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Vanadium [V] as principal constituent

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  • CPC
  • H01L2224/13672
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/13672Vanadium [V] as principal constituent
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    Interconnect Crack Arrestor Structure and Methods
    • Publication number 20190326228
    • Publication date Oct 24, 2019
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Pillar Design for Conductive Bump
    • Publication number 20140361432
    • Publication date Dec 11, 2014
    • Cheng-Chieh Hsieh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Interconnect Crack Arrestor Structure and Methods
    • Publication number 20130207239
    • Publication date Aug 15, 2013
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Pillar Design for Conductive Bump
    • Publication number 20130020698
    • Publication date Jan 24, 2013
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Cheng-Chieh Hsieh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Metal Bump Formation
    • Publication number 20120322255
    • Publication date Dec 20, 2012
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Ming-Da Cheng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGES
    • Publication number 20120299197
    • Publication date Nov 29, 2012
    • Samsung Electronics Co., Ltd.
    • Heungkyu KWON
    • H01 - BASIC ELECTRIC ELEMENTS