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CPC
H05K1/113

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/113Via provided in pad; Pad over filled via

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic package and manufacturing method thereof, and substrate...
- Patent number 12,154,848
- Issue date Nov 26, 2024
- Siliconware Precision Industries Co., Ltd.
- Chia-Wen Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and configuration for stacking multiple printed circuit boards
- Patent number 12,156,333
- Issue date Nov 26, 2024
- Mellanox Technologies, Ltd.
- Xiuzhuang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact oscillator device with a cavity resonator on a circuit board
- Patent number 12,142,810
- Issue date Nov 12, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Mikael Hörberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer circuit board
- Patent number 12,137,521
- Issue date Nov 5, 2024
- 3M Innovative Properties Company
- YunLong Qiao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 12,133,329
- Issue date Oct 29, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Su Min Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit structure and fabrication method thereof
- Patent number 12,133,337
- Issue date Oct 29, 2024
- INNOLUX CORPORATION
- Yi Hung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 12,133,330
- Issue date Oct 29, 2024
- Shinko Electric Industries Co., Ltd.
- Akihiro Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component embedded substrate
- Patent number 12,114,428
- Issue date Oct 8, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yun Je Ji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for creating orthogonal solder interconnects
- Patent number 12,108,542
- Issue date Oct 1, 2024
- Raytheon Company
- Justin A. Kasemodel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 12,108,530
- Issue date Oct 1, 2024
- Unimicron Technology Corp.
- Kuang-Ching Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 12,107,082
- Issue date Oct 1, 2024
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with stack-stack connection for connecting compon...
- Patent number 12,096,555
- Issue date Sep 17, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Broadband and low cost printed circuit board based 180° hybrid coup...
- Patent number 12,087,993
- Issue date Sep 10, 2024
- Outdoor Wireless Networks LLC
- Mohammad Vatankhah Varnoosfaderani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad structure
- Patent number 12,075,566
- Issue date Aug 27, 2024
- Innolux Corporation
- Yu-Ting Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of circuit board
- Patent number 12,052,815
- Issue date Jul 30, 2024
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked-layer board, electronic component module, and method of man...
- Patent number 12,052,821
- Issue date Jul 30, 2024
- Murata Manufacturing Co., Ltd.
- Takuya Goitsuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,048,095
- Issue date Jul 23, 2024
- LG Innotek Co., Ltd
- Min Young Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective soldering with photonic soldering technology
- Patent number 12,041,728
- Issue date Jul 16, 2024
- Apple Inc.
- Maryam Rahimi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Switched capacitor converter package structure and method
- Patent number 12,028,980
- Issue date Jul 2, 2024
- Halo Microelectronics International
- Rui Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded circuit board, electronic device, and fabrication method t...
- Patent number 12,016,115
- Issue date Jun 18, 2024
- SHENNAN CIRCUITS CO., LTD.
- Beilei Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer printed circuit board
- Patent number 12,016,119
- Issue date Jun 18, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Cheng-Jia Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,010,795
- Issue date Jun 11, 2024
- LG Innotek Co., Ltd
- Il Sik Nam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 11,997,788
- Issue date May 28, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sang Hoon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method of manufacturing wiring substrate
- Patent number 11,997,787
- Issue date May 28, 2024
- Shinko Electric Industries Co., Ltd.
- Hikaru Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 11,978,730
- Issue date May 7, 2024
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity printed circuit board for three-dimensional IC package
- Patent number 11,963,296
- Issue date Apr 16, 2024
- Google LLC
- Yuan Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Brushless DC motor power tool with combined PCB design
- Patent number 11,923,752
- Issue date Mar 5, 2024
- Milwaukee Electric Tool Corporation
- Matthew J. Mergener
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Circuit board with solder mask on internal copper pad
- Patent number 11,910,540
- Issue date Feb 20, 2024
- Pui Yin Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board having a battery mounted thereto
- Patent number 11,910,531
- Issue date Feb 20, 2024
- Ascensia Diabetes Care Holdings AG
- Igor Y. Gofman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for embedding and packaging multiple devices by layer and...
- Patent number 11,903,133
- Issue date Feb 13, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD
- Publication number 20240387344
- Publication date Nov 21, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Chi Hyeon JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240389229
- Publication date Nov 21, 2024
- InnoLux Corporation
- Yu-Ting LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CONTROL DEVICE
- Publication number 20240389228
- Publication date Nov 21, 2024
- Hitachi Astemo, Ltd.
- Akira ISHII
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE, CIRCUIT BOARD, AND MANUFACTURING METHOD FOR CIRC...
- Publication number 20240373553
- Publication date Nov 7, 2024
- Huawei Technologies Co., Ltd
- Xuanling Liang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240365468
- Publication date Oct 31, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE FOR ELECTRONIC CONTROL DEVICE, AND METHOD FOR MANU...
- Publication number 20240357736
- Publication date Oct 24, 2024
- Hitachi Astemo, Ltd.
- Takanori SEKIGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CURABLE ADHESIVE COMPOSITION, FILMY ADHESIVE, METHOD FOR PRODUCING...
- Publication number 20240352287
- Publication date Oct 24, 2024
- Resonac Corporation
- Masashi OHKOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240349430
- Publication date Oct 17, 2024
- IBIDEN CO., LTD.
- Kentaro WADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240334598
- Publication date Oct 3, 2024
- Shinko Electric Industries Co., Ltd.
- Yuki KOBAYASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240321715
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- HYEJIN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARDS AND SEMICONDUCTOR PACKAGES HAVING THE SAME
- Publication number 20240324094
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Okgyeong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20240314937
- Publication date Sep 19, 2024
- LG Innotek Co., Ltd.
- Hee Jung LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SPLIT PAD WITH TEST LINE
- Publication number 20240304503
- Publication date Sep 12, 2024
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240292534
- Publication date Aug 29, 2024
- LG Innotek Co., Ltd.
- Il Sik NAM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING WIRING SUBSTRATE
- Publication number 20240284593
- Publication date Aug 22, 2024
- Shinko Electric Industries Co., Ltd.
- Hikaru Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240284604
- Publication date Aug 22, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Myungju Gi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE
- Publication number 20240276651
- Publication date Aug 15, 2024
- Honor Device Co., Ltd.
- Jianqiang GUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240276643
- Publication date Aug 15, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Sang Hoon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240276642
- Publication date Aug 15, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Keesu Jeon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BIOCOMPATIBLE GLASS SUBSTRATE WITH THROUGH ELECTRODE AND BIOCOMPATI...
- Publication number 20240262738
- Publication date Aug 8, 2024
- Schott Japan Corporation
- Yutaka ONEZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20240260187
- Publication date Aug 1, 2024
- Shinko Electric Industries Co., Ltd.
- Hiroshi YOKOTA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR SURFACE MOUNT CONNECTIONS
- Publication number 20240243496
- Publication date Jul 18, 2024
- CIENA CORPORATION
- Russell Mays
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240234281
- Publication date Jul 11, 2024
- LG Innotek Co., Ltd.
- Hyun Sun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-HUNDRED OR THOUSAND CHANNEL ELECTRODE ELECTROPHYSIOLOGICAL AR...
- Publication number 20240226565
- Publication date Jul 11, 2024
- The Regents of the University of California
- Shadi A. Dayeh
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
THERMALLY IMPROVED PCB FOR SEMICONDUCTOR POWER DIE CONNECTED BY VIA...
- Publication number 20240237208
- Publication date Jul 11, 2024
- Mitsubishi Electric Corporation
- REMI PERRIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH FREQUENCY CIRCUIT
- Publication number 20240237192
- Publication date Jul 11, 2024
- Sumitomo Electric Industries, Ltd.
- Shun IGARASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
- Publication number 20240222350
- Publication date Jul 4, 2024
- Intel Corporation
- Russell K. MORTENSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20240215164
- Publication date Jun 27, 2024
- Shinko Electric Industries Co., Ltd.
- Kyota YAMAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION SUBSTRATE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME,...
- Publication number 20240213133
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Hyungjun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRUSHLESS DC MOTOR POWER TOOL WITH COMBINED PCB DESIGN
- Publication number 20240204615
- Publication date Jun 20, 2024
- Milwaukee Electric Tool Corporation
- Matthew J. Mergener
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS

Via provided in pad; Pad over filled via

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic package and manufacturing method thereof, and substrate...

Method and configuration for stacking multiple printed circuit boards

Compact oscillator device with a cavity resonator on a circuit board

Multilayer circuit board

Printed circuit board and method for manufacturing the same

Circuit structure and fabrication method thereof

Wiring substrate and semiconductor device

Electronic component embedded substrate

System and method for creating orthogonal solder interconnects

Circuit board structure and manufacturing method thereof

Offset interposers for large-bottom packages and large-die package-...

Component carrier with stack-stack connection for connecting compon...

Broadband and low cost printed circuit board based 180° hybrid coup...

Bonding pad structure

Manufacturing method of circuit board

Stacked-layer board, electronic component module, and method of man...

Circuit board

Selective soldering with photonic soldering technology

Switched capacitor converter package structure and method

Embedded circuit board, electronic device, and fabrication method t...

Method for manufacturing multilayer printed circuit board

Printed circuit board

Printed circuit board and method of manufacturing the same

Wiring substrate and method of manufacturing wiring substrate

Offset interposers for large-bottom packages and large-die package-...

Cavity printed circuit board for three-dimensional IC package

Brushless DC motor power tool with combined PCB design

Circuit board with solder mask on internal copper pad

Flexible printed circuit board having a battery mounted thereto

Structure for embedding and packaging multiple devices by layer and...

Patents Applicationslast 30 patents

CIRCUIT BOARD

ELECTRONIC DEVICE

ELECTRONIC CONTROL DEVICE

ELECTRONIC DEVICE, CIRCUIT BOARD, AND MANUFACTURING METHOD FOR CIRC...

WIRING SUBSTRATE

WIRING SUBSTRATE FOR ELECTRONIC CONTROL DEVICE, AND METHOD FOR MANU...

CURABLE ADHESIVE COMPOSITION, FILMY ADHESIVE, METHOD FOR PRODUCING...

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

WIRING SUBSTRATE

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

PRINTED CIRCUIT BOARDS AND SEMICONDUCTOR PACKAGES HAVING THE SAME

CIRCUIT BOARD

SPLIT PAD WITH TEST LINE

PRINTED CIRCUIT BOARD

WIRING SUBSTRATE AND METHOD OF MANUFACTURING WIRING SUBSTRATE

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

BIOCOMPATIBLE GLASS SUBSTRATE WITH THROUGH ELECTRODE AND BIOCOMPATI...

WIRING BOARD

METHOD AND APPARATUS FOR SURFACE MOUNT CONNECTIONS

SEMICONDUCTOR PACKAGE

MULTI-HUNDRED OR THOUSAND CHANNEL ELECTRODE ELECTROPHYSIOLOGICAL AR...

THERMALLY IMPROVED PCB FOR SEMICONDUCTOR POWER DIE CONNECTED BY VIA...

HIGH FREQUENCY CIRCUIT

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...

WIRING BOARD

REDISTRIBUTION SUBSTRATE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME,...

BRUSHLESS DC MOTOR POWER TOOL WITH COMBINED PCB DESIGN