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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME
    • Publication number 20240155760
    • Publication date May 9, 2024
    • Shinko Electric Industries Co., Ltd.
    • Yuji YUKIIRI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF, AND SUBSTRATE...
    • Publication number 20240145372
    • Publication date May 2, 2024
    • Siliconware Precision Industries Co., Ltd.
    • Chia-Wen TSAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HIGH FREQUENCY CIRCUIT
    • Publication number 20240138055
    • Publication date Apr 25, 2024
    • Sumitomo Electric Industries, Ltd.
    • Shun IGARASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240136267
    • Publication date Apr 25, 2024
    • LG Innotek Co., Ltd.
    • Hyun Sun LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTI-HUNDRED OR THOUSAND CHANNEL ELECTRODE ELECTROPHYSIOLOGICAL AR...
    • Publication number 20240131339
    • Publication date Apr 25, 2024
    • The Regents of the University of California
    • Shadi A. Dayeh
    • A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
  • Information Patent Application

    VERTICAL LAUNCHER FOR A PRINTED CIRCUIT BOARD
    • Publication number 20240121897
    • Publication date Apr 11, 2024
    • NXP B.V.
    • Abdellatif Zanati
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED WIRING BOARD AND MANUFACTURING METHOD FOR PRINTED WIRING BOARD
    • Publication number 20240121903
    • Publication date Apr 11, 2024
    • Kyocera Corporation
    • Atsuo KAWAGOE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    THERMOPLASTIC INTERPOSER
    • Publication number 20240121882
    • Publication date Apr 11, 2024
    • Meta Platforms Technologies, LLC
    • Brian Toleno
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20240114619
    • Publication date Apr 4, 2024
    • InnoLux Corporation
    • Cheng-Chi WANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20240114620
    • Publication date Apr 4, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Seung Min LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240107668
    • Publication date Mar 28, 2024
    • LG Innotek Co., Ltd.
    • Jinhak LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20240098896
    • Publication date Mar 21, 2024
    • PanelSemi Corporation
    • Chin-Tang LI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240098897
    • Publication date Mar 21, 2024
    • IBIDEN CO., LTD.
    • Yoshio MIZUTANI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    NESTED FILTERS
    • Publication number 20240090123
    • Publication date Mar 14, 2024
    • Skyworks Solutions, Inc.
    • Robert Francis DARVEAUX
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CLUSTERED MICROVIA STRUCTURE FOR A HIGH-DENSITY INTERFACE PCB
    • Publication number 20240074053
    • Publication date Feb 29, 2024
    • NVIDIA Corporation
    • Mingyi YU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND PACKAGE SUBSTRATE INCLUDING SAME
    • Publication number 20240055340
    • Publication date Feb 15, 2024
    • LG Innotek Co., Ltd.
    • Se Woong NA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    THROUGH BOARD VIA HEAT SINK
    • Publication number 20240057246
    • Publication date Feb 15, 2024
    • Aptiv Technologies Limited
    • Navneet GUPTA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD AND CONFIGURATION FOR STACKING MULTIPLE PRINTED CIRCUIT BOARDS
    • Publication number 20240049393
    • Publication date Feb 8, 2024
    • MELLANOX TECHNOLOGIES, LTD.
    • Xiuzhuang Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20240040697
    • Publication date Feb 1, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Jin Young Choi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    STACKED COMPONENT ARRAY STRUCTURE
    • Publication number 20240015887
    • Publication date Jan 11, 2024
    • Tesla, Inc.
    • Jin Zhao
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240008191
    • Publication date Jan 4, 2024
    • IBIDEN CO., LTD.
    • Toshiki FURUTANI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING CIRCUIT BOARD
    • Publication number 20240008178
    • Publication date Jan 4, 2024
    • Nitto Denko Corporation
    • Shusaku SHIBATA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
    • Publication number 20240006401
    • Publication date Jan 4, 2024
    • Intel Corporation
    • Russell K. MORTENSEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20230413425
    • Publication date Dec 21, 2023
    • LG Innotek Co., Ltd.
    • Myung Jae KWON
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20230413437
    • Publication date Dec 21, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • Kye Hwan LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
    • Publication number 20230403793
    • Publication date Dec 14, 2023
    • KYOCERA CORPORATION
    • Yuki TAKESHIMA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MANUFACTURING METHOD OF CIRCUIT BOARD
    • Publication number 20230389172
    • Publication date Nov 30, 2023
    • Unimicron Technology Corp.
    • Chih-Chiang Lu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20230380076
    • Publication date Nov 23, 2023
    • IBIDEN CO., LTD.
    • Masataka KATO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20230380055
    • Publication date Nov 23, 2023
    • IBIDEN CO., LTD.
    • Masataka KATO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FLEXIBLE ELECTRONIC STRUCTURES
    • Publication number 20230363092
    • Publication date Nov 9, 2023
    • X-CELEPRINT LIMITED
    • António José Marques Trindade
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR