Via connections; Lands around holes or via connections

Industry

CPC
H05K1/115

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/115Via connections; Lands around holes or via connections

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic assembly having circuit carrier
- Patent number 12,356,558
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun-Yi Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and image display device including same
- Patent number 12,356,540
- Issue date Jul 8, 2025
- LG Electronics Inc.
- Geumsub Sin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power supply device
- Patent number 12,355,347
- Issue date Jul 8, 2025
- Delta Electronics (Shanghai) Co., Ltd.
- Kai Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package, electronic structure and manufacturing method t...
- Patent number 12,354,885
- Issue date Jul 8, 2025
- Siliconware Precision Industries Co., Ltd.
- Yi-Ling Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for achieving certain characteristics...
- Patent number 12,349,267
- Issue date Jul 1, 2025
- Juniper Networks, Inc.
- Dylan G. Rust-Nguyen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component embedded substrate
- Patent number 12,349,283
- Issue date Jul 1, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Ho Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board including a core layer provided with plurality of ins...
- Patent number 12,349,288
- Issue date Jul 1, 2025
- LG Innotek Co., Ltd
- Myung Jae Kwon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low cost, low loss material for microwave or antenna printed circui...
- Patent number 12,347,927
- Issue date Jul 1, 2025
- Hughes Network Systems, L.L.C.
- Bingqian Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Co-planar interconnection mechanisms for circuit boards
- Patent number 12,349,276
- Issue date Jul 1, 2025
- Intel Corporation
- Mooi Ling Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Capacitors in through glass vias
- Patent number 12,349,282
- Issue date Jul 1, 2025
- Intel Corporation
- Benjamin Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,349,273
- Issue date Jul 1, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seong Ho Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit boards with integrated inductors and antennas
- Patent number 12,349,281
- Issue date Jul 1, 2025
- Super Micro Computer, Inc.
- Manhtien V. Phan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voltage regulator module
- Patent number 12,348,141
- Issue date Jul 1, 2025
- Delta Electronics, Inc.
- Yahong Xiong
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Methods to fill through-holes of a substrate with metal paste
- Patent number 12,342,470
- Issue date Jun 24, 2025
- Reophotonics, Ltd.
- Michael Zenou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Customized thermal pathways in a PCB
- Patent number 12,342,474
- Issue date Jun 24, 2025
- Todd Robinson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power supply apparatus, load and electronic device
- Patent number 12,342,450
- Issue date Jun 24, 2025
- Delta Electronics (Shanghai) Co., Ltd.
- Wulong Cong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and manufacturing method of wiring board
- Patent number 12,342,457
- Issue date Jun 24, 2025
- Shinko Electric Industries Co., Ltd.
- Takashi Kasuga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 12,342,465
- Issue date Jun 24, 2025
- Murata Manufacturing Co., Ltd.
- Yoshiki Tobita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,336,098
- Issue date Jun 17, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Woong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High aspect ratio vias filled with liquid metal fill
- Patent number 12,336,112
- Issue date Jun 17, 2025
- Samtec, Inc.
- Christopher David Bohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,336,095
- Issue date Jun 17, 2025
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Asymmetrical laminated circuit boards for improved electrical perfo...
- Patent number 12,328,816
- Issue date Jun 10, 2025
- Intel Corporation
- Jackson Chung Peng Kong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and a semiconductor package including the same
- Patent number 12,328,820
- Issue date Jun 10, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Gopal Garg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection structure and electronic device
- Patent number 12,317,417
- Issue date May 27, 2025
- Innolux Corporation
- Mei-Hsiu Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing printed wiring board and printed wiring board
- Patent number 12,317,425
- Issue date May 27, 2025
- Ibiden Co., Ltd.
- Atsushi Ishida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated wiring board
- Patent number 12,317,426
- Issue date May 27, 2025
- Shinko Electric Industries Co., Ltd.
- Shota Miki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and systems for defects detection and classification using...
- Patent number 12,307,668
- Issue date May 20, 2025
- Bruker Nano, Inc.
- David Lewis Adler
- G01 - MEASURING TESTING
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 12,309,915
- Issue date May 20, 2025
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure embedded substrate and substrate structure inc...
- Patent number 12,309,924
- Issue date May 20, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Tae Hong Min
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electrical device, in particular inverter or converter
- Patent number 12,309,927
- Issue date May 20, 2025
- Sew-Eurodrive GmbH & Co. KG
- Werner Groß
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
POWER DELIVERY SYSTEM FOR HIGH DENSITY SIGNALING AND HIGH POWER DEL...
- Publication number 20250240870
- Publication date Jul 24, 2025
- Cisco Technology, Inc.
- Wenbin Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RELAY, POWER DISTRIBUTION APPARATUS, AND CHARGING PILE
- Publication number 20250240892
- Publication date Jul 24, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Qiao WANG
- B60 - VEHICLES IN GENERAL
Information Patent Application
MULTI-LAMINATION STRUCTURE THAT ELIMINATES MICRO CAVITY RESONANCE
- Publication number 20250240873
- Publication date Jul 24, 2025
- Cisco Technology, Inc.
- Wenbin Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE
- Publication number 20250240874
- Publication date Jul 24, 2025
- Murata Manufacturing Co., Ltd.
- Ryutatsu MIZUKAMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250240889
- Publication date Jul 24, 2025
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Liquid Cooling Using PCB Through Holes
- Publication number 20250240878
- Publication date Jul 24, 2025
- Jordan K. Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND IMAGE FORMING APPARATUS
- Publication number 20250240881
- Publication date Jul 24, 2025
- Canon Kabushiki Kaisha
- TAKESHI HONDA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250240887
- Publication date Jul 24, 2025
- Unimicron Technology Corp.
- Chin-Sheng WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLASS SUBSTRATE, MULTILAYER WIRING SUBSTRATE, AND METHOD FOR PRODUC...
- Publication number 20250227841
- Publication date Jul 10, 2025
- TOPPAN Holdings Inc.
- Masashi SAWADAISHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLASS SUBSTRATE, MULTILAYER WIRING SUBSTRATE, AND METHOD FOR PRODUC...
- Publication number 20250227842
- Publication date Jul 10, 2025
- TOPPAN Holdings Inc.
- Masashi SAWADAISHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wearable Device for Sports Headwear
- Publication number 20250227839
- Publication date Jul 10, 2025
- HEAD IMPACT TRAUMA LIMITED
- David Euan Murray BOWEN
- A42 - HEADWEAR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT CARRIER
- Publication number 20250227857
- Publication date Jul 10, 2025
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250218918
- Publication date Jul 3, 2025
- RENESAS ELECTRONICS CORPORATION
- Ryuichi OIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20250220810
- Publication date Jul 3, 2025
- LG Innotek Co., Ltd.
- Han Sang KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250212326
- Publication date Jun 26, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Sang Jong LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SLOT GROUND FOR IMPROVED SIGNAL INTEGRITY
- Publication number 20250212317
- Publication date Jun 26, 2025
- NVIDIA Corporation
- Tibet Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20250212324
- Publication date Jun 26, 2025
- TOPPAN Holdings Inc.
- Tomoyuki Ishii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH FREQUENCY MODULE AND COMMUNICATION APPARATUS
- Publication number 20250212318
- Publication date Jun 26, 2025
- MURATA MANUFACTURING CO., LTD.
- Hisanori MURASE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250212335
- Publication date Jun 26, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Tae Kyung LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250212336
- Publication date Jun 26, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Ki Ran PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250203767
- Publication date Jun 19, 2025
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal Management in Circuit Board Assemblies
- Publication number 20250203753
- Publication date Jun 19, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20250203775
- Publication date Jun 19, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Sang Kee YOON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VOLTAGE-ISOLATED IC PACKAGES WITH EXTENSIONS FOR CORE PLACEMENT
- Publication number 20250201466
- Publication date Jun 19, 2025
- ALLEGRO MICROSYSTEMS, LLC
- Vijay Mangtani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250203766
- Publication date Jun 19, 2025
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND MOUNTING STRUCTURE
- Publication number 20250203755
- Publication date Jun 19, 2025
- KYOCERA CORPORATION
- Aki KAWASE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20250203769
- Publication date Jun 19, 2025
- Nichia Corporation.
- Atsushi HOSOKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING ELECTRONIC COMPONENT SUB-MOUNT
- Publication number 20250203780
- Publication date Jun 19, 2025
- Lextar Electronics Corporation
- Ming-Jing LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE HAVING THE SAME
- Publication number 20250194011
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Eunhye Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATE, METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE...
- Publication number 20250194009
- Publication date Jun 12, 2025
- FICT LIMITED
- Kenji Iida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Via connections; Lands around holes or via connections

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic assembly having circuit carrier

Printed circuit board and image display device including same

Power supply device

Electronic package, electronic structure and manufacturing method t...

Apparatus, system, and method for achieving certain characteristics...

Electronic component embedded substrate

Circuit board including a core layer provided with plurality of ins...

Low cost, low loss material for microwave or antenna printed circui...

Co-planar interconnection mechanisms for circuit boards

Capacitors in through glass vias

Printed circuit board

Printed circuit boards with integrated inductors and antennas

Voltage regulator module

Methods to fill through-holes of a substrate with metal paste

Customized thermal pathways in a PCB

Power supply apparatus, load and electronic device

Wiring board and manufacturing method of wiring board

Wiring board

Printed circuit board

High aspect ratio vias filled with liquid metal fill

Wiring substrate and method for manufacturing wiring substrate

Asymmetrical laminated circuit boards for improved electrical perfo...

Printed circuit board and a semiconductor package including the same

Connection structure and electronic device

Method for manufacturing printed wiring board and printed wiring board

Laminated wiring board

Methods and systems for defects detection and classification using...

Mating backplane for high speed, high density electrical connector

Connection structure embedded substrate and substrate structure inc...

Electrical device, in particular inverter or converter

Patents Applicationslast 30 patents

POWER DELIVERY SYSTEM FOR HIGH DENSITY SIGNALING AND HIGH POWER DEL...

RELAY, POWER DISTRIBUTION APPARATUS, AND CHARGING PILE

MULTI-LAMINATION STRUCTURE THAT ELIMINATES MICRO CAVITY RESONANCE

MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE

SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

Liquid Cooling Using PCB Through Holes

CIRCUIT BOARD AND IMAGE FORMING APPARATUS

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

GLASS SUBSTRATE, MULTILAYER WIRING SUBSTRATE, AND METHOD FOR PRODUC...

GLASS SUBSTRATE, MULTILAYER WIRING SUBSTRATE, AND METHOD FOR PRODUC...

Wearable Device for Sports Headwear

MANUFACTURING METHOD OF CIRCUIT CARRIER

ELECTRONIC DEVICE

CIRCUIT BOARD

PRINTED CIRCUIT BOARD

SLOT GROUND FOR IMPROVED SIGNAL INTEGRITY

WIRING BOARD

HIGH FREQUENCY MODULE AND COMMUNICATION APPARATUS

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD

PRINTED WIRING BOARD

Thermal Management in Circuit Board Assemblies

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME

VOLTAGE-ISOLATED IC PACKAGES WITH EXTENSIONS FOR CORE PLACEMENT

PRINTED WIRING BOARD

WIRING BOARD AND MOUNTING STRUCTURE

WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE INCLUDING ELECTRONIC COMPONENT SUB-MOUNT

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE HAVING THE SAME

MULTILAYER SUBSTRATE, METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE...