TREA

Via provided in pad; Pad over filled via

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Industry

  • CPC
  • H05K1/113
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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/113Via provided in pad; Pad over filled via
Industries