Via connections; Lands around holes or via connections

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CPC
H05K1/115

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/115Via connections; Lands around holes or via connections

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Asymmetrical laminated circuit boards for improved electrical perfo...
- Patent number 12,328,816
- Issue date Jun 10, 2025
- Intel Corporation
- Jackson Chung Peng Kong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and a semiconductor package including the same
- Patent number 12,328,820
- Issue date Jun 10, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Gopal Garg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection structure and electronic device
- Patent number 12,317,417
- Issue date May 27, 2025
- Innolux Corporation
- Mei-Hsiu Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing printed wiring board and printed wiring board
- Patent number 12,317,425
- Issue date May 27, 2025
- Ibiden Co., Ltd.
- Atsushi Ishida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated wiring board
- Patent number 12,317,426
- Issue date May 27, 2025
- Shinko Electric Industries Co., Ltd.
- Shota Miki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and systems for defects detection and classification using...
- Patent number 12,307,668
- Issue date May 20, 2025
- Bruker Nano, Inc.
- David Lewis Adler
- G01 - MEASURING TESTING
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 12,309,915
- Issue date May 20, 2025
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure embedded substrate and substrate structure inc...
- Patent number 12,309,924
- Issue date May 20, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Tae Hong Min
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electrical device, in particular inverter or converter
- Patent number 12,309,927
- Issue date May 20, 2025
- Sew-Eurodrive GmbH & Co. KG
- Werner Groß
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 12,309,923
- Issue date May 20, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sang Hoon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit carrier and manufacturing method thereof and package structure
- Patent number 12,309,943
- Issue date May 20, 2025
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lighting device with connection to element electrodes using filler
- Patent number 12,302,494
- Issue date May 13, 2025
- Nichia Corporation
- Eiko Minato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer structure and an electronic device including the same
- Patent number 12,302,495
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Yeonkyung Chung
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
System and method to eliminate via striping
- Patent number 12,302,496
- Issue date May 13, 2025
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package and electronic device
- Patent number 12,300,681
- Issue date May 13, 2025
- Advanced Semiconductor Engineering, Inc.
- Wei-Hao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and image forming apparatus
- Patent number 12,295,096
- Issue date May 6, 2025
- Canon Kabushiki Kaisha
- Takeshi Honda
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Conductive structure including copper-phosphorous alloy and a metho...
- Patent number 12,293,966
- Issue date May 6, 2025
- Chun-Ming Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed circuit board and storage device including the same
- Patent number 12,295,095
- Issue date May 6, 2025
- Samsung Electronics Co., Ltd.
- Sunhong Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with partially metallized hole using anti-plating...
- Patent number 12,295,108
- Issue date May 6, 2025
- AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
- Jiangfeng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board
- Patent number 12,295,099
- Issue date May 6, 2025
- Shinko Electric Industries Co., Ltd.
- Yuta Yamazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 12,289,829
- Issue date Apr 29, 2025
- Ibiden Co., Ltd.
- Jun Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metamaterial electromagnetic absorber
- Patent number 12,289,823
- Issue date Apr 29, 2025
- Hyundai Motor Company
- Seung Hyun Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 12,289,832
- Issue date Apr 29, 2025
- NANJING ZTE NEW SOFTWARE CO., LTD.
- Li Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,289,838
- Issue date Apr 29, 2025
- Ibiden Co., Ltd.
- Yasuki Kimishima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Three dimensional circuit module and method for manufacturing the same
- Patent number 12,289,833
- Issue date Apr 29, 2025
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Gao Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
PCB tuning for waveguide antennae
- Patent number 12,283,736
- Issue date Apr 22, 2025
- MAGNA ELECTRONICS, LLC
- Angelos Alexanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring circuit board
- Patent number 12,284,757
- Issue date Apr 22, 2025
- Nitto Denko Corporation
- Shusaku Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Isolator
- Patent number 12,279,362
- Issue date Apr 15, 2025
- Kabushiki Kaisha Toshiba
- Yoshinari Tamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid through hole for solid state intrusion detection
- Patent number 12,279,370
- Issue date Apr 15, 2025
- Dell Products L.P.
- Yong-Teng Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electrically connected component carrier stacks with respective cav...
- Patent number 12,279,369
- Issue date Apr 15, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Bernhard Reitmaier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE HAVING THE SAME
- Publication number 20250194011
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Eunhye Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATE, METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE...
- Publication number 20250194009
- Publication date Jun 12, 2025
- FICT LIMITED
- Kenji Iida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND IMAGE FORMING APPARATUS
- Publication number 20250189923
- Publication date Jun 12, 2025
- Canon Kabushiki Kaisha
- YOSHIFUMI TAKAO
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250194010
- Publication date Jun 12, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Jun Ki Min
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE COMPRISING ANTENNA STRUCTURE CONNECTED TO HOUSING
- Publication number 20250192415
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Youngchul LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250194001
- Publication date Jun 12, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Kyung Moon JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250194004
- Publication date Jun 12, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Mi Sun Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250194008
- Publication date Jun 12, 2025
- KYOCERA CORPORATION
- Tomoya NAGASE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Device and Manufacturing Method thereof
- Publication number 20250183148
- Publication date Jun 5, 2025
- InnoLux Corporation
- Kuang-Ming FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20250185157
- Publication date Jun 5, 2025
- KYOCERA CORPORATION
- Suguru KADOWAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD INCLUDING A BUFFER LAYER FOR IMPROVING
- Publication number 20250185161
- Publication date Jun 5, 2025
- LG Innotek Co., Ltd.
- Yong Suk KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR AN INTERMEDIATE DEVICE STRUCTURE
- Publication number 20250185139
- Publication date Jun 5, 2025
- LIGHTING DEFENSE GROUP, LLC
- Daniel S. Spiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BGA Radio Frequency Module, Substrate for BGA Radio Frequency Modul...
- Publication number 20250185153
- Publication date Jun 5, 2025
- Nippon Telegraph and Telephone Corporation
- Masayuki Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metal-ceramic substrate and method of manufacturing a metal-ceramic...
- Publication number 20250185166
- Publication date Jun 5, 2025
- Rogers Germany GmbH
- Tilo Welker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING SUBSTRATE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME
- Publication number 20250174537
- Publication date May 29, 2025
- ABSOLICS INC.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250174568
- Publication date May 29, 2025
- InnoLux Corporation
- Po-Yun HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250176099
- Publication date May 29, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Tae Hong MIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS COMPRISING INTERPOSER
- Publication number 20250176106
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Euisup KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING SUBSTRATE
- Publication number 20250168972
- Publication date May 22, 2025
- IBIDEN CO., LTD.
- Haruhiko MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250168980
- Publication date May 22, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Min Gyu PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250168984
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Jin Duck PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BASE MEMBER
- Publication number 20250168982
- Publication date May 22, 2025
- Canon Kabushiki Kaisha
- Yoshihiko Fujise
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer Filter, Multilayer Filter Assembly, and Methods for Form...
- Publication number 20250167414
- Publication date May 22, 2025
- KYOCERA AVX Components Corporation
- Cory Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORE SUBSTRATE AND INTERPOSER
- Publication number 20250167091
- Publication date May 22, 2025
- NGK Insulators, Ltd.
- Yoshitsugu WAKAZONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20250168981
- Publication date May 22, 2025
- InnoLux Corporation
- Cheng-Chi WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METALLIZED VIAS IN GLASS AND SILICON SUBSTRATES, INTERPOSERS, AND M...
- Publication number 20250159807
- Publication date May 15, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20250157910
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Jongyoun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD HAVING OPTIONAL CIRCUIT UNIT
- Publication number 20250159804
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Kihun OH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY AND ELECTRONIC DEVICE COMPRISING SAME
- Publication number 20250150523
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Kyonghwan CHO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
FLEXIBLE AND STRETCHABLE STRUCTURES
- Publication number 20250151201
- Publication date May 8, 2025
- Liquid Wire Inc.
- Mark William Ronay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Via connections; Lands around holes or via connections

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Asymmetrical laminated circuit boards for improved electrical perfo...

Printed circuit board and a semiconductor package including the same

Connection structure and electronic device

Method for manufacturing printed wiring board and printed wiring board

Laminated wiring board

Methods and systems for defects detection and classification using...

Mating backplane for high speed, high density electrical connector

Connection structure embedded substrate and substrate structure inc...

Electrical device, in particular inverter or converter

Printed circuit board and method for manufacturing the same

Circuit carrier and manufacturing method thereof and package structure

Lighting device with connection to element electrodes using filler

Interposer structure and an electronic device including the same

System and method to eliminate via striping

Electronic package and electronic device

Circuit board and image forming apparatus

Conductive structure including copper-phosphorous alloy and a metho...

Printed circuit board and storage device including the same

Component carrier with partially metallized hole using anti-plating...

Wiring board

Printed wiring board

Metamaterial electromagnetic absorber

Circuit board

Wiring substrate and method for manufacturing wiring substrate

Three dimensional circuit module and method for manufacturing the same

PCB tuning for waveguide antennae

Wiring circuit board

Isolator

Hybrid through hole for solid state intrusion detection

Electrically connected component carrier stacks with respective cav...

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE HAVING THE SAME

MULTILAYER SUBSTRATE, METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE...

CIRCUIT BOARD AND IMAGE FORMING APPARATUS

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE COMPRISING ANTENNA STRUCTURE CONNECTED TO HOUSING

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD

PRINTED WIRING BOARD

Electronic Device and Manufacturing Method thereof

WIRING BOARD

CIRCUIT BOARD INCLUDING A BUFFER LAYER FOR IMPROVING

SYSTEMS AND METHODS FOR AN INTERMEDIATE DEVICE STRUCTURE

BGA Radio Frequency Module, Substrate for BGA Radio Frequency Modul...

Metal-ceramic substrate and method of manufacturing a metal-ceramic...

PACKAGING SUBSTRATE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME

ELECTRONIC DEVICE

PRINTED CIRCUIT BOARD

ELECTRONIC APPARATUS COMPRISING INTERPOSER

ELECTRONIC COMPONENT MOUNTING SUBSTRATE

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

BASE MEMBER

Multilayer Filter, Multilayer Filter Assembly, and Methods for Form...

CORE SUBSTRATE AND INTERPOSER

ELECTRONIC DEVICE AND METHOD FOR FORMING THE SAME

METALLIZED VIAS IN GLASS AND SILICON SUBSTRATES, INTERPOSERS, AND M...

CONNECTION STRUCTURE AND METHOD OF FORMING THE SAME

PRINTED CIRCUIT BOARD HAVING OPTIONAL CIRCUIT UNIT

DISPLAY AND ELECTRONIC DEVICE COMPRISING SAME

FLEXIBLE AND STRETCHABLE STRUCTURES