Vanadium [V] as principal constituent

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H01L2224/13172

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13172Vanadium [V] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor bonding structures and methods
- Patent number 12,119,238
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,887,840
- Issue date Jan 30, 2024
- Samsung Electronics Co., Ltd.
- Min Sung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding structures and methods
- Patent number 11,749,535
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with reduced pitch conductive pillars
- Patent number 11,676,924
- Issue date Jun 13, 2023
- Advanced Micro Devices, Inc.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scheme for connector site spacing and resulting structures
- Patent number 10,985,114
- Issue date Apr 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with reduced pitch conductive pillars
- Patent number 10,943,880
- Issue date Mar 9, 2021
- Advanced Micro Devices, Inc.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scheme for connector site spacing and resulting structures
- Patent number 10,504,856
- Issue date Dec 10, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing metal ball, joining material, and metal ball
- Patent number 10,150,185
- Issue date Dec 11, 2018
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing a hybridized device including microelectronic c...
- Patent number 10,002,842
- Issue date Jun 19, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Francois Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning methods and compositions
- Patent number 9,765,289
- Issue date Sep 19, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Jung Tsai
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Semiconductor device having solder joint and method of forming the...
- Patent number 9,646,945
- Issue date May 9, 2017
- Samsung Electronics Co., Ltd.
- Soon-Bum Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level chip-scale package structure utilizing conductive polymer
- Patent number 9,496,234
- Issue date Nov 15, 2016
- GLOBALFOUNDRIES Inc.
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scheme for connector site spacing and resulting structures
- Patent number 9,484,317
- Issue date Nov 1, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scheme for connector site spacing and resulting structures
- Patent number 9,472,521
- Issue date Oct 18, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scheme for connector site spacing and resulting structures
- Patent number 9,190,348
- Issue date Nov 17, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer backside structures having copper pillars
- Patent number 8,759,949
- Issue date Jun 24, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflow system and method for conductive connections
- Patent number 8,623,756
- Issue date Jan 7, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chita Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip semiconductor package and fabrication method thereof
- Patent number 8,093,721
- Issue date Jan 10, 2012
- Nepes Corporation
- In-Soo Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for electrostatic discharge protection using a...
- Patent number 7,629,202
- Issue date Dec 8, 2009
- International Business Machines Corporation
- Jonas R Weiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumpless wafer scale device and board assembly
- Patent number 6,768,210
- Issue date Jul 27, 2004
- Texas Instruments Incorporated
- Edgar R. Zuniga-Ortiz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
REVERSABLE ATTACHMENT SYSTEM
- Publication number 20240213212
- Publication date Jun 27, 2024
- The Boeing Company
- Peter D. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230016186
- Publication date Jan 19, 2023
- Samsung Electronics Co., Ltd.
- Min Sung KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH REDUCED PITCH CONDUCTIVE PILLARS
- Publication number 20210193604
- Publication date Jun 24, 2021
- ADVANCED MICRO DEVICES, INC.
- PRIYAL SHAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH REDUCED PITCH CONDUCTIVE PILLARS
- Publication number 20200365543
- Publication date Nov 19, 2020
- ADVANCED MICRO DEVICES, INC.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Design Scheme for Connector Site Spacing and Resulting Structures
- Publication number 20200058601
- Publication date Feb 20, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Bonding Structures and Methods
- Publication number 20200035510
- Publication date Jan 30, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Design Scheme for Connector Site Spacing and Resulting Structures
- Publication number 20140291838
- Publication date Oct 2, 2014
- Yu-Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING COMPONENT EQUIPPED WITH HOLLOW INSERTS
- Publication number 20140075747
- Publication date Mar 20, 2014
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- François MARION
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Design Scheme for Connector Site Spacing and Resulting Structures
- Publication number 20130320524
- Publication date Dec 5, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cleaning Methods and Compositions
- Publication number 20130276837
- Publication date Oct 24, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Jung Tsai
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
Reflow System and Method for Conductive Connections
- Publication number 20120329264
- Publication date Dec 27, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chita Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Backside Structures Having Copper Pillars
- Publication number 20100276787
- Publication date Nov 4, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20100230810
- Publication date Sep 16, 2010
- In-Soo Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE FOE SEMICONDUCTOR DEVICE
- Publication number 20100032831
- Publication date Feb 11, 2010
- NEPES CORPORATION
- Byung-Jin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR ELECTROSTATIC DISCHARGE PROTECTION USING A...
- Publication number 20090275191
- Publication date Nov 5, 2009
- Jonas R Weiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bumpless wafer scale device and board assembly
- Publication number 20030080392
- Publication date May 1, 2003
- Edgar R. Zuniga-Ortiz
- H01 - BASIC ELECTRIC ELEMENTS

Vanadium [V] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor bonding structures and methods

Semiconductor device and method for manufacturing the same

Semiconductor bonding structures and methods

Semiconductor chip with reduced pitch conductive pillars

Scheme for connector site spacing and resulting structures

Semiconductor chip with reduced pitch conductive pillars

Scheme for connector site spacing and resulting structures

Method for producing metal ball, joining material, and metal ball

Method of producing a hybridized device including microelectronic c...

Cleaning methods and compositions

Semiconductor device having solder joint and method of forming the...

Wafer-level chip-scale package structure utilizing conductive polymer

Scheme for connector site spacing and resulting structures

Scheme for connector site spacing and resulting structures

Scheme for connector site spacing and resulting structures

Wafer backside structures having copper pillars

Reflow system and method for conductive connections

Flip chip semiconductor package and fabrication method thereof

Method and apparatus for electrostatic discharge protection using a...

Bumpless wafer scale device and board assembly

Patents Applicationslast 30 patents

REVERSABLE ATTACHMENT SYSTEM

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR CHIP WITH REDUCED PITCH CONDUCTIVE PILLARS

SEMICONDUCTOR CHIP WITH REDUCED PITCH CONDUCTIVE PILLARS

Design Scheme for Connector Site Spacing and Resulting Structures

Semiconductor Bonding Structures and Methods

Design Scheme for Connector Site Spacing and Resulting Structures

CONNECTING COMPONENT EQUIPPED WITH HOLLOW INSERTS

Design Scheme for Connector Site Spacing and Resulting Structures

Cleaning Methods and Compositions

Reflow System and Method for Conductive Connections

Wafer Backside Structures Having Copper Pillars

FLIP CHIP SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

BUMP STRUCTURE FOE SEMICONDUCTOR DEVICE

METHOD AND APPARATUS FOR ELECTROSTATIC DISCHARGE PROTECTION USING A...

Bumpless wafer scale device and board assembly