1. Field of the Invention
The present invention relates to a chip, and more particularly to a chip having a metal pillar structure.
2. Description of the Related Art
The conventional chip 1 has the following disadvantages. When the pitch between two adjacent metal pillar structures 15 of the chip 1 is a fine pitch, and the maximum diameter formed by the solder 17 is greater than the diameter of the metal pillar 16, a solder bridge easily happens, which leads to a short circuit.
Therefore, it is necessary to provide a chip having a metal pillar structure to solve the above-mentioned problems.
The present invention is directed to a chip having a metal pillar structure. The chip comprises a chip body, at least one chip pad, a first passivation layer, an under ball metal layer (UBM) and at least one metal pillar structure. The chip body has an active surface. The chip pad is disposed on the active surface. The first passivation layer is disposed on the active surface, and has at least one first opening so as to expose part of the chip pad. The under ball metal layer (UBM) is disposed on the chip pad. The metal pillar structure is disposed on the under ball metal layer (UBM), and comprises a metal pillar and a solder. The metal pillar is disposed on the under ball metal layer (UBM). The solder is disposed on the metal pillar, and the maximum diameter formed by the solder is shorter than or equal to the diameter of the metal pillar.
The present invention is further directed to a chip having a metal pillar structure. The chip comprises a chip body, at least one chip pad, a first passivation layer, an under ball metal layer (UBM) and at least one metal pillar structure. The chip body has an active surface. The chip pad is disposed on the active surface. The first passivation layer is disposed on the active surface, and has at least one first opening so as to expose part of the chip pad. The under ball metal layer (UBM) is disposed on the chip pad. The metal pillar structure is disposed on the under ball metal layer (UBM), and comprises a metal pillar and a solder. The metal pillar is disposed on the under ball metal layer (UBM), and has a metal pillar. The solder is disposed in a phantom zone extending upward from the peripheral surface of the metal pillar.
Whereby, when the pitch between two adjacent metal pillar structures of the chip is a fine pitch, the defect of solder bridge can be avoided, so that the yield rate is improved.
As shown in
As shown in
The metal pillar structure 28 is disposed on the under ball metal layer (UBM) 29, and comprises a metal pillar 26 and a solder 27. The metal pillar 26 is disposed on the under ball metal layer (UBM) 29, and has a peripheral surface 261. In the embodiment, the material of the metal pillar 26 is copper (Cu), the height of the metal pillar 26 has no limitation, and the peripheral surface 261 of the metal pillar 26 is aligned with the peripheral surface 291 of the under ball metal layer (UBM) 29. The solder 27 is disposed on the metal pillar 26, and the maximum diameter formed by the solder 27 is shorter than or equal to the diameter of the metal pillar 26. Therefore, the solder 27 is disposed in a phantom zone extending upward from the peripheral surface 261 of the metal pillar 26. Preferably, the solder 27 is a hemisphere, and the height of the solder 27 is shorter than or equal to the radius of the metal pillar 26. In the present invention, the distance between the central axes of two adjacent metal pillar structures 28 is defined as a pitch D (
In the present invention, when the pitch between two adjacent metal pillar structures 28 of the chips 2, 3, 4 is a fine pitch, the defect of solder bridge can be avoided, so that the yield rate is improved.
While several embodiments of the present invention have been illustrated and described, various modifications and improvements can be made by those skilled in the art. The embodiments of the present invention are therefore described in an illustrative but not restrictive sense. It is intended that the present invention should not be limited to the particular forms as illustrated, and that all modifications which maintain the spirit and scope of the present invention are within the scope defined by the appended claims.
Number | Date | Country | Kind |
---|---|---|---|
98134806 A | Oct 2009 | TW | national |
Number | Name | Date | Kind |
---|---|---|---|
3761309 | Schmitter et al. | Sep 1973 | A |
4341594 | Carlson et al. | Jul 1982 | A |
4845542 | Bezuk et al. | Jul 1989 | A |
5466635 | Lynch et al. | Nov 1995 | A |
5629564 | Nye, III et al. | May 1997 | A |
5640052 | Tsukamoto | Jun 1997 | A |
5656858 | Kondo et al. | Aug 1997 | A |
5698465 | Lynch et al. | Dec 1997 | A |
5790377 | Schreiber et al. | Aug 1998 | A |
5872404 | Lynch et al. | Feb 1999 | A |
5914536 | Shizuki et al. | Jun 1999 | A |
5943597 | Kleffner et al. | Aug 1999 | A |
6013571 | Morrell | Jan 2000 | A |
6028357 | Moriyama | Feb 2000 | A |
6051450 | Ohsawa et al. | Apr 2000 | A |
6077765 | Naya | Jun 2000 | A |
6107164 | Ohuchi | Aug 2000 | A |
6159837 | Yamaji et al. | Dec 2000 | A |
6229220 | Saitoh et al. | May 2001 | B1 |
6281106 | Higdon et al. | Aug 2001 | B1 |
6350705 | Lin | Feb 2002 | B1 |
6362087 | Wang et al. | Mar 2002 | B1 |
6362090 | Paik et al. | Mar 2002 | B1 |
6378759 | Ho et al. | Apr 2002 | B1 |
6501185 | Chow et al. | Dec 2002 | B1 |
6510976 | Hwee et al. | Jan 2003 | B2 |
6550666 | Chew et al. | Apr 2003 | B2 |
6573598 | Ohuchi et al. | Jun 2003 | B2 |
6578754 | Tung | Jun 2003 | B1 |
6592019 | Tung | Jul 2003 | B2 |
6599775 | Tie et al. | Jul 2003 | B2 |
6600234 | Kuwabara et al. | Jul 2003 | B2 |
6639299 | Aoki | Oct 2003 | B2 |
6642136 | Lee et al. | Nov 2003 | B1 |
6664128 | Tong et al. | Dec 2003 | B2 |
6681982 | Tung | Jan 2004 | B2 |
6683375 | Joshi et al. | Jan 2004 | B2 |
6731003 | Joshi et al. | May 2004 | B2 |
6732913 | Alvarez | May 2004 | B2 |
6734039 | Hwee et al. | May 2004 | B2 |
6740577 | Jin et al. | May 2004 | B2 |
6750082 | Briar et al. | Jun 2004 | B2 |
6756671 | Lee et al. | Jun 2004 | B2 |
6784087 | Lee et al. | Aug 2004 | B2 |
6818545 | Lee et al. | Nov 2004 | B2 |
6888209 | Jobetto | May 2005 | B2 |
6917119 | Lee et al. | Jul 2005 | B2 |
6929981 | Hwee et al. | Aug 2005 | B2 |
6940168 | Garrity et al. | Sep 2005 | B2 |
7008867 | Lei | Mar 2006 | B2 |
7022548 | Joshi et al. | Apr 2006 | B2 |
7087458 | Wang et al. | Aug 2006 | B2 |
7122403 | Chandran et al. | Oct 2006 | B2 |
7135770 | Nishiyama et al. | Nov 2006 | B2 |
7268438 | Nishiyama et al. | Sep 2007 | B2 |
7276801 | Dubin et al. | Oct 2007 | B2 |
7391112 | Li et al. | Jun 2008 | B2 |
7449406 | Nishiyama et al. | Nov 2008 | B2 |
7456496 | Hwee et al. | Nov 2008 | B2 |
7476564 | Chen et al. | Jan 2009 | B2 |
7550375 | Wang et al. | Jun 2009 | B2 |
20020011664 | Tanaka | Jan 2002 | A1 |
20030127734 | Lee et al. | Jul 2003 | A1 |
20030219966 | Jin et al. | Nov 2003 | A1 |
20060006544 | Farrar | Jan 2006 | A1 |
20080296761 | Lee et al. | Dec 2008 | A1 |
20090072385 | Alley et al. | Mar 2009 | A1 |
20090155955 | Liang | Jun 2009 | A1 |
20090289360 | Takahashi et al. | Nov 2009 | A1 |
20110084389 | Lo et al. | Apr 2011 | A1 |
Number | Date | Country |
---|---|---|
54128669 | Oct 1979 | JP |
60217646 | Oct 1985 | JP |
62160744 | Jul 1987 | JP |
1123440 | May 1989 | JP |
4144143 | May 1992 | JP |
5109820 | Apr 1993 | JP |
5152376 | Jun 1993 | JP |
5315339 | Nov 1993 | JP |
2711722 | Aug 1995 | JP |
7335648 | Dec 1995 | JP |
8008259 | Jan 1996 | JP |
8013166 | Jan 1996 | JP |
9266230 | Oct 1997 | JP |
9045691 | Dec 1997 | JP |
2000091371 | Mar 2000 | JP |
2000269387 | Sep 2000 | JP |
2002043352 | Feb 2002 | JP |
2006279062 | Oct 2006 | JP |
2008047667 | Feb 2008 | JP |
Number | Date | Country | |
---|---|---|---|
20110084381 A1 | Apr 2011 | US |