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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    BRUSHLESS DC MOTOR POWER TOOL WITH COMBINED PCB DESIGN
    • Publication number 20250239911
    • Publication date Jul 24, 2025
    • Milwaukee Electric Tool Corporation
    • Matthew J. Mergener
    • B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20250220815
    • Publication date Jul 3, 2025
    • PanelSemi Corporation
    • CHIN-TANG LI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SLOT GROUND FOR IMPROVED SIGNAL INTEGRITY
    • Publication number 20250212317
    • Publication date Jun 26, 2025
    • NVIDIA Corporation
    • Tibet Zhao
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FLEXIBLE PRINTED CIRCUIT, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DE...
    • Publication number 20250212330
    • Publication date Jun 26, 2025
    • Huawei Technologies Co., Ltd
    • Tong Zhang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20250212334
    • Publication date Jun 26, 2025
    • Mitsubishi Electric Corporation
    • Taketoshi SHIKANO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
    • Publication number 20250185165
    • Publication date Jun 5, 2025
    • AOI ELECTRONICS CO., LTD.
    • Takashi SUZUKI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE POST AND METHOD OF MANUF...
    • Publication number 20250174541
    • Publication date May 29, 2025
    • Samsung Electronics Co., Ltd.
    • Jing Cheng Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20250176111
    • Publication date May 29, 2025
    • Samsung Electronics Co., LTD
    • Kyoungok Jung
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20250151195
    • Publication date May 8, 2025
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD
    • Publication number 20250142724
    • Publication date May 1, 2025
    • KYOCERA CORPORATION
    • Toshifumi HIGASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LIGHTING DEVICE
    • Publication number 20250142723
    • Publication date May 1, 2025
    • Lite-On Technology Corporation
    • SHAN-HUI CHEN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20250133656
    • Publication date Apr 24, 2025
    • LG Innotek Co., Ltd.
    • Sang Il KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    VIA PLUG RESISTOR
    • Publication number 20250125242
    • Publication date Apr 17, 2025
    • Intel Corporation
    • Santosh Gangal
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND PACKAGE SUBSTRATE INCLUDING SAME
    • Publication number 20250125240
    • Publication date Apr 17, 2025
    • LG Innotek Co., Ltd.
    • Se Woong NA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR FORMING CIRCUIT BOARD
    • Publication number 20250126723
    • Publication date Apr 17, 2025
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Jiun-Yi Wu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250126710
    • Publication date Apr 17, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Man Gon KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20250125269
    • Publication date Apr 17, 2025
    • LG Innotek Co., Ltd.
    • Se Woong NA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING BOARD
    • Publication number 20250120010
    • Publication date Apr 10, 2025
    • Shinko Electric Industries Co., Ltd.
    • Tatsuki Sumi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD AND SEMICONDUCTOR DEVICE
    • Publication number 20250113438
    • Publication date Apr 3, 2025
    • Shinko Electric Industries Co., Ltd.
    • Tomoyuki SHIMODAIRA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20250089172
    • Publication date Mar 13, 2025
    • LG Innotek Co., Ltd.
    • Eom Ji KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20250089164
    • Publication date Mar 13, 2025
    • InnoLux Corporation
    • Cheng-Chi WANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR ELECTRONIC DEVICE
    • Publication number 20250079284
    • Publication date Mar 6, 2025
    • KYOCERA CORPORATION
    • Shigenori TAKAYA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING WIRING...
    • Publication number 20250070003
    • Publication date Feb 27, 2025
    • TOPPAN Holdings Inc.
    • Kenta SUGAWARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    EDGE MOUNT MEMORY CONNECTOR WITH STAGGERED FOOTPRINT PINS
    • Publication number 20250063659
    • Publication date Feb 20, 2025
    • Intel Corporation
    • Landon HANKS
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    VIA AND PAD ARRANGEMENT FOR PRINTED CIRCUIT BOARD
    • Publication number 20250063658
    • Publication date Feb 20, 2025
    • Cisco Technology, Inc.
    • Mike Sapozhnikov
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20250056713
    • Publication date Feb 13, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Ho-Jae LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20250048557
    • Publication date Feb 6, 2025
    • LG Innotek Co., Ltd.
    • Soo Min LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER BOARD, MULTILAYER BOARD MODULE, AND ELECTRONIC DEVICE
    • Publication number 20250048533
    • Publication date Feb 6, 2025
    • Murata Manufacturing Co., Ltd.
    • Nobuo IKEMOTO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF, AND SUBSTRATE...
    • Publication number 20250038097
    • Publication date Jan 30, 2025
    • Siliconware Precision Industries Co., Ltd.
    • Chia-Wen TSAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PLATED VIA-IN-VIA VERTICAL CONNECTION
    • Publication number 20250031318
    • Publication date Jan 23, 2025
    • Nokia Solutions and Networks Oy
    • Paul BROWN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR