Visible light curing

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H01L2224/83871

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/83871Visible light curing

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device and method of transferring electronic element usi...
- Patent number 12,009,339
- Issue date Jun 11, 2024
- Seoul National University R&DB Foundation
- Yongtaek Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of transferring electronic element usi...
- Patent number 11,848,303
- Issue date Dec 19, 2023
- Seoul National University R&DB Foundation
- Yongtaek Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure
- Patent number 11,735,556
- Issue date Aug 22, 2023
- Mikuni Electron Corporation
- Sakae Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding tools for bonding machines, bonding machines for bonding se...
- Patent number 11,608,453
- Issue date Mar 21, 2023
- Kulicke and Soffa Industries, Inc.
- Urban Ernst
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Chip bonding method and bonding device
- Patent number 11,239,198
- Issue date Feb 1, 2022
- BOE Technology Group Co., Ltd.
- Lili Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a device fixed on a substrate with an a...
- Patent number 11,233,029
- Issue date Jan 25, 2022
- Mitsubishi Electric Corporation
- Kazuo Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level integration including design/co-design, structure proce...
- Patent number 11,201,138
- Issue date Dec 14, 2021
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure
- Patent number 11,133,279
- Issue date Sep 28, 2021
- Mikuni Electron Corporation
- Sakae Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure
- Patent number 10,804,235
- Issue date Oct 13, 2020
- Mikuni Electron Corporation
- Sakae Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro LED transferring method, micro LED display panel and micro LE...
- Patent number 10,741,739
- Issue date Aug 11, 2020
- Zeshang He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curing a heat-curable material in an embedded curing zone
- Patent number 10,717,236
- Issue date Jul 21, 2020
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Jeroen van den Brand
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Integrated circuit module and method of forming same
- Patent number 10,636,768
- Issue date Apr 28, 2020
- Starkey Laboratories, Inc.
- Sayed Kaysarbin Rahim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Connection structure and method for manufacturing connection structure
- Patent number 10,580,751
- Issue date Mar 3, 2020
- MIKUNI ELECTRON CORPORATION
- Sakae Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed assemblies of ultrathin, microscale inorganic light emittin...
- Patent number 10,546,841
- Issue date Jan 28, 2020
- The Board of Trustees of the University of Illinois
- John A. Rogers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure and method for manufacturing connection structure
- Patent number 10,529,681
- Issue date Jan 7, 2020
- MIKUNI ELECTRON CORPORATION
- Sakae Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and production method of the same
- Patent number 10,442,958
- Issue date Oct 15, 2019
- Dexerials Corporation
- Yuta Araki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Anisotropic conductive film, method for producing anisotropic condu...
- Patent number 10,373,926
- Issue date Aug 6, 2019
- Dexerials Corporation
- Kouichi Sato
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Laser assisted transfer welding process
- Patent number 10,181,483
- Issue date Jan 15, 2019
- Etienne Menard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor structure
- Patent number 10,163,734
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film, method for producing anisotropic condu...
- Patent number 9,960,139
- Issue date May 1, 2018
- Dexerials Corporation
- Kouichi Sato
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for bonding substrates
- Patent number 9,929,124
- Issue date Mar 27, 2018
- EV Group E. Thallner GmbH
- Jurgen Burggraf
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed assemblies of ultrathin, microscale inorganic light emittin...
- Patent number 9,647,171
- Issue date May 9, 2017
- The Board of Trustees of the University of Illinois
- John A. Rogers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabrication and testing of three-dimensional stacked int...
- Patent number 9,570,429
- Issue date Feb 14, 2017
- SHANGHAI JADIC OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Jianhong Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite substrate manufacturing method, semiconductor element man...
- Patent number 9,455,229
- Issue date Sep 27, 2016
- Namiki Seimitsu Houseki Kabushiki Kaisha
- Hideo Aida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip-chip assembly process comprising pre-coating interconnect elem...
- Patent number 9,406,662
- Issue date Aug 2, 2016
- Commisariat A l'Energie Atomique et Aux Energies Alternatives
- François Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser assisted transfer welding process
- Patent number 9,161,448
- Issue date Oct 13, 2015
- Semprius, Inc.
- Etienne Menard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 9,136,241
- Issue date Sep 15, 2015
- Yu-Lin Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting devices in substrate and device-mounting substra...
- Patent number 9,119,332
- Issue date Aug 25, 2015
- Sony Corporation
- Katsuhiro Tomoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically bonded arrays of transfer printed active components
- Patent number 9,049,797
- Issue date Jun 2, 2015
- Semprius, Inc.
- Etienne Menard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit packaging system with ultra-thin chip and method...
- Patent number 8,716,108
- Issue date May 6, 2014
- Stats Chippac Ltd.
- Hun Teak Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE AND METHOD OF TRANSFERRING ELECTRONIC ELEMENT USI...
- Publication number 20220271004
- Publication date Aug 25, 2022
- Seoul National University R&DB Foundation
- Yongtaek HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING ELECTRICAL INTERCONNECTIONS USING CAPILLARY MICROFLUIDICS
- Publication number 20220078918
- Publication date Mar 10, 2022
- 3M Innovative Properties Company
- Ankit Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF TRANSFERRING ELECTRONIC ELEMENT USI...
- Publication number 20220059496
- Publication date Feb 24, 2022
- Seoul National University R&DB Foundation
- Yongtaek HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE
- Publication number 20210398931
- Publication date Dec 23, 2021
- MIKUNI ELECTRON CORPORATION
- SAKAE TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE
- Publication number 20200343211
- Publication date Oct 29, 2020
- MIKUNI ELECTRON CORPORATION
- SAKAE TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...
- Publication number 20200126951
- Publication date Apr 23, 2020
- International Business Machines Corporation
- Bing DANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE
- Publication number 20200098718
- Publication date Mar 26, 2020
- Mikuni Electron Corporation
- SAKAE TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE
- Publication number 20190237424
- Publication date Aug 1, 2019
- Mikuni Electron Corporation
- SAKAE TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO LED TRANSFERRING METHOD, MICRO LED DISPLAY PANEL AND MICRO LE...
- Publication number 20190148611
- Publication date May 16, 2019
- SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
- Zeshang HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed Assemblies of Ultrathin, Microscale Inorganic Light Emittin...
- Publication number 20150132873
- Publication date May 14, 2015
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- John A. ROGERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE SUBSTRATE MANUFACTURING METHOD, SEMICONDUCTOR ELEMENT MAN...
- Publication number 20150076662
- Publication date Mar 19, 2015
- NAMIKI SEIMITSU HOUSEKI KABUSHIKIKAISHA
- Hideo Aida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ULTRA-THIN CHIP AND METHOD...
- Publication number 20130249117
- Publication date Sep 26, 2013
- Hun Teak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY BONDED ARRAYS OF TRANSFER PRINTED ACTIVE COMPONENTS
- Publication number 20130153277
- Publication date Jun 20, 2013
- Etienne Menard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SENSOR DEVICE AND METHOD OF PACKAGING SAME
- Publication number 20120306031
- Publication date Dec 6, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- G01 - MEASURING TESTING
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20120261809
- Publication date Oct 18, 2012
- Yu-Lin YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ASSISTED TRANSFER WELDING PROCESS
- Publication number 20120115262
- Publication date May 10, 2012
- Semprius, Inc.
- Etienne Menard
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD OF MOUNTING DEVICES IN SUBSTRATE AND DEVICE-MOUNTING SUBSTRA...
- Publication number 20110266039
- Publication date Nov 3, 2011
- SONY CORPORATION
- Katsuhiro TOMODA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ADHESIVE BONDING METHOD
- Publication number 20110198014
- Publication date Aug 18, 2011
- SAE MAGNETICS (H. K) LTD.
- Wingkeung Mak
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Printed Assemblies of Ultrathin, Microscale Inorganic Light Emittin...
- Publication number 20100317132
- Publication date Dec 16, 2010
- John A. Rogers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesive bonding method
- Publication number 20100200147
- Publication date Aug 12, 2010
- SAE MAGNETICS (H. K) LTD.
- Wingkeung Mak
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method and Device for the Permanent Connection of Integrated Circui...
- Publication number 20090283210
- Publication date Nov 19, 2009
- MUEHLBAUER AG
- Uwe Augst
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD OF SEMICONDUCTOR AND LAMINATED STRUCTURE FABRICATED...
- Publication number 20090072414
- Publication date Mar 19, 2009
- Hiroyuki TENMEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mounting method, electric part-mounted substrate and an electric de...
- Publication number 20090039291
- Publication date Feb 12, 2009
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Kazutaka Furuta
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Apparatus incorporating small-feature-size and large-feature-size c...
- Publication number 20070117274
- Publication date May 24, 2007
- Susan Swindlehurst
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method and device for attaching a chip in a housing
- Publication number 20070037317
- Publication date Feb 15, 2007
- Klaus Offterdinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus incorporating small-feature-size and large-feature-size c...
- Publication number 20040183182
- Publication date Sep 23, 2004
- Susan Swindlehurst
- G06 - COMPUTING CALCULATING COUNTING

Visible light curing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device and method of transferring electronic element usi...

Electronic device and method of transferring electronic element usi...

Connection structure

Bonding tools for bonding machines, bonding machines for bonding se...

Chip bonding method and bonding device

Semiconductor device having a device fixed on a substrate with an a...

Wafer level integration including design/co-design, structure proce...

Connection structure

Connection structure

Micro LED transferring method, micro LED display panel and micro LE...

Curing a heat-curable material in an embedded curing zone

Integrated circuit module and method of forming same

Connection structure and method for manufacturing connection structure

Printed assemblies of ultrathin, microscale inorganic light emittin...

Connection structure and method for manufacturing connection structure

Anisotropic conductive film and production method of the same

Anisotropic conductive film, method for producing anisotropic condu...

Laser assisted transfer welding process

Method for manufacturing semiconductor structure

Anisotropic conductive film, method for producing anisotropic condu...

Method for bonding substrates

Printed assemblies of ultrathin, microscale inorganic light emittin...

Methods of fabrication and testing of three-dimensional stacked int...

Composite substrate manufacturing method, semiconductor element man...

Flip-chip assembly process comprising pre-coating interconnect elem...

Laser assisted transfer welding process

Chip package and manufacturing method thereof

Method of mounting devices in substrate and device-mounting substra...

Electrically bonded arrays of transfer printed active components

Integrated circuit packaging system with ultra-thin chip and method...

Patents Applicationslast 30 patents

ELECTRONIC DEVICE AND METHOD OF TRANSFERRING ELECTRONIC ELEMENT USI...

FORMING ELECTRICAL INTERCONNECTIONS USING CAPILLARY MICROFLUIDICS

ELECTRONIC DEVICE AND METHOD OF TRANSFERRING ELECTRONIC ELEMENT USI...

CONNECTION STRUCTURE

CONNECTION STRUCTURE

WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...

CONNECTION STRUCTURE

CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE

MICRO LED TRANSFERRING METHOD, MICRO LED DISPLAY PANEL AND MICRO LE...

Printed Assemblies of Ultrathin, Microscale Inorganic Light Emittin...

COMPOSITE SUBSTRATE MANUFACTURING METHOD, SEMICONDUCTOR ELEMENT MAN...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ULTRA-THIN CHIP AND METHOD...

ELECTRICALLY BONDED ARRAYS OF TRANSFER PRINTED ACTIVE COMPONENTS

SEMICONDUCTOR SENSOR DEVICE AND METHOD OF PACKAGING SAME

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

LASER ASSISTED TRANSFER WELDING PROCESS

METHOD OF MOUNTING DEVICES IN SUBSTRATE AND DEVICE-MOUNTING SUBSTRA...

ADHESIVE BONDING METHOD

Printed Assemblies of Ultrathin, Microscale Inorganic Light Emittin...

Adhesive bonding method

Method and Device for the Permanent Connection of Integrated Circui...

BONDING METHOD OF SEMICONDUCTOR AND LAMINATED STRUCTURE FABRICATED...

Mounting method, electric part-mounted substrate and an electric de...

Apparatus incorporating small-feature-size and large-feature-size c...

Method and device for attaching a chip in a housing

Apparatus incorporating small-feature-size and large-feature-size c...