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Via connections; Lands around holes or via connections

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

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H05K1/115Via connections; Lands around holes or via connections
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    Embeddable Electrically Insulating Thermal Connector and Circuit Bo...
    • Publication number 20250106979
    • Publication date Mar 27, 2025
    • KYOCERA AVX Components Corporation
    • Cory Nelson
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COIL DEVICE AND PRINTED WIRING BOARD
    • Publication number 20250107001
    • Publication date Mar 27, 2025
    • SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    • Michi OGATA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250098071
    • Publication date Mar 20, 2025
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Jung Hyun CHO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250098067
    • Publication date Mar 20, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Chi Hyeon JEONG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PACKAGE COMPRISING A SUBSTRATE WITH AN INTERCONNECT BLOCK
    • Publication number 20250098066
    • Publication date Mar 20, 2025
    • QUALCOMM Incorporated
    • Hong Bok WE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES...
    • Publication number 20250089154
    • Publication date Mar 13, 2025
    • Skyworks Solutions, Inc.
    • Shaul BRANCHEVSKY
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER SUBSTRATE
    • Publication number 20250089160
    • Publication date Mar 13, 2025
    • Murata Manufacturing Co., Ltd.
    • Tomoki YAMAMOTO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250089165
    • Publication date Mar 13, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Seong Hun NA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    HYBRID PRINTED CIRCUIT BOARD
    • Publication number 20250089166
    • Publication date Mar 13, 2025
    • Samsung Electronics Co., Ltd.
    • Keonwoo KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20250089167
    • Publication date Mar 13, 2025
    • IBIDEN CO., LTD.
    • Shunsuke SAKAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20250081338
    • Publication date Mar 6, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Sang Ho JEONG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20250079413
    • Publication date Mar 6, 2025
    • Fuji Electric Co., Ltd.
    • Akira HIRAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20250081334
    • Publication date Mar 6, 2025
    • IBIDEN CO., LTD.
    • Katsuyuki SANO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    HIGH SPEED CAMERA INTERFACE PCB FLOOR PLAN FOR AUTONOMOUS VEHICLES
    • Publication number 20250081336
    • Publication date Mar 6, 2025
    • Apollo Autonomous Driving USA LLC
    • Yun JI
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250081343
    • Publication date Mar 6, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Chi Hyeon JEONG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20250081354
    • Publication date Mar 6, 2025
    • InnoLux Corporation
    • Cheng-Chi WANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250081340
    • Publication date Mar 6, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • In Gun KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BRIDGE PRINTED CIRCUIT BOARD EMBEDDED WITHIN ANOTHER PRINTED CIRCUI...
    • Publication number 20250081348
    • Publication date Mar 6, 2025
    • Intel Corporation
    • Arumanayagam RAJASEKAR
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE INCLUDING FLEXIBLE CIRCUIT BOARD
    • Publication number 20250081360
    • Publication date Mar 6, 2025
    • Samsung Electronics Co., Ltd.
    • Youngsun LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250081337
    • Publication date Mar 6, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Young Kuk KO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250071898
    • Publication date Feb 27, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Seung Eun LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD WITH INCREASED DURABILITY IN BENDING REGION A...
    • Publication number 20250071891
    • Publication date Feb 27, 2025
    • Samsung Electronics Co., Ltd.
    • Youngsun LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250071902
    • Publication date Feb 27, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Seung Eun LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Component Carrier With Embedded Interposer Laterally Between Electr...
    • Publication number 20250071907
    • Publication date Feb 27, 2025
    • AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    • Minwoo Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER SUBSTRATE AND JIG
    • Publication number 20250063660
    • Publication date Feb 20, 2025
    • NIDEC ADVANCE TECHNOLOGY CORPORATION
    • Shigeki SAKAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20250063661
    • Publication date Feb 20, 2025
    • Sumitomo Electric Industries, Ltd.
    • Kenji TAKAHASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
    • Publication number 20250063662
    • Publication date Feb 20, 2025
    • Amphenol Corporation
    • Marc B. Cartier
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250063666
    • Publication date Feb 20, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Dae Jung BYUN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Embedding Methods for Fine-Pitch Components and Corresponding Compo...
    • Publication number 20250063668
    • Publication date Feb 20, 2025
    • AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    • Jeesoo Mok
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20250056718
    • Publication date Feb 13, 2025
    • IBIDEN CO., LTD.
    • Atsushi ISHIDA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR