Voltage converter

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H01L2924/14252

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/14252Voltage converter

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electrical devices and methods of manufacture
- Patent number 12,199,046
- Issue date Jan 14, 2025
- Faraday Semi, Inc.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,961,828
- Issue date Apr 16, 2024
- Denso Corporation
- Nobuyuki Katoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 11,929,354
- Issue date Mar 12, 2024
- Fuji Electric Co., Ltd.
- Masanari Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module apparatus, cooling structure, and electric vehicle or...
- Patent number 11,854,937
- Issue date Dec 26, 2023
- Rohm Co., Ltd.
- Katsuhiko Yoshihara
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device, power conversion device, and method for manuf...
- Patent number 11,830,795
- Issue date Nov 28, 2023
- Mitsubishi Electric Corporation
- Yuji Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,776,936
- Issue date Oct 3, 2023
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated half-bridge power converter
- Patent number 11,715,720
- Issue date Aug 1, 2023
- NAVITAS SEMICONDUCTOR LIMITED
- Daniel M. Kinzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,705,438
- Issue date Jul 18, 2023
- Kabushiki Kaisha Toshiba
- Tatsuya Hirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a lead frame including die paddles and...
- Patent number 11,688,671
- Issue date Jun 27, 2023
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL, LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor having double-sided substrate
- Patent number 11,631,627
- Issue date Apr 18, 2023
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical devices and methods of manufacture
- Patent number 11,621,230
- Issue date Apr 4, 2023
- Faraday Semi, Inc.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Peripheral inductors
- Patent number 11,616,014
- Issue date Mar 28, 2023
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,610,873
- Issue date Mar 21, 2023
- Mitsubishi Electric Corporation
- Ryo Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module arrangement
- Patent number 11,538,725
- Issue date Dec 27, 2022
- Infineon Technologies AG
- Daniel Domes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus, power module and power supply
- Patent number 11,387,160
- Issue date Jul 12, 2022
- Rohm Co., Ltd.
- Keisuke Wakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,380,656
- Issue date Jul 5, 2022
- Denso Corporation
- Hiroshi Ishino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having conductive structures with differ...
- Patent number 11,380,609
- Issue date Jul 5, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and power conversion device
- Patent number 11,257,768
- Issue date Feb 22, 2022
- Mitsubishi Electric Corporation
- Yuji Imoto
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device
- Patent number 11,233,037
- Issue date Jan 25, 2022
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module with a groove and press hole on the surface of a...
- Patent number 11,227,810
- Issue date Jan 18, 2022
- Shindengen Electric Manufacturing Co., Ltd.
- Yoshihiro Kamiyama
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Power module and method of manufacturing same
- Patent number 11,227,845
- Issue date Jan 18, 2022
- Hyundai Motor Company
- Hyun Koo Lee
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device
- Patent number 11,171,122
- Issue date Nov 9, 2021
- Fuji Electric Co., Ltd.
- Shunta Horie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated package device for high-voltage silico...
- Patent number 11,158,609
- Issue date Oct 26, 2021
- Xi'an Jiaotong University
- Laili Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power module semiconductor package with multiple submodules
- Patent number 11,127,651
- Issue date Sep 21, 2021
- Semiconductor Components Industries, LLC
- Jie Chang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Power conversion device for reducing an inductance difference betwe...
- Patent number 11,127,695
- Issue date Sep 21, 2021
- Hitachi Automotive Systems, Ltd.
- Akihiro Namba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 11,127,671
- Issue date Sep 21, 2021
- ABB Power Grids Switzerland AG
- Samuel Hartmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including low side field-effect transistors a...
- Patent number 11,094,617
- Issue date Aug 17, 2021
- ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN), LTD
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical devices and methods of manufacture
- Patent number 11,069,624
- Issue date Jul 20, 2021
- Faraday Semi, Inc.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and power conversion device
- Patent number 11,063,025
- Issue date Jul 13, 2021
- Mitsubishi Electric Corporation
- Junichi Nakashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,056,415
- Issue date Jul 6, 2021
- HITACHI AUTOMOTIVE SYSTEMS, LTD.
- Masami Oonishi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
PACKAGED INTEGRATED CIRCUIT, BIDIRECTIONAL DATA TRANSMISSION METHOD...
- Publication number 20250029958
- Publication date Jan 23, 2025
- NUVOTON TECHNOLOGY CORPORATION
- Chih-Hsien YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20240312878
- Publication date Sep 19, 2024
- ROHM CO., LTD.
- Hiroaki AOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240243100
- Publication date Jul 18, 2024
- ROHM CO., LTD.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED 3D CACHE CONFIGURATION WITH ON-CHIP POWER SUPPORT
- Publication number 20240162192
- Publication date May 16, 2024
- International Business Machines Corporation
- Arvind Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE AND ELECTRONIC APPARATUS
- Publication number 20240128193
- Publication date Apr 18, 2024
- Advanced Semiconductor Engineering, Inc.
- Pao-Nan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240071900
- Publication date Feb 29, 2024
- Fuji Electric Co., Ltd.
- Katsumi TANIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240055360
- Publication date Feb 15, 2024
- FARADAY SEMI, INC.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATED POWER CHIP BASED ON WAFER LEVEL PACKAGING AND METHOD OF MA...
- Publication number 20240014126
- Publication date Jan 11, 2024
- UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
- Lin CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH MULTIPLE DIES
- Publication number 20230420380
- Publication date Dec 28, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230402432
- Publication date Dec 14, 2023
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC COMPRISING SEMICONDUCTOR SUBSTRATES WITH DIFFERENT BANDGAPS
- Publication number 20230326890
- Publication date Oct 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING DIES AND AN INTERCONNECT COUPLED TO THE...
- Publication number 20230307405
- Publication date Sep 28, 2023
- ADVANCED MICRO DEVICES, INC.
- Lei Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING CONDUCTIVE STRUCTURES WITH DIFFER...
- Publication number 20220278038
- Publication date Sep 1, 2022
- Intel Corporation
- Ji Yong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD FOR MANUF...
- Publication number 20220230945
- Publication date Jul 21, 2022
- Mitsubishi Electric Corporation
- Yuji SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220108977
- Publication date Apr 7, 2022
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220093572
- Publication date Mar 24, 2022
- Kabushiki Kaisha Toshiba
- Tatsuya HIRAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL DEVICES AND METHODS OF MANUFACTURE
- Publication number 20220068823
- Publication date Mar 3, 2022
- FARADAY SEMI, INC.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220020730
- Publication date Jan 20, 2022
- DENSO CORPORATION
- NOBUYUKI KATOH
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME
- Publication number 20210343630
- Publication date Nov 4, 2021
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR HAVING DOUBLE-SIDED SUBSTRATE
- Publication number 20210335691
- Publication date Oct 28, 2021
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210249389
- Publication date Aug 12, 2021
- Mitsubishi Electric Corporation
- Ryo GOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20210242179
- Publication date Aug 5, 2021
- Fuji Electric Co., Ltd.
- Masanari FUJII
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210134762
- Publication date May 6, 2021
- Rohm Co., Ltd.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Module Arrangement
- Publication number 20210028078
- Publication date Jan 28, 2021
- Daniel Domes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT ARRANGEMENT HAVING A SPACER ELEMENT, CONVERTER AND AIRCRAFT...
- Publication number 20210021179
- Publication date Jan 21, 2021
- Rene Blank
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME
- Publication number 20200411422
- Publication date Dec 31, 2020
- Alpha and Omega Semiconductor (Cayman), Ltd
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200395344
- Publication date Dec 17, 2020
- Fuji Electric Co., Ltd.
- Shunta HORIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED PACKAGE DEVICE FOR HIGH-VOLTAGE SILICO...
- Publication number 20200388595
- Publication date Dec 10, 2020
- XI'AN JIAOTONG UNIVERSITY
- Laili WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PERIPHERAL INDUCTORS
- Publication number 20200365510
- Publication date Nov 19, 2020
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE
- Publication number 20200335412
- Publication date Oct 22, 2020
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Yoshihiro KAMIYAMA
- H01 - BASIC ELECTRIC ELEMENTS

Voltage converter

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electrical devices and methods of manufacture

Semiconductor device

Power semiconductor module

Power module apparatus, cooling structure, and electric vehicle or...

Semiconductor device, power conversion device, and method for manuf...

Semiconductor device

Integrated half-bridge power converter

Semiconductor device

Semiconductor package having a lead frame including die paddles and...

Method of manufacturing semiconductor having double-sided substrate

Electrical devices and methods of manufacture

Peripheral inductors

Semiconductor device and method of manufacturing semiconductor device

Semiconductor module arrangement

Semiconductor apparatus, power module and power supply

Semiconductor device

Microelectronic assemblies having conductive structures with differ...

Semiconductor device and power conversion device

Semiconductor device

Electronic module with a groove and press hole on the surface of a...

Power module and method of manufacturing same

Semiconductor device

Three-dimensional integrated package device for high-voltage silico...

High power module semiconductor package with multiple submodules

Power conversion device for reducing an inductance difference betwe...

Power semiconductor module

Semiconductor package including low side field-effect transistors a...

Electrical devices and methods of manufacture

Semiconductor module and power conversion device

Semiconductor device

Patents Applicationslast 30 patents

PACKAGED INTEGRATED CIRCUIT, BIDIRECTIONAL DATA TRANSMISSION METHOD...

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

STACKED 3D CACHE CONFIGURATION WITH ON-CHIP POWER SUPPORT

ELECTRONIC MODULE AND ELECTRONIC APPARATUS

SEMICONDUCTOR DEVICE

ELECTRICAL DEVICES AND METHODS OF MANUFACTURE

ISOLATED POWER CHIP BASED ON WAFER LEVEL PACKAGING AND METHOD OF MA...

SEMICONDUCTOR DEVICE WITH MULTIPLE DIES

SEMICONDUCTOR DEVICE

3D IC COMPRISING SEMICONDUCTOR SUBSTRATES WITH DIFFERENT BANDGAPS

ELECTRONIC DEVICE INCLUDING DIES AND AN INTERCONNECT COUPLED TO THE...

MICROELECTRONIC ASSEMBLIES HAVING CONDUCTIVE STRUCTURES WITH DIFFER...

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD FOR MANUF...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

ELECTRICAL DEVICES AND METHODS OF MANUFACTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR HAVING DOUBLE-SIDED SUBSTRATE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE

Semiconductor Module Arrangement

CIRCUIT ARRANGEMENT HAVING A SPACER ELEMENT, CONVERTER AND AIRCRAFT...

SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME

SEMICONDUCTOR DEVICE

THREE-DIMENSIONAL INTEGRATED PACKAGE DEVICE FOR HIGH-VOLTAGE SILICO...

PERIPHERAL INDUCTORS

ELECTRONIC MODULE