Via connections; Lands around holes or via connections

Industry

CPC
H05K1/115

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/115Via connections; Lands around holes or via connections

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 12,171,063
- Issue date Dec 17, 2024
- Amphenol Corporation
- Marc B. Cartier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-throughput additively manufactured power delivery vias and traces
- Patent number 12,170,244
- Issue date Dec 17, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulation structures and printed circuit board including the same
- Patent number 12,167,532
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Hyejin Kim
- B32 - LAYERED PRODUCTS
Information Patent Grant
Component carrier with embedded interposer laterally between electr...
- Patent number 12,165,964
- Issue date Dec 10, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Minwoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 12,160,955
- Issue date Dec 3, 2024
- LG Innotek Co., Ltd
- Dong Sun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,156,329
- Issue date Nov 26, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seong Ho Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Technologies for power tunnels on circuit boards
- Patent number 12,156,331
- Issue date Nov 26, 2024
- Intel Corporation
- Khai Ern See
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device including stacked printed circuit boards
- Patent number 12,156,326
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Seungbo Shim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and procedure for miniaturing a multi-layer PCB
- Patent number 12,150,237
- Issue date Nov 19, 2024
- VEEA INC.
- Robert Migliorino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package assembly
- Patent number 12,150,243
- Issue date Nov 19, 2024
- Wiwynn Corporation
- Yi Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED circuit board structure and LED testing and packaging method
- Patent number 12,150,242
- Issue date Nov 19, 2024
- Ingentec Corporation
- Yi-Chuan Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compact oscillator device with a cavity resonator on a circuit board
- Patent number 12,142,810
- Issue date Nov 12, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Mikael Hörberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board with increased durability in bending region a...
- Patent number 12,144,109
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Youngsun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
ESD protection of chip scale package LEDS
- Patent number 12,140,297
- Issue date Nov 12, 2024
- SIGNIFY HOLDING, B.V.
- Christian Tenhumberg
- F21 - LIGHTING
Information Patent Grant
Circuit board structure
- Patent number 12,144,113
- Issue date Nov 12, 2024
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for water intrusion mitigation
- Patent number 12,137,527
- Issue date Nov 5, 2024
- Rosemount Aerospace Inc.
- Dennis A. Quy
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for detecting and adjusting poor back drills in printed circ...
- Patent number 12,135,347
- Issue date Nov 5, 2024
- R&D Circuits
- Michael Caprio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for multiple input power distribution to adjac...
- Patent number 12,126,147
- Issue date Oct 22, 2024
- Legrand DPC, LLC
- Carrel W. Ewing
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display apparatus and electronic device
- Patent number 12,127,345
- Issue date Oct 22, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Xiaoxia Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semi-flex component carrier with dielectric material surrounding an...
- Patent number 12,127,338
- Issue date Oct 22, 2024
- AT&S(China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 12,127,340
- Issue date Oct 22, 2024
- Kyocera Corporation
- Yoshihiro Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,127,343
- Issue date Oct 22, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Dong Joo Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Antenna assembly having a circuit board and at least one antenna ar...
- Patent number 12,123,902
- Issue date Oct 22, 2024
- HELLA GMBH & CO. KGAA
- Andreas John
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection of electronics in negative pressure wound therapy systems
- Patent number 12,127,333
- Issue date Oct 22, 2024
- Smith & Nephew PLC
- Ben Alan Askem
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Antenna module and electronic device comprising same
- Patent number 12,119,564
- Issue date Oct 15, 2024
- LG Electronics Inc.
- Seungmin Woo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna substrate
- Patent number 12,119,565
- Issue date Oct 15, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yang Je Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate, method for manufacturing substrate, and electronic device
- Patent number 12,114,433
- Issue date Oct 8, 2024
- FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
- Hiroshi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-ground vias for improved signal integrity for high-speed seri...
- Patent number 12,114,419
- Issue date Oct 8, 2024
- Dell Products L.P.
- William Andrew Smith
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and preparation method thereof
- Patent number 12,114,424
- Issue date Oct 8, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Mei Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DYNAMICALLY RECONFIGURABLE MAGNETIC CIRCUIT SYSTEMS WITH TUNABLE CO...
- Publication number 20240422898
- Publication date Dec 19, 2024
- Albert Moses Haim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Component Carrier With Continuously Extending Vertical Connection S...
- Publication number 20240422907
- Publication date Dec 19, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Markus LEITGEB
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240422912
- Publication date Dec 19, 2024
- PanelSemi Corporation
- Sheng-Ping CHIANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240422908
- Publication date Dec 19, 2024
- LG Innotek Co., Ltd.
- Kyo Hun KOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TERMINAL STRUCTURE AND WIRING SUBSTRATE
- Publication number 20240413063
- Publication date Dec 12, 2024
- Shinko Electric Industries Co., Ltd.
- Junichi NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOTOR UNIT
- Publication number 20240414895
- Publication date Dec 12, 2024
- JTEKT CORPORATION
- Yuki HAYASHI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
- Publication number 20240414844
- Publication date Dec 12, 2024
- LG Innotek Co., Ltd.
- Yong Suk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR TRACE GENERATION AND RECONFIGURATION ON A BRE...
- Publication number 20240407083
- Publication date Dec 5, 2024
- Albert Moses Haim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
- Publication number 20240407095
- Publication date Dec 5, 2024
- LG Innotek Co., Ltd.
- Han Sang KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARDS WITH INTEGRATED INDUCTORS AND ANTENNAS
- Publication number 20240407102
- Publication date Dec 5, 2024
- Super Micro Computer, Inc.
- Manhtien V. PHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20240404934
- Publication date Dec 5, 2024
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTRA-PAIR SKEW COMPENSATION OF DIFFERENTIAL SIGNALS
- Publication number 20240407093
- Publication date Dec 5, 2024
- Achronix Semiconductor Corporation
- Hansel Desmond Dsilva
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240407094
- Publication date Dec 5, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20240407103
- Publication date Dec 5, 2024
- LG Innotek Co., Ltd.
- Chae Young YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF IMPROVED POWER INTEGRITY FOR MMWAVE PHASED ARRAY ANTENNAS...
- Publication number 20240405427
- Publication date Dec 5, 2024
- Jabil Inc.
- Ian Jeffery Timmins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD, DISPLAY MODULE, AND DISPLAY DEVICE
- Publication number 20240407082
- Publication date Dec 5, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Peng Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BURIED PATCH ANTENNA FOR LOW COST MMWAVE PHASED ARRAY DESIGN
- Publication number 20240405435
- Publication date Dec 5, 2024
- Jabil Inc.
- Ian Jeffery Timmins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed Circuit Board and Signal Transmission System
- Publication number 20240397612
- Publication date Nov 28, 2024
- ZTE Corporation
- Xindan ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD DEVICE
- Publication number 20240397621
- Publication date Nov 28, 2024
- Unimicron Technology Corp.
- Chin-Hsun WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PPTC SMALL PLANAR SMD TEMPERATURE SENSORS AND OVERCURRENT DEVICES
- Publication number 20240397618
- Publication date Nov 28, 2024
- LITTELFUSE, INC.
- Martin G. Pineda
- G01 - MEASURING TESTING
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20240397622
- Publication date Nov 28, 2024
- IBIDEN CO., LTD.
- Yoshiki MATSUI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-EMBEDDED CIRCUIT BOARD
- Publication number 20240397605
- Publication date Nov 28, 2024
- The Boeing Company
- Kyle Avery Woolrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BURIED SKIP VIAS FOR IMPROVED SIGNAL AND POWER INTEGRITY
- Publication number 20240389230
- Publication date Nov 21, 2024
- NVIDIA Corporation
- Mingyi Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD TO MAINTAIN SIGNAL INTEGRITY BETWEEN MULTIPLE SIG...
- Publication number 20240389223
- Publication date Nov 21, 2024
- Dell Products L.P.
- SANDOR TIBOR FARKAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANTENNA MODULE AND ELECTRONIC DEVICE COMPRISING SAME
- Publication number 20240387996
- Publication date Nov 21, 2024
- LG ELECTRONICS INC.
- Seungmin WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-GROUND VIAS FOR IMPROVED SIGNAL INTEGRITY FOR HIGH-SPEED SERI...
- Publication number 20240389219
- Publication date Nov 21, 2024
- Dell Products L.P.
- William Andrew Smith
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240389231
- Publication date Nov 21, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RADIO FREQUENCY MODULE, COMMUNICATION DEVICE, AND FILTER
- Publication number 20240389222
- Publication date Nov 21, 2024
- Murata Manufacturing Co., Ltd.
- Eiji FUJIMORI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240381533
- Publication date Nov 14, 2024
- Unimicron Technology Corp.
- Chun Hung KUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing a Component Carrier by a Nano Imprint Lithography Pro...
- Publication number 20240381538
- Publication date Nov 14, 2024
- AT&S Austria Technologie & Systemtechnik
- Heinrich TRISCHLER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Via connections; Lands around holes or via connections

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Backplane footprint for high speed, high density electrical connectors

High-throughput additively manufactured power delivery vias and traces

Insulation structures and printed circuit board including the same

Component carrier with embedded interposer laterally between electr...

Circuit board

Printed circuit board

Technologies for power tunnels on circuit boards

Electronic device including stacked printed circuit boards

Method and procedure for miniaturing a multi-layer PCB

Package assembly

LED circuit board structure and LED testing and packaging method

Compact oscillator device with a cavity resonator on a circuit board

Printed circuit board with increased durability in bending region a...

ESD protection of chip scale package LEDS

Circuit board structure

Method and device for water intrusion mitigation

Method for detecting and adjusting poor back drills in printed circ...

Hermetic metallized via with improved reliability

Method and apparatus for multiple input power distribution to adjac...

Display apparatus and electronic device

Semi-flex component carrier with dielectric material surrounding an...

Wiring substrate

Printed circuit board

Antenna assembly having a circuit board and at least one antenna ar...

Protection of electronics in negative pressure wound therapy systems

Antenna module and electronic device comprising same

Antenna substrate

Substrate, method for manufacturing substrate, and electronic device

Micro-ground vias for improved signal integrity for high-speed seri...

Circuit board and preparation method thereof

Patents Applicationslast 30 patents

DYNAMICALLY RECONFIGURABLE MAGNETIC CIRCUIT SYSTEMS WITH TUNABLE CO...

Component Carrier With Continuously Extending Vertical Connection S...

ELECTRONIC DEVICE

PRINTED CIRCUIT BOARD

TERMINAL STRUCTURE AND WIRING SUBSTRATE

MOTOR UNIT

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

SYSTEM AND METHOD FOR TRACE GENERATION AND RECONFIGURATION ON A BRE...

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

PRINTED CIRCUIT BOARDS WITH INTEGRATED INDUCTORS AND ANTENNAS

THROUGH-HOLE ELECTRODE SUBSTRATE

INTRA-PAIR SKEW COMPENSATION OF DIFFERENTIAL SIGNALS

PRINTED WIRING BOARD

CIRCUIT BOARD

METHOD OF IMPROVED POWER INTEGRITY FOR MMWAVE PHASED ARRAY ANTENNAS...

FLEXIBLE PRINTED CIRCUIT BOARD, DISPLAY MODULE, AND DISPLAY DEVICE

BURIED PATCH ANTENNA FOR LOW COST MMWAVE PHASED ARRAY DESIGN

Printed Circuit Board and Signal Transmission System

CIRCUIT BOARD DEVICE

PPTC SMALL PLANAR SMD TEMPERATURE SENSORS AND OVERCURRENT DEVICES

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

MULTI-EMBEDDED CIRCUIT BOARD

BURIED SKIP VIAS FOR IMPROVED SIGNAL AND POWER INTEGRITY

SYSTEM AND METHOD TO MAINTAIN SIGNAL INTEGRITY BETWEEN MULTIPLE SIG...

ANTENNA MODULE AND ELECTRONIC DEVICE COMPRISING SAME

MICRO-GROUND VIAS FOR IMPROVED SIGNAL INTEGRITY FOR HIGH-SPEED SERI...

PRINTED WIRING BOARD

RADIO FREQUENCY MODULE, COMMUNICATION DEVICE, AND FILTER

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

Manufacturing a Component Carrier by a Nano Imprint Lithography Pro...