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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    EDGE MOUNT MEMORY CONNECTOR WITH STAGGERED FOOTPRINT PINS
    • Publication number 20250063659
    • Publication date Feb 20, 2025
    • Intel Corporation
    • Landon HANKS
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    VIA AND PAD ARRANGEMENT FOR PRINTED CIRCUIT BOARD
    • Publication number 20250063658
    • Publication date Feb 20, 2025
    • Cisco Technology, Inc.
    • Mike Sapozhnikov
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20250056713
    • Publication date Feb 13, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Ho-Jae LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20250048557
    • Publication date Feb 6, 2025
    • LG Innotek Co., Ltd.
    • Soo Min LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER BOARD, MULTILAYER BOARD MODULE, AND ELECTRONIC DEVICE
    • Publication number 20250048533
    • Publication date Feb 6, 2025
    • Murata Manufacturing Co., Ltd.
    • Nobuo IKEMOTO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF, AND SUBSTRATE...
    • Publication number 20250038097
    • Publication date Jan 30, 2025
    • Siliconware Precision Industries Co., Ltd.
    • Chia-Wen TSAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PLATED VIA-IN-VIA VERTICAL CONNECTION
    • Publication number 20250031318
    • Publication date Jan 23, 2025
    • Nokia Solutions and Networks Oy
    • Paul BROWN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250024601
    • Publication date Jan 16, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Jin Uk Lee
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT STRUCTURE
    • Publication number 20250024608
    • Publication date Jan 16, 2025
    • Innolux Corporation
    • Yi Hung Lin
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD AND CONFIGURATION FOR STACKING MULTIPLE PRINTED CIRCUIT BOARDS
    • Publication number 20250024606
    • Publication date Jan 16, 2025
    • MELLANOX TECHNOLOGIES, LTD.
    • Xiuzhuang Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20250016921
    • Publication date Jan 9, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Sang Ho JEONG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING BOARD, IMAGE PICKUP UNIT, ENDOSCOPE, AND METHOD FOR MANUFACT...
    • Publication number 20250016922
    • Publication date Jan 9, 2025
    • OLYMPUS MEDICAL SYSTEMS CORP.
    • Toshiyuki SHIMIZU
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20240397620
    • Publication date Nov 28, 2024
    • InnoLux Corporation
    • Yuan-Lin WU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20240387344
    • Publication date Nov 21, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Chi Hyeon JEONG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20240389229
    • Publication date Nov 21, 2024
    • InnoLux Corporation
    • Yu-Ting LIU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC CONTROL DEVICE
    • Publication number 20240389228
    • Publication date Nov 21, 2024
    • Hitachi Astemo, Ltd.
    • Akira ISHII
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE, CIRCUIT BOARD, AND MANUFACTURING METHOD FOR CIRC...
    • Publication number 20240373553
    • Publication date Nov 7, 2024
    • Huawei Technologies Co., Ltd
    • Xuanling Liang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240365468
    • Publication date Oct 31, 2024
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE FOR ELECTRONIC CONTROL DEVICE, AND METHOD FOR MANU...
    • Publication number 20240357736
    • Publication date Oct 24, 2024
    • Hitachi Astemo, Ltd.
    • Takanori SEKIGUCHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CURABLE ADHESIVE COMPOSITION, FILMY ADHESIVE, METHOD FOR PRODUCING...
    • Publication number 20240352287
    • Publication date Oct 24, 2024
    • Resonac Corporation
    • Masashi OHKOSHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20240349430
    • Publication date Oct 17, 2024
    • IBIDEN CO., LTD.
    • Kentaro WADA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240334598
    • Publication date Oct 3, 2024
    • Shinko Electric Industries Co., Ltd.
    • Yuki KOBAYASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
    • Publication number 20240321715
    • Publication date Sep 26, 2024
    • Samsung Electronics Co., Ltd.
    • HYEJIN KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARDS AND SEMICONDUCTOR PACKAGES HAVING THE SAME
    • Publication number 20240324094
    • Publication date Sep 26, 2024
    • Samsung Electronics Co., Ltd.
    • Okgyeong Park
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20240314937
    • Publication date Sep 19, 2024
    • LG Innotek Co., Ltd.
    • Hee Jung LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SPLIT PAD WITH TEST LINE
    • Publication number 20240304503
    • Publication date Sep 12, 2024
    • QUALCOMM Incorporated
    • Aniket PATIL
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20240292534
    • Publication date Aug 29, 2024
    • LG Innotek Co., Ltd.
    • Il Sik NAM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE AND METHOD OF MANUFACTURING WIRING SUBSTRATE
    • Publication number 20240284593
    • Publication date Aug 22, 2024
    • Shinko Electric Industries Co., Ltd.
    • Hikaru Tanaka
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20240284604
    • Publication date Aug 22, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Myungju Gi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE
    • Publication number 20240276651
    • Publication date Aug 15, 2024
    • Honor Device Co., Ltd.
    • Jianqiang GUO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR