Premold housings are chip housings which are manufactured in molding methods by extrusion coating a carrier strip (in the following: lead frame) with plastic or a molding compound (based on epoxide resin, for example). These materials are identical in color to the standard molded housings thus manufactured (frequently: black, white, beige, etc.), so that the subsequent construction within the housing is not visible from the outside after completion.
Usually, chips which may not be completely extrusion-coated with plastic or molding compound because of their properties are mounted in premold housings. Because of non-transparent premold housings, these chips are mounted using an adhesive having a cross-linking mechanism based on the effect of heat.
The present invention relates to a method for attaching at least one chip in a housing which is optically transparent to radiation of at least one predefined transmission wavelength, in which an adhesive layer is applied between the chip and the housing and the adhesive layer is irradiated through the housing using radiation of the transmission wavelength for the purpose of curing.
The manufacturing method is thus made significantly easier in regard to the attachment.
In accordance with an advantageous embodiment of the present invention, the housing is a premold housing or plastic housing which is transparent to radiation in the visible range and/or in the ultraviolet range.
In accordance with an advantageous embodiment of the present invention, the adhesive layer is made of an adhesive which cures especially well under ultraviolet or visible light.
In accordance with an advantageous embodiment of the present invention, the radiation is light in the visible range or in the ultraviolet range.
In accordance with an advantageous embodiment of the present invention, the radiation comes from the side facing away from the chip and hits the adhesive layer. The radiation therefore does not have to pass through the chip first.
Furthermore, the present invention relates to a system including a chip in a housing which is optically transparent to radiation of at least one predefined transmission wavelength and an adhesive layer between the chip and the housing, the adhesive layer being cured via irradiation through the housing using radiation of the transmission wavelength.
A device according to an example embodiment of an example embodiment of the present invention for attaching at least one (e.g., micromechanical) chip in a housing which is optically transparent to radiation of at least one predefined transmission wavelength may include a radiation source which may be positioned in relation to the housing in such a way that an adhesive layer located between the chip and the housing is irradiated by the radiation source through the housing using radiation of the transmission wavelength for the purpose of curing.
Advantageous embodiments of the method according to the present invention are also expressed as advantageous embodiments of the device according to the present invention and the system according to the present invention and vice versa.
Multiple chips may also be mounted and/or attached in a premold housing using the method according to the present invention.
The following advantages may result because the material used for manufacturing premold housings and/or plastic housings is optically transparent (clear):
The present invention relates to optically transparent premold housings. Some possible advantages of optically transparent premold housings are described on the basis of a housing example. These are made of optically transparent plastic materials or optically transparent molding compounds.
The premold housing is manufactured from an optically transparent material (injectable plastics or optically clear molding compounds).
It is therefore possible to use UV-curing and light-curing adhesive systems and curing them via irradiation through the housing material. Many possible advantages of this adhesive technology are described above.
In
The same housing, additionally including a diepad 200, is illustrated in
Number | Date | Country | Kind |
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10348253.9 | Oct 2003 | DE | national |
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/DE04/02054 | 9/15/2004 | WO | 3/31/2006 |