,646,945
- Issue date May 9, 2017
- Samsung Electronics Co., Ltd.
- Soon-Bum Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with patterned underbump metallization and polym...
- Patent number 9,576,923
- Issue date Feb 21, 2017
- ATI Technologies ULC
- Roden R. Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass carrier with embedded semiconductor device and metal layers o...
- Patent number 9,385,075
- Issue date Jul 5, 2016
- Infineon Technologies AG
- Alexander Breymesser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a chip package
- Patent number 9,245,868
- Issue date Jan 26, 2016
- Infineon Technologies AG
- Holger Torwesten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device, method of manufacturing the device and...
- Patent number 9,059,003
- Issue date Jun 16, 2015
- NIPPON MICROMETAL CORPORATION
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating a wafer level semiconductor package having a pre-formed...
- Patent number 8,945,991
- Issue date Feb 3, 2015
- Broadcom Corporation
- Kevin (Kunzhong) Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level semiconductor package
- Patent number 8,922,014
- Issue date Dec 30, 2014
- Broadcom Corporation
- Kevin (Kunzhong) Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packages including bump buffer spring pads and me...
- Patent number 8,836,118
- Issue date Sep 16, 2014
- SK Hynix Inc.
- Tae Min Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package device having solder bump assemblies that inclu...
- Patent number 8,643,150
- Issue date Feb 4, 2014
- Maxim Integrated Products, Inc.
- Yong L. Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 8,614,488
- Issue date Dec 24, 2013
- Ying-Nan Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a wafer level semiconductor package having a...
- Patent number 8,592,259
- Issue date Nov 26, 2013
- Broadcom Corporation
- Kevin (Kunzhong) Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,552,553
- Issue date Oct 8, 2013
- Advanced Semiconductor Engineering, Inc.
- Jian-Wen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating a light-emitting device
- Patent number 8,361,819
- Issue date Jan 29, 2013
- Samsung Electronics Co., Ltd.
- Yu-Sik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip having a metal pillar structure
- Patent number 8,334,594
- Issue date Dec 18, 2012
- Advanced Semiconductor Engineering, Inc.
- Jian-Wen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method for production thereof
- Patent number 8,314,489
- Issue date Nov 20, 2012
- Infineon Technologies AG
- Ralf Siemieniec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit system with stress redistribution layer and meth...
- Patent number 8,304,919
- Issue date Nov 6, 2012
- Stats Chippac Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization with tailorable coefficient of thermal expansion
- Patent number 8,141,556
- Issue date Mar 27, 2012
- Medtronic, Inc.
- David A. Ruben
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Chip package solder interconnect formed by surface tension
- Patent number 8,138,099
- Issue date Mar 20, 2012
- International Business Machines Corporation
- Timothy H. Daubenspeck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer and semiconductor package
- Patent number 8,110,931
- Issue date Feb 7, 2012
- Advanced Semiconductor Engineering, Inc.
- Hsiao Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUITS WITH CONDUCTIVE POSTS HAVING ROUGH SIDEWALLS
- Publication number 20240363570
- Publication date Oct 31, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jose Daniel Carlos Torres
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Carbide Device and Method for Forming a Silicon Carbide Device
- Publication number 20240113026
- Publication date Apr 4, 2024
- INFINEON TECHNOLOGIES AG
- Edward Fürgut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor module having a double-sided heat dissipation structu...
- Publication number 20240096720
- Publication date Mar 21, 2024
- LX Semicon Co., Ltd.
- Deog Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM PACKAGE
- Publication number 20230326896
- Publication date Oct 12, 2023
- Chipbond Technology Corporation
- Sheng-Jen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-SCALE PACKAGE
- Publication number 20230230892
- Publication date Jul 20, 2023
- NEXPERIA B.V.
- Regnerus Hermannus Poelma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Carbide Device and Method for Forming a Silicon Carbide Device
- Publication number 20220285283
- Publication date Sep 8, 2022
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Chip, Method for Producing a Power Semiconducto...
- Publication number 20190148318
- Publication date May 16, 2019
- SEMIKRON Elektronik GmbH & Co., KG
- Wolfgang-Michael SCHULZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20190088618
- Publication date Mar 21, 2019
- Toshiba Memory Corporation
- Kazumichi TSUMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20190027453
- Publication date Jan 24, 2019
- Samsung Electronics Co., Ltd.
- YONG HO KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED INTERPOSER SEMICONDUCTOR PACKAGE
- Publication number 20180233440
- Publication date Aug 16, 2018
- Avago Technologies General IP (Singapore) PTE. LTD.
- Edward Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...
- Publication number 20170033075
- Publication date Feb 2, 2017
- Advanced Semiconductor, Inc.
- Min-Fong SHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE AND...
- Publication number 20140327018
- Publication date Nov 6, 2014
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods for Manufacturing Semiconductor D...
- Publication number 20140117530
- Publication date May 1, 2014
- INFINEON TECHNOLOGIES AG
- Alexander Breymesser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Semiconductor Package
- Publication number 20140084462
- Publication date Mar 27, 2014
- BROADCOM CORPORATION
- Kevin (Kunzhong) Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabricating a Wafer Level Semiconductor Package Having a Pre-formed...
- Publication number 20140087553
- Publication date Mar 27, 2014
- BROADCOM CORPORATION
- Kevin (Kunzhong) Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHODS FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20140001634
- Publication date Jan 2, 2014
- INFINEON TECHNOLOGIES AG
- Holger Torwesten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGES INCLUDING BUMP BUFFER SPRING PADS AND ME...
- Publication number 20130292820
- Publication date Nov 7, 2013
- SK HYNIX INC.
- Tae Min KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Semiconductor Package
- Publication number 20130134596
- Publication date May 30, 2013
- BROADCOM CORPORATION
- Kevin (Kunzhong) Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE SOLDER BUMP COUPLING WITHIN A CHIP SCALE PACKAGE
- Publication number 20120248599
- Publication date Oct 4, 2012
- Matthew A. Ring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20120146153
- Publication date Jun 14, 2012
- Ying-Nan WEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Module and Method for Production Thereof
- Publication number 20120061819
- Publication date Mar 15, 2012
- Ralf Siemieniec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of fabricating a light-emitting device
- Publication number 20120034715
- Publication date Feb 9, 2012
- Yu-Sik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT AND FABRICATION METHOD THEREOF
- Publication number 20120007233
- Publication date Jan 12, 2012
- Siliconware Precision Industries Co., Ltd.
- Kuei-Hsiao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SYSTEM WITH STRESS REDISTRIBUTION LAYER AND METH...
- Publication number 20110233763
- Publication date Sep 29, 2011
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20110084389
- Publication date Apr 14, 2011
- Jian-Wen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Having A Metal Pillar Structure
- Publication number 20110084381
- Publication date Apr 14, 2011
- Jian-Wen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of fabricating a light-emitting device
- Publication number 20100248400
- Publication date Sep 30, 2010
- SAMSUNG ELECTRONICS CO., LTD.
- Yu-Sik KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING CONNECTION TERMINAL
- Publication number 20100190333
- Publication date Jul 29, 2010
- Samsung Electronics Co., Ltd.
- Myeong-Soon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER AND SEMICONDUCTOR PACKAGE
- Publication number 20100007004
- Publication date Jan 14, 2010
- Advanced Semiconductor Engineering, Inc.
- Hsiao Chuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZATION WITH TAILORABLE COEFFICIENT OF THERMAL EXPANSION
- Publication number 20080269623
- Publication date Oct 30, 2008
- David A. Ruben
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

Vanadium [V] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Silicon carbide device and method for forming a silicon carbide device

Power semiconductor chip, method for producing a power semiconducto...

Silicon carbide device and method for forming a silicon carbide device

Semiconductor chip with patterned underbump metallization and polym...

Non-destructive testing of integrated circuit chips

Semiconductor chip and power module, and manufacturing method of th...

Photoresist cleaning composition used in photolithography and a met...

Bonding structure for semiconductor package and method of manufactu...

Methods for forming pillar bumps on semiconductor wafers

Method of manufacturing a semiconductor device having scribe lines

Processing of thick metal pads

Semiconductor device having solder joint and method of forming the...

Semiconductor chip with patterned underbump metallization and polym...

Glass carrier with embedded semiconductor device and metal layers o...

Method for manufacturing a chip package

Power semiconductor device, method of manufacturing the device and...

Fabricating a wafer level semiconductor package having a pre-formed...

Wafer level semiconductor package

Electronic device packages including bump buffer spring pads and me...

Wafer-level package device having solder bump assemblies that inclu...

Chip package and method for forming the same

Method of fabricating a wafer level semiconductor package having a...

Semiconductor device

Methods of fabricating a light-emitting device

Chip having a metal pillar structure

Semiconductor module and method for production thereof

Integrated circuit system with stress redistribution layer and meth...

Metallization with tailorable coefficient of thermal expansion

Chip package solder interconnect formed by surface tension

Wafer and semiconductor package

Patents Applicationslast 30 patents

INTEGRATED CIRCUITS WITH CONDUCTIVE POSTS HAVING ROUGH SIDEWALLS

Silicon Carbide Device and Method for Forming a Silicon Carbide Device

Semiconductor module having a double-sided heat dissipation structu...

CHIP-ON-FILM PACKAGE

CHIP-SCALE PACKAGE

Silicon Carbide Device and Method for Forming a Silicon Carbide Device

Power Semiconductor Chip, Method for Producing a Power Semiconducto...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES

RECONSTITUTED INTERPOSER SEMICONDUCTOR PACKAGE

BONDING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...

POWER SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE AND...

Semiconductor Devices and Methods for Manufacturing Semiconductor D...

Wafer Level Semiconductor Package

Fabricating a Wafer Level Semiconductor Package Having a Pre-formed...

CHIP PACKAGE AND METHODS FOR MANUFACTURING A CHIP PACKAGE

ELECTRONIC DEVICE PACKAGES INCLUDING BUMP BUFFER SPRING PADS AND ME...

Wafer Level Semiconductor Package

RELIABLE SOLDER BUMP COUPLING WITHIN A CHIP SCALE PACKAGE

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

Semiconductor Module and Method for Production Thereof

Methods of fabricating a light-emitting device

SEMICONDUCTOR ELEMENT AND FABRICATION METHOD THEREOF

INTEGRATED CIRCUIT SYSTEM WITH STRESS REDISTRIBUTION LAYER AND METH...

Semiconductor Device

Chip Having A Metal Pillar Structure

Methods of fabricating a light-emitting device

METHOD OF FORMING CONNECTION TERMINAL

WAFER AND SEMICONDUCTOR PACKAGE

METALLIZATION WITH TAILORABLE COEFFICIENT OF THERMAL EXPANSION