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H05K2201/09609

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device including stacked printed circuit boards
- Patent number 12,156,326
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Seungbo Shim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and procedure for miniaturing a multi-layer PCB
- Patent number 12,150,237
- Issue date Nov 19, 2024
- VEEA INC.
- Robert Migliorino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Rigid flexible printed circuit board and electronic device includin...
- Patent number 12,101,874
- Issue date Sep 24, 2024
- Samsung Electronics Co., Ltd.
- Eunseok Hong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Waveguide launch system for coupling to a waveguide channel through...
- Patent number 12,087,990
- Issue date Sep 10, 2024
- Saab AB
- Sten Gunnarsson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resonant-coupled transmission line
- Patent number 12,004,288
- Issue date Jun 4, 2024
- Teradyne, Inc.
- Andrew Westwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution plate
- Patent number 11,997,789
- Issue date May 28, 2024
- Dominik Schmidt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wideband routing techniques for PCB layout
- Patent number 11,937,373
- Issue date Mar 19, 2024
- Hewlett Packard Enterprise Development LP
- Melvin K. Benedict
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering printed circuits using radiant heat
- Patent number 11,903,143
- Issue date Feb 13, 2024
- Microsoft Technology Licensing, LLC
- David Christopher Perna
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 11,903,128
- Issue date Feb 13, 2024
- Ibiden Co., Ltd.
- Shigeto Iyoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-frequency circuit
- Patent number 11,812,546
- Issue date Nov 7, 2023
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Koji Nitta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Front-end module comprising front-end components and a substrate in...
- Patent number 11,777,186
- Issue date Oct 3, 2023
- Allen-Vanguard Corporation
- Sulav Adhikari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having substrate
- Patent number 11,756,865
- Issue date Sep 12, 2023
- Industrial Technology Research Institute
- Sheng-Che Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including high-frequency transmission circuit
- Patent number 11,749,880
- Issue date Sep 5, 2023
- Samsung Electronics Co., Ltd.
- Han-Min Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective ground flood around reduced land pad on package base laye...
- Patent number 11,737,227
- Issue date Aug 22, 2023
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board connector footprint
- Patent number 11,729,898
- Issue date Aug 15, 2023
- TE CONNECTIVITY SOLUTIONS GmbH
- Justin Dennis Pickel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems for shielding bent signal lines
- Patent number 11,696,390
- Issue date Jul 4, 2023
- QUALCOMM Incorporated
- Jeahyeong Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,678,438
- Issue date Jun 13, 2023
- PANELSEMI CORPORATION
- Chin-Tang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adapter board and method for making adapter board
- Patent number 11,665,820
- Issue date May 30, 2023
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Man-Zhi Peng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate layered structure and interposer block
- Patent number 11,647,586
- Issue date May 9, 2023
- LG Electronics Inc.
- Sanggeun Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wiring board
- Patent number 11,602,048
- Issue date Mar 7, 2023
- Kyocera Corporation
- Hidetoshi Yugawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and system of a printed circuit board (PCB) including a r...
- Patent number 11,596,055
- Issue date Feb 28, 2023
- Intel Corporation
- Ofer Markish
- G01 - MEASURING TESTING
Information Patent Grant
Electronic device including high-frequency transmission circuit
- Patent number 11,569,565
- Issue date Jan 31, 2023
- Samsung Electronics Co., Ltd.
- Han-Min Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board device
- Patent number 11,570,886
- Issue date Jan 31, 2023
- Global Unichip Corporation
- Yu-Ju Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-hole and surface mount printed circuit card connections for...
- Patent number 11,570,894
- Issue date Jan 31, 2023
- Rockwell Collins, Inc.
- James B. Mayfield
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for impedance balancing of long radio frequenc...
- Patent number 11,564,316
- Issue date Jan 24, 2023
- Lockheed Martin Corporation
- Jesse Michael Zamarron
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Functionally graded thermal vias for inductor winding heat flow con...
- Patent number 11,545,297
- Issue date Jan 3, 2023
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Ercan Dede
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus
- Patent number 11,536,646
- Issue date Dec 27, 2022
- Kabushiki Kaisha Toshiba
- Masahide Takazawa
- G08 - SIGNALLING
Information Patent Grant
High-frequency module, high-frequency circuit, and communication de...
- Patent number 11,533,806
- Issue date Dec 20, 2022
- Murata Manufacturing Co., Ltd.
- Hiroshi Matsubara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Redistribution plate
- Patent number 11,510,318
- Issue date Nov 22, 2022
- Dominik Schmidt
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
CARRIER STRUCTURE
- Publication number 20240407079
- Publication date Dec 5, 2024
- Siliconware Precision Industries Co., Ltd.
- Chien-Sheng CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE AND A METHOD FOR MANUFACTURING THE SAME
- Publication number 20240321711
- Publication date Sep 26, 2024
- Chengdu Monolithic Power Systems Co., Ltd.
- Yingjiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD FOR A POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR...
- Publication number 20240260168
- Publication date Aug 1, 2024
- VITESCO TECHNOLOGIES GMBH
- Detlev Bagung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR SURFACE MOUNT CONNECTIONS
- Publication number 20240243496
- Publication date Jul 18, 2024
- CIENA CORPORATION
- Russell Mays
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY IMPROVED PCB FOR SEMICONDUCTOR POWER DIE CONNECTED BY VIA...
- Publication number 20240237208
- Publication date Jul 11, 2024
- Mitsubishi Electric Corporation
- REMI PERRIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB DESIGN TO IMPROVE HFM CONNECTOR PERFORMANCE
- Publication number 20240188210
- Publication date Jun 6, 2024
- NIO Technology (Anhui) Co., Ltd.
- Tiejun Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CONNECTING STRUCTURE
- Publication number 20240128665
- Publication date Apr 18, 2024
- Min Di Consultants Ltd.
- Chi-Di LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL LAUNCHER FOR A PRINTED CIRCUIT BOARD
- Publication number 20240121897
- Publication date Apr 11, 2024
- NXP B.V.
- Abdellatif Zanati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BASE AND ELECTRONIC DEVICE
- Publication number 20240074035
- Publication date Feb 29, 2024
- KYOCERA CORPORATION
- Yoshiki KAWAZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATE, METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE...
- Publication number 20240055744
- Publication date Feb 15, 2024
- Murata Manufacturing Co., Ltd.
- Nobuo IKEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD, MULTILAYER RESONATOR, AND MULTILAYER FILTER
- Publication number 20240040693
- Publication date Feb 1, 2024
- KYOCERA CORPORATION
- Atsuo KAWAGOE
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
FRONT-END MODULE COMPRISING FRONT-END COMPONENTS AND A SUBSTRATE IN...
- Publication number 20240030575
- Publication date Jan 25, 2024
- ALLEN-VANGUARD CORPORATION
- Sulav ADHIKARI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240030580
- Publication date Jan 25, 2024
- Innolux Corporation
- Chen-Lin Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20240014536
- Publication date Jan 11, 2024
- Murata Manufacturing Co., Ltd.
- Hironobu TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING CIRCUIT BOARD
- Publication number 20240008178
- Publication date Jan 4, 2024
- Nitto Denko Corporation
- Shusaku SHIBATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING HIGH-FREQUENCY TRANSMISSION CIRCUIT
- Publication number 20230411832
- Publication date Dec 21, 2023
- Samsung Electronics Co., Ltd.
- Han-Min CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20230397334
- Publication date Dec 7, 2023
- NANJING ZTE NEW SOFTWARE CO., LTD.
- Li ZHAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIDEBAND ROUTING TECHNIQUES FOR PCB LAYOUT
- Publication number 20230292436
- Publication date Sep 14, 2023
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Melvin K. Benedict
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER PRINTED CIRCUIT BOARD
- Publication number 20230292437
- Publication date Sep 14, 2023
- JESS-LINK PRODUCTS CO., LTD.
- Yu-Liang LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND SYSTEM OF A PRINTED CIRCUIT BOARD (PCB) INCLUDING A R...
- Publication number 20230276568
- Publication date Aug 31, 2023
- Intel Corporation
- Ofer Markish
- G01 - MEASURING TESTING
Information Patent Application
Printed Circuit Board, Backplane Architecture System, and Communica...
- Publication number 20230269862
- Publication date Aug 24, 2023
- Huawei Technologies Co., Ltd
- Wenliang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND PROBE CARD
- Publication number 20230266363
- Publication date Aug 24, 2023
- KYOCERA CORPORATION
- Hitoshi TEGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND LIGHT-EMITTING DEVICE
- Publication number 20230209715
- Publication date Jun 29, 2023
- Nichia Corporation.
- Soichiro MIURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERING PRINTED CIRCUITS USING RADIANT HEAT
- Publication number 20230199971
- Publication date Jun 22, 2023
- Microsoft Technology Licensing, LLC
- David Christopher PERNA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING HIGH-FREQUENCY TRANSMISSION CIRCUIT
- Publication number 20230134315
- Publication date May 4, 2023
- Samsung Electronics Co., Ltd.
- Han-Min CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20230115650
- Publication date Apr 13, 2023
- IBIDEN CO., LTD.
- Shigeto IYODA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Procedure for Miniaturing a Multi-layer PCB
- Publication number 20230087792
- Publication date Mar 23, 2023
- Veea Inc.
- Robert MIGLIORINO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDISTRIBUTION PLATE
- Publication number 20230054628
- Publication date Feb 23, 2023
- Translarity, Inc.
- Dominik Schmidt
- G01 - MEASURING TESTING
Information Patent Application
RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDIN...
- Publication number 20230035851
- Publication date Feb 2, 2023
- Samsung Electronics Co., Ltd.
- Eunseok HONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING STACKED PRINTED CIRCUIT BOARDS
- Publication number 20230011480
- Publication date Jan 12, 2023
- Samsung Electronics Co., Ltd.
- Seungbo SHIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device including stacked printed circuit boards

Method and procedure for miniaturing a multi-layer PCB

Hermetic metallized via with improved reliability

Rigid flexible printed circuit board and electronic device includin...

Waveguide launch system for coupling to a waveguide channel through...

Resonant-coupled transmission line

Redistribution plate

Wideband routing techniques for PCB layout

Soldering printed circuits using radiant heat

Wiring substrate

High-frequency circuit

Front-end module comprising front-end components and a substrate in...

Electronic device having substrate

Electronic device including high-frequency transmission circuit

Selective ground flood around reduced land pad on package base laye...

Circuit board connector footprint

Systems for shielding bent signal lines

Electronic device

Adapter board and method for making adapter board

Substrate layered structure and interposer block

Wiring board

Apparatus and system of a printed circuit board (PCB) including a r...

Electronic device including high-frequency transmission circuit

Circuit board device

Through-hole and surface mount printed circuit card connections for...

Apparatus and method for impedance balancing of long radio frequenc...

Functionally graded thermal vias for inductor winding heat flow con...

Electronic apparatus

High-frequency module, high-frequency circuit, and communication de...

Redistribution plate

Patents Applicationslast 30 patents

CARRIER STRUCTURE

SUBSTRATE AND A METHOD FOR MANUFACTURING THE SAME

CIRCUIT BOARD FOR A POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR...

METHOD AND APPARATUS FOR SURFACE MOUNT CONNECTIONS

THERMALLY IMPROVED PCB FOR SEMICONDUCTOR POWER DIE CONNECTED BY VIA...

PCB DESIGN TO IMPROVE HFM CONNECTOR PERFORMANCE

FLEXIBLE CONNECTING STRUCTURE

VERTICAL LAUNCHER FOR A PRINTED CIRCUIT BOARD

WIRING BASE AND ELECTRONIC DEVICE

MULTILAYER SUBSTRATE, METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE...

PRINTED WIRING BOARD, MULTILAYER RESONATOR, AND MULTILAYER FILTER

FRONT-END MODULE COMPRISING FRONT-END COMPONENTS AND A SUBSTRATE IN...

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

MULTILAYER SUBSTRATE AND ELECTRONIC DEVICE

WIRING CIRCUIT BOARD

ELECTRONIC DEVICE INCLUDING HIGH-FREQUENCY TRANSMISSION CIRCUIT

CIRCUIT BOARD

WIDEBAND ROUTING TECHNIQUES FOR PCB LAYOUT

MULTI-LAYER PRINTED CIRCUIT BOARD

APPARATUS AND SYSTEM OF A PRINTED CIRCUIT BOARD (PCB) INCLUDING A R...

Printed Circuit Board, Backplane Architecture System, and Communica...

CIRCUIT BOARD AND PROBE CARD

WIRING BOARD AND LIGHT-EMITTING DEVICE

SOLDERING PRINTED CIRCUITS USING RADIANT HEAT

ELECTRONIC DEVICE INCLUDING HIGH-FREQUENCY TRANSMISSION CIRCUIT

WIRING SUBSTRATE

Method and Procedure for Miniaturing a Multi-layer PCB

REDISTRIBUTION PLATE

RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDIN...

ELECTRONIC DEVICE INCLUDING STACKED PRINTED CIRCUIT BOARDS