Waveguides

Industry

CPC
H01L2223/6627

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00

Current Industry

H01L2223/6627Waveguides

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 12,148,980
- Issue date Nov 19, 2024
- Advanced Semiconductor Engineering, Inc.
- Christophe Zinck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Platforms including microelectronic packages therein coupled to a c...
- Patent number 12,150,271
- Issue date Nov 19, 2024
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanowire-based integrated via in anodic aluminum oxide layer for CM...
- Patent number 12,142,805
- Issue date Nov 12, 2024
- Regents of The University of Minnesota
- Rhonda Franklin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wilkinson divider
- Patent number 12,142,808
- Issue date Nov 12, 2024
- Teknologian tutkimuskeskus VTT Oy
- Mikko Varonen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tunable coupler with coupling extension
- Patent number 12,131,225
- Issue date Oct 29, 2024
- IQM Finland Oy
- Johannes Heinsoo
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method and epitaxial oxide device with impact ionization
- Patent number 12,125,946
- Issue date Oct 22, 2024
- SILANNA UV TECHNOLOGIES PTE LTD
- Petar Atanackovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Channelized filter using semiconductor fabrication
- Patent number 12,119,313
- Issue date Oct 15, 2024
- Northrop Grumman Systems Corporation
- Dah-Weih Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-stripline with crosstalk cancellation
- Patent number 12,113,265
- Issue date Oct 8, 2024
- Intel Corporation
- Albert Sutono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmission line structures for three-dimensional integrated circu...
- Patent number 12,100,675
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Ying Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesion layer for forming nanowires in anodic aluminum oxide layer
- Patent number 12,100,879
- Issue date Sep 24, 2024
- Regents of the University of Minnesota and Board of Regents
- Bethanie Joyce Hills Stadler
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device capable of realizing a wide band impedance mat...
- Patent number 12,094,840
- Issue date Sep 17, 2024
- Sumitomo Electric Device Innovations, Inc.
- Masahiro Hirayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxial oxide device with impact ionization
- Patent number 12,095,006
- Issue date Sep 17, 2024
- SILANNA UV TECHNOLOGIES PTE LTD
- Petar Atanackovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-chip diplexed multi-band submillimeter-wave/terahertz sources
- Patent number 12,087,867
- Issue date Sep 10, 2024
- California Institute of Technology
- Jose Vicente Siles Perez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microstructure enhanced absorption photosensitive devices
- Patent number 12,087,871
- Issue date Sep 10, 2024
- W&W Sens Devices, Inc.
- Shih-Yuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxial oxide materials, structures, and devices
- Patent number 12,087,880
- Issue date Sep 10, 2024
- SILANNA UV TECHNOLOGIES PTE LTD
- Petar Atanackovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic multi-I region diode limiters
- Patent number 12,080,708
- Issue date Sep 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- James Joseph Brogle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structures with antenna elements and IC chips employing...
- Patent number 12,080,661
- Issue date Sep 3, 2024
- Viasat, Inc.
- Steven J. Franson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doherty amplifier
- Patent number 12,081,174
- Issue date Sep 3, 2024
- Mitsubishi Electric Corporation
- Katsuya Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with integrated waveguide launcher
- Patent number 12,074,124
- Issue date Aug 27, 2024
- NXP B.V.
- Abdellatif Zanati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid integrated circuit package
- Patent number 12,068,297
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency integrated circuit
- Patent number 12,040,290
- Issue date Jul 16, 2024
- National Tsing Hua University
- Rachit Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 12,027,465
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of additively manufacturing an integrated circuit of an inte...
- Patent number 12,027,477
- Issue date Jul 2, 2024
- Board of Trustees of Michigan State University
- Ioannis Papapolymerou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Components for millimeter-wave communication
- Patent number 12,021,289
- Issue date Jun 25, 2024
- Intel Corporation
- Diego Correas-Serrano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,014,992
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnection and wiring layers, package structures,...
- Patent number 12,015,003
- Issue date Jun 18, 2024
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package system and package
- Patent number 12,009,321
- Issue date Jun 11, 2024
- Intel Corporation
- Zhen Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power combiner/splitter for millimetre wave applications
- Patent number 12,009,565
- Issue date Jun 11, 2024
- NXP B.V.
- Olivier Tesson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 11,984,439
- Issue date May 14, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor package transmission lines with mic...
- Patent number 11,978,712
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Transmission Line Structures for Three-Dimensional Integrated Circu...
- Publication number 20240379592
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Ying Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL OXIDE MATERIALS, STRUCTURES, AND DEVICES
- Publication number 20240372035
- Publication date Nov 7, 2024
- Silanna UV Technologies Pte Ltd
- Petar Atanackovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID INTEGRATED CIRCUIT PACKAGES
- Publication number 20240363610
- Publication date Oct 31, 2024
- Taiwan Semiconductor Mamufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTROMAGNETIC WAVE DEVICE
- Publication number 20240332226
- Publication date Oct 3, 2024
- ROHM CO., LTD.
- Yosuke NISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240304561
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL OXIDE TRANSISTOR
- Publication number 20240266469
- Publication date Aug 8, 2024
- Silanna UV Technologies Pte Ltd
- Petar Atanackovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL OXIDE TRANSISTOR
- Publication number 20240258460
- Publication date Aug 1, 2024
- Silanna UV Technologies Pte Ltd
- Petar Atanackovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20240258296
- Publication date Aug 1, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE WITH HIGH PEAK BANDWIDTH I/O CHANNELS
- Publication number 20240223283
- Publication date Jul 4, 2024
- L. Pierre de Rochemont
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES
- Publication number 20240222307
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFICATION HIGH-FREQUENCY CIRCUIT DEVICE
- Publication number 20240213189
- Publication date Jun 27, 2024
- Mitsubishi Electric Corporation
- Yuta SUGIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALLIUM NITRIDE (GAN) DEVICES WITH THROUGH-SILICON VIAS
- Publication number 20240213118
- Publication date Jun 27, 2024
- Intel Corporation
- Han Wui THEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMPLIFIER MODULES AND SYSTEMS WITH GROUND TERMINALS ADJACENT TO POW...
- Publication number 20240203912
- Publication date Jun 20, 2024
- NXP USA, Inc.
- Jeffrey Spencer Roberts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240194618
- Publication date Jun 13, 2024
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- HUI DONG LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240194619
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL OXIDE TRANSISTOR
- Publication number 20240170612
- Publication date May 23, 2024
- Silanna UV Technologies Pte Ltd
- Petar Atanackovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION
- Publication number 20240162172
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND ELECTRONIC APPARATUS
- Publication number 20240145415
- Publication date May 2, 2024
- PanelSemi Corporation
- HSIEN-TE CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE PACKAGE INCLUDING INDUCTOR AND SEMICONDUCTOR...
- Publication number 20240120297
- Publication date Apr 11, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE WITH OPEN AIR GAP STRUCTURES
- Publication number 20240113049
- Publication date Apr 4, 2024
- Intel Corporation
- Kristof Kuwawi Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH DIRECTIONAL ANTENNAS
- Publication number 20240113050
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Juan Herbsommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER
- Publication number 20240113006
- Publication date Apr 4, 2024
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SUPPORTS WITH MICROSTRIPS
- Publication number 20240088069
- Publication date Mar 14, 2024
- Intel Corporation
- Wenzhi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL OXIDE MATERIALS, STRUCTURES, AND DEVICES
- Publication number 20240072205
- Publication date Feb 29, 2024
- Silanna UV Technologies Pte Ltd
- Petar Atanackovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL OXIDE MATERIALS, STRUCTURES, AND DEVICES
- Publication number 20240055560
- Publication date Feb 15, 2024
- Silanna UV Technologies Pte Ltd
- Petar Atanackovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHANNELIZED FILTER USING SEMICONDUCTOR FABRICATION
- Publication number 20240047388
- Publication date Feb 8, 2024
- Northrop Grumman Systems Corporation
- Dah-Weih Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR ADJUSTING PHASE CHARACTERISTICS...
- Publication number 20240014150
- Publication date Jan 11, 2024
- Kabushiki Kaisha Toshiba
- Koji TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, BASE STATION, MOBILE DEVICE AND METHOD FOR F...
- Publication number 20240006350
- Publication date Jan 4, 2024
- Intel Corporation
- Ellis NEASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURE
- Publication number 20230420553
- Publication date Dec 28, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- En-Shuo LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC WAVEGUIDING THROUGH LIQUID COOLING CONDUIT
- Publication number 20230420394
- Publication date Dec 28, 2023
- International Business Machines Corporation
- Anil Yuksel
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device package and method of manufacturing the same

Platforms including microelectronic packages therein coupled to a c...

Nanowire-based integrated via in anodic aluminum oxide layer for CM...

Wilkinson divider

Tunable coupler with coupling extension

Method and epitaxial oxide device with impact ionization

Channelized filter using semiconductor fabrication

Dual-stripline with crosstalk cancellation

Transmission line structures for three-dimensional integrated circu...

Adhesion layer for forming nanowires in anodic aluminum oxide layer

Semiconductor device capable of realizing a wide band impedance mat...

Epitaxial oxide device with impact ionization

On-chip diplexed multi-band submillimeter-wave/terahertz sources

Microstructure enhanced absorption photosensitive devices

Epitaxial oxide materials, structures, and devices

Monolithic multi-I region diode limiters

Integrated structures with antenna elements and IC chips employing...

Doherty amplifier

Integrated circuit package with integrated waveguide launcher

Hybrid integrated circuit package

Radio frequency integrated circuit

Impedance controlled electrical interconnection employing meta-mate...

Method of additively manufacturing an integrated circuit of an inte...

Components for millimeter-wave communication

Semiconductor package

High density interconnection and wiring layers, package structures,...

Package system and package

Power combiner/splitter for millimetre wave applications

Microelectronic assemblies

Method of forming semiconductor package transmission lines with mic...

Patents Applicationslast 30 patents

Transmission Line Structures for Three-Dimensional Integrated Circu...

EPITAXIAL OXIDE MATERIALS, STRUCTURES, AND DEVICES

HYBRID INTEGRATED CIRCUIT PACKAGES

SEMICONDUCTOR DEVICE AND ELECTROMAGNETIC WAVE DEVICE

SEMICONDUCTOR PACKAGE

EPITAXIAL OXIDE TRANSISTOR

EPITAXIAL OXIDE TRANSISTOR

MICROELECTRONIC ASSEMBLIES

MODULE WITH HIGH PEAK BANDWIDTH I/O CHANNELS

INTEGRATED CIRCUIT PACKAGES

POWER AMPLIFICATION HIGH-FREQUENCY CIRCUIT DEVICE

GALLIUM NITRIDE (GAN) DEVICES WITH THROUGH-SILICON VIAS

AMPLIFIER MODULES AND SYSTEMS WITH GROUND TERMINALS ADJACENT TO POW...

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

EPITAXIAL OXIDE TRANSISTOR

SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION

ELECTRONIC DEVICE AND ELECTRONIC APPARATUS

MICROELECTRONIC DEVICE PACKAGE INCLUDING INDUCTOR AND SEMICONDUCTOR...

PACKAGE SUBSTRATE WITH OPEN AIR GAP STRUCTURES

SEMICONDUCTOR PACKAGES WITH DIRECTIONAL ANTENNAS

PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER

INTEGRATED CIRCUIT SUPPORTS WITH MICROSTRIPS

EPITAXIAL OXIDE MATERIALS, STRUCTURES, AND DEVICES

EPITAXIAL OXIDE MATERIALS, STRUCTURES, AND DEVICES

CHANNELIZED FILTER USING SEMICONDUCTOR FABRICATION

SEMICONDUCTOR DEVICE AND METHOD FOR ADJUSTING PHASE CHARACTERISTICS...

SEMICONDUCTOR PACKAGE, BASE STATION, MOBILE DEVICE AND METHOD FOR F...

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURE

ELECTROMAGNETIC WAVEGUIDING THROUGH LIQUID COOLING CONDUIT