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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240107668
    • Publication date Mar 28, 2024
    • LG Innotek Co., Ltd.
    • Jinhak LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20240098896
    • Publication date Mar 21, 2024
    • PanelSemi Corporation
    • Chin-Tang LI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    • Publication number 20240074050
    • Publication date Feb 29, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Jun Ki Min
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20240074057
    • Publication date Feb 29, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Man Gon Kim
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Overlap Joint Flex Circuit Board Interconnection
    • Publication number 20240049392
    • Publication date Feb 8, 2024
    • Google LLC
    • John Martinis
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING CIRCUIT BOARD
    • Publication number 20240008178
    • Publication date Jan 4, 2024
    • Nitto Denko Corporation
    • Shusaku SHIBATA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PCB FOR HEATSINK BASED POWER DELIVERY
    • Publication number 20230337356
    • Publication date Oct 19, 2023
    • Dell Products L.P.
    • Sandor Farkas
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CPU FOR HEATSINK BASED POWER DELIVERY
    • Publication number 20230337360
    • Publication date Oct 19, 2023
    • Dell Products L.P.
    • Sandor Farkas
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20230309233
    • Publication date Sep 28, 2023
    • KIOXIA Corporation
    • Satoru FUKUCHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD, FABRICATION METHOD OF THE SAME AND ELECTRONI...
    • Publication number 20230121285
    • Publication date Apr 20, 2023
    • Samsung Electronics Co., Ltd.
    • Sangwon HA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20230115650
    • Publication date Apr 13, 2023
    • IBIDEN CO., LTD.
    • Shigeto IYODA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20230113302
    • Publication date Apr 13, 2023
    • LG Innotek Co., Ltd.
    • Yong Han JEON
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MODULE
    • Publication number 20230105635
    • Publication date Apr 6, 2023
    • Murata Manufacturing Co., Ltd.
    • Yoshihito OTSUBO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MODULE
    • Publication number 20230105809
    • Publication date Apr 6, 2023
    • Murata Manufacturing Co., Ltd.
    • Yoshihito OTSUBO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SUBSTRATE HAVING ELECTRIC COMPONENT EMBEDDED THEREIN
    • Publication number 20230104939
    • Publication date Apr 6, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • Myeong Hui Jung
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MODULE
    • Publication number 20230103130
    • Publication date Mar 30, 2023
    • Murata Manufacturing Co., Ltd.
    • Yoshihito OTSUBO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND VEHICLE INCLUDING THE SAME
    • Publication number 20230073345
    • Publication date Mar 9, 2023
    • HYUNDAI MOBIS CO., LTD.
    • Myeong Je KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE COMPRISING INTERPOSER
    • Publication number 20230069694
    • Publication date Mar 2, 2023
    • Samsung Electronics Co., Ltd.
    • Eunseok HONG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD FOR MANUFACTURING WIRING SUBSTRATE
    • Publication number 20230063719
    • Publication date Mar 2, 2023
    • IBIDEN CO., LTD.
    • Michimasa TAKAHASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20230066269
    • Publication date Mar 2, 2023
    • LG Innotek Co., Ltd.
    • Min Young HWANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ADAPTER BOARD, METHOD FOR MANUFACTURING THE SAME AND CIRCUIT BOARD...
    • Publication number 20230007778
    • Publication date Jan 5, 2023
    • SHENNAN CIRCUITS CO., LTD.
    • LIXIANG HUANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARDS AND MEMORY MODULES
    • Publication number 20220408550
    • Publication date Dec 22, 2022
    • Samsung Electronics Co., Ltd.
    • Dongyoon SEO
    • G11 - INFORMATION STORAGE
  • Information Patent Application

    INTEGRATED RF PASSIVE DEVICES ON GLASS
    • Publication number 20220408562
    • Publication date Dec 22, 2022
    • Intel Corporation
    • Telesphor KAMGAING
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Component Carrier Interconnection and Manufacturing Method
    • Publication number 20220386464
    • Publication date Dec 1, 2022
    • AT&S Austria Technologie & Systemtechnik Aktiengensellschaft
    • Abderrazzaq IFIS
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Method for Designing PCB Pads, Device and Medium
    • Publication number 20220377905
    • Publication date Nov 24, 2022
    • INSPUR SUZHOU INTELLIGENT TECHNOLOGY CO., LTD
    • Caikun Yang
    • G05 - CONTROLLING REGULATING
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20220361330
    • Publication date Nov 10, 2022
    • FUJIKURA LTD.
    • Naoki Oyaizu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20220304152
    • Publication date Sep 22, 2022
    • ZTE Corporation
    • Changgang YIN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COMPOSITE WIRING BOARD, PACKAGE, AND ELECTRONIC DEVICE
    • Publication number 20220151060
    • Publication date May 12, 2022
    • NGK Electronics Devices, Inc.
    • Noboru KUBO
    • G02 - OPTICS
  • Information Patent Application

    FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE...
    • Publication number 20220151061
    • Publication date May 12, 2022
    • Samsung Electro-Mechanics Co., Ltd.
    • Ji Won Lee
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Overlap Joint Flex Circuit Board Mating
    • Publication number 20220087022
    • Publication date Mar 17, 2022
    • Google LLC
    • John Martinis
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR