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Patents Grantslast 30 patents

  • Information Patent Grant

    Circuit board

    • Patent number 12,369,248
    • Issue date Jul 22, 2025
    • LG Innotek Co., Ltd
    • Min Young Hwang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Printed circuit board

    • Patent number 12,356,547
    • Issue date Jul 8, 2025
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Man Gon Kim
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Board-level pad pattern for multi-row QFN packages

    • Patent number 12,309,921
    • Issue date May 20, 2025
    • Mediatek Inc.
    • Hui-Chi Tang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Electronic device comprising interposer

    • Patent number 12,245,374
    • Issue date Mar 4, 2025
    • Samsung Electronics Co., Ltd.
    • Eunseok Hong
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    CPU for heatsink based power delivery

    • Patent number 12,213,252
    • Issue date Jan 28, 2025
    • Dell Products L.P.
    • Sandor Farkas
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Overlap joint flex circuit board interconnection

    • Patent number 12,207,407
    • Issue date Jan 21, 2025
    • Google LLC
    • John Martinis
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Module

    • Patent number 12,193,162
    • Issue date Jan 7, 2025
    • Murata Manufacturing Co., Ltd.
    • Yoshihito Otsubo
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Shielded electronic component package

    • Patent number 12,040,305
    • Issue date Jul 16, 2024
    • Amkor Technology Singapore Holding Pte Ltd.
    • Jong Ok Chun
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Display device and manufacturing method thereof

    • Patent number 12,041,720
    • Issue date Jul 16, 2024
    • Chengdu BOE Optoelectronics Technology Co., Ltd.
    • Ren Xiong
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Circuit board

    • Patent number 11,974,388
    • Issue date Apr 30, 2024
    • LG Innotek Co., Ltd
    • Byeong Kyun Choi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Printed circuit boards and memory modules

    • Patent number 11,974,391
    • Issue date Apr 30, 2024
    • Samsung Electronics Co., Ltd.
    • Dongyoon Seo
    • G11 - INFORMATION STORAGE
  • Information Patent Grant

    PCB for heatsink based power delivery

    • Patent number 11,963,289
    • Issue date Apr 16, 2024
    • Dell Products L.P.
    • Sandor Farkas
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wiring substrate

    • Patent number 11,903,128
    • Issue date Feb 13, 2024
    • Ibiden Co., Ltd.
    • Shigeto Iyoda
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wiring substrate

    • Patent number 11,864,316
    • Issue date Jan 2, 2024
    • Fujikura Ltd.
    • Naoki Oyaizu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Adapter board, method for manufacturing the same and circuit board...

    • Patent number 11,856,702
    • Issue date Dec 26, 2023
    • SHENNAN CIRCUITS CO., LTD.
    • Lixiang Huang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Composite wiring board, package, and electronic device

    • Patent number 11,849,538
    • Issue date Dec 19, 2023
    • NGK Electronics Devices, Inc.
    • Noboru Kubo
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Printed circuit board and vehicle including the same

    • Patent number 11,832,387
    • Issue date Nov 28, 2023
    • Hyundai Mobis Co., Ltd.
    • Myeong Je Kim
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Circuit board

    • Patent number 11,778,741
    • Issue date Oct 3, 2023
    • LG Innotek Co., Ltd
    • Yong Han Jeon
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Substrate having electric component embedded therein

    • Patent number 11,765,833
    • Issue date Sep 19, 2023
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Myeong Hui Jung
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Overlap joint flex circuit board mating

    • Patent number 11,751,333
    • Issue date Sep 5, 2023
    • Google LLC
    • John Martinis
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Circuit board connector footprint

    • Patent number 11,729,898
    • Issue date Aug 15, 2023
    • TE CONNECTIVITY SOLUTIONS GmbH
    • Justin Dennis Pickel
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Circuit board

    • Patent number 11,696,399
    • Issue date Jul 4, 2023
    • ZTE Corporation
    • Changgang Yin
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Display device and manufacturing method thereof

    • Patent number 11,690,174
    • Issue date Jun 27, 2023
    • Chengdu BOE Optoelectronics Technology Co., Ltd.
    • Ren Xiong
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    LED lighting systems and methods

    • Patent number 11,690,172
    • Issue date Jun 27, 2023
    • Metrospec Technology, LLC
    • Henry V. Holec
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Ceramic electronic component

    • Patent number 11,647,581
    • Issue date May 9, 2023
    • Murata Manufacturing Co., Ltd.
    • Yuki Takemori
    • B32 - LAYERED PRODUCTS
  • Information Patent Grant

    Shielded electronic component package

    • Patent number 11,646,290
    • Issue date May 9, 2023
    • Amkor Technology Singapore Holding Pte Ltd.
    • Jong Ok Chun
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Ceramic electronic component

    • Patent number 11,641,712
    • Issue date May 2, 2023
    • Murata Manufacturing Co., Ltd.
    • Yuki Takemori
    • B32 - LAYERED PRODUCTS
  • Information Patent Grant

    Flexible printed circuit board and electronic device including the...

    • Patent number 11,576,255
    • Issue date Feb 7, 2023
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Ji Won Lee
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    LED assembly with omnidirectional light field

    • Patent number 11,543,081
    • Issue date Jan 3, 2023
    • Epistar Corporation
    • Hong-Zhi Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Circuit board structure and manufacturing method thereof

    • Patent number 11,516,910
    • Issue date Nov 29, 2022
    • Unimicron Technology Corp.
    • Chia-Yu Peng
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    WIRING BOARD

    • Publication number 20250240876
    • Publication date Jul 24, 2025
    • KYOCERA CORPORATION
    • Daichi SHIMIZU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING CIRCUIT BOARD

    • Publication number 20250240877
    • Publication date Jul 24, 2025
    • Nitto Denko Corporation
    • Takashi YAMAMOTO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD

    • Publication number 20250212324
    • Publication date Jun 26, 2025
    • TOPPAN Holdings Inc.
    • Tomoyuki Ishii
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR MODULE

    • Publication number 20250212334
    • Publication date Jun 26, 2025
    • Mitsubishi Electric Corporation
    • Taketoshi SHIKANO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD

    • Publication number 20250212336
    • Publication date Jun 26, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Ki Ran PARK
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD

    • Publication number 20250142724
    • Publication date May 1, 2025
    • KYOCERA CORPORATION
    • Toshifumi HIGASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PER LAYER ANTI-PAD STRUCTURE FOR BALL GRID ARRAY PRINTED CIRCUIT BO...

    • Publication number 20250142716
    • Publication date May 1, 2025
    • Astera Labs, Inc.
    • Long YANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD ASSEMBLY

    • Publication number 20250133652
    • Publication date Apr 24, 2025
    • Cisco Technology, Inc.
    • Yuqing Zhu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING BOARD AND SEMICONDUCTOR DEVICE

    • Publication number 20250113438
    • Publication date Apr 3, 2025
    • Shinko Electric Industries Co., Ltd.
    • Tomoyuki SHIMODAIRA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD

    • Publication number 20250089172
    • Publication date Mar 13, 2025
    • LG Innotek Co., Ltd.
    • Eom Ji KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    VIA AND PAD ARRANGEMENT FOR PRINTED CIRCUIT BOARD

    • Publication number 20250063658
    • Publication date Feb 20, 2025
    • Cisco Technology, Inc.
    • Mike Sapozhnikov
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD

    • Publication number 20250048557
    • Publication date Feb 6, 2025
    • LG Innotek Co., Ltd.
    • Soo Min LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    VIA ASSEMBLY FOR PRINTED CIRCUIT BOARD

    • Publication number 20250031300
    • Publication date Jan 23, 2025
    • Cisco Technology, Inc.
    • Mike Sapozhnikov
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

    • Publication number 20250016921
    • Publication date Jan 9, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Sang Ho JEONG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD

    • Publication number 20240407103
    • Publication date Dec 5, 2024
    • LG Innotek Co., Ltd.
    • Chae Young YOU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    OFFSET VOIDING SCHEME FOR VERTICAL INTERCONNECTS

    • Publication number 20240397610
    • Publication date Nov 28, 2024
    • Intel Corporation
    • Aik Hong Tan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DISPLAY DEVICE

    • Publication number 20240334603
    • Publication date Oct 3, 2024
    • Chengdu BOE Optoelectronics Technology Co., Ltd.
    • Ren XIONG
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

    • Publication number 20240321715
    • Publication date Sep 26, 2024
    • Samsung Electronics Co., Ltd.
    • HYEJIN KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Flexible Circuit Board, Circuit Board Assembly, and Electronic Device

    • Publication number 20240306300
    • Publication date Sep 12, 2024
    • Honor Device Co., Ltd.
    • Jianqiang Guo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD AND APPARATUS FOR SURFACE MOUNT CONNECTIONS

    • Publication number 20240243496
    • Publication date Jul 18, 2024
    • CIENA CORPORATION
    • Russell Mays
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING BOARD

    • Publication number 20240215164
    • Publication date Jun 27, 2024
    • Shinko Electric Industries Co., Ltd.
    • Kyota YAMAMURA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE

    • Publication number 20240107668
    • Publication date Mar 28, 2024
    • LG Innotek Co., Ltd.
    • Jinhak LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE

    • Publication number 20240098896
    • Publication date Mar 21, 2024
    • PanelSemi Corporation
    • Chin-Tang LI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

    • Publication number 20240074050
    • Publication date Feb 29, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Jun Ki Min
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD

    • Publication number 20240074057
    • Publication date Feb 29, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Man Gon Kim
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Overlap Joint Flex Circuit Board Interconnection

    • Publication number 20240049392
    • Publication date Feb 8, 2024
    • Google LLC
    • John Martinis
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING CIRCUIT BOARD

    • Publication number 20240008178
    • Publication date Jan 4, 2024
    • Nitto Denko Corporation
    • Shusaku SHIBATA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PCB FOR HEATSINK BASED POWER DELIVERY

    • Publication number 20230337356
    • Publication date Oct 19, 2023
    • Dell Products L.P.
    • Sandor Farkas
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CPU FOR HEATSINK BASED POWER DELIVERY

    • Publication number 20230337360
    • Publication date Oct 19, 2023
    • Dell Products L.P.
    • Sandor Farkas
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE

    • Publication number 20230309233
    • Publication date Sep 28, 2023
    • KIOXIA Corporation
    • Satoru FUKUCHI
    • H01 - BASIC ELECTRIC ELEMENTS