Wedge bonds

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H01L2224/49425

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/49425Wedge bonds

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 8,482,112
- Issue date Jul 9, 2013
- Marvell International Ltd.
- Shiann-Ming Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system having interconnect stack and ext...
- Patent number 8,138,080
- Issue date Mar 20, 2012
- Stats Chippac Ltd.
- Dario S. Filoteo, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 8,132,709
- Issue date Mar 13, 2012
- Nichia Corporation
- Tadao Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 8,022,522
- Issue date Sep 20, 2011
- Marvell International Ltd.
- Shiann-Ming Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method
- Patent number 7,934,634
- Issue date May 3, 2011
- Kabushiki Kaisha Shinkawa
- Tatsunari Mii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Double density method for wirebond interconnect
- Patent number 7,655,552
- Issue date Feb 2, 2010
- Texas Instruments Incorporated
- Mark Allen Gerber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,528,011
- Issue date May 5, 2009
- Sharp Kabushiki Kaisha
- Yuji Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,276,437
- Issue date Oct 2, 2007
- Sharp Kabushiki Kaisha
- Yuji Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double density method for wirebond interconnect
- Patent number 7,078,808
- Issue date Jul 18, 2006
- Texas Instruments Incorporated
- Mark Allen Gerber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3310858
- Patent number 3,310,858
- Issue date Mar 28, 1967
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20110151622
- Publication date Jun 23, 2011
- Panasonic Corporation
- Akira Oga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION DEVICE BEWTEEN TRANSISTOR AND LEAD FRAME
- Publication number 20110049692
- Publication date Mar 3, 2011
- Great Team Backend Foundry, Inc.
- Chung Hsing Tzu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonding method
- Publication number 20090194577
- Publication date Aug 6, 2009
- KABUSHIKI KAISHA SHINKAWA
- Tatsunari Mii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20080246129
- Publication date Oct 9, 2008
- Matsushita Electric Industrial Co., Ltd.
- Akira Oga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor and Method For Producing the Same
- Publication number 20080185740
- Publication date Aug 7, 2008
- INFINEON TECHNOLOGIES AG
- Xaver Schloegel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20080116591
- Publication date May 22, 2008
- Nichia Corporation.
- Tadao Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20070232054
- Publication date Oct 4, 2007
- Sharp Kabushiki Kaisha
- Yuji Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM
- Publication number 20070210436
- Publication date Sep 13, 2007
- STATS ChipPAC Ltd.
- Dario S. Filoteo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Double density method for wirebond interconnect
- Publication number 20060208359
- Publication date Sep 21, 2006
- Mark Allen Gerber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonding method
- Publication number 20060175383
- Publication date Aug 10, 2006
- KABUSHIKI KAISHA SHINKAWA
- Tatsunari Mii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Double density method for wirebond interconnect
- Publication number 20050258538
- Publication date Nov 24, 2005
- TEXAS INSTRUMENTS INCORPORATED
- Mark Allen Gerber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20050148175
- Publication date Jul 7, 2005
- Sharp Kabushiki Kaisha
- Yuji Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20020158325
- Publication date Oct 31, 2002
- Sharp Kabushiki Kaisha
- Yuji Yano
- H01 - BASIC ELECTRIC ELEMENTS

Wedge bonds

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package

Integrated circuit package system having interconnect stack and ext...

Semiconductor device and method for manufacturing same

Semiconductor package

Wire bonding method

Double density method for wirebond interconnect

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Double density method for wirebond interconnect

3310858

Patents Applicationslast 30 patents

Method of manufacturing semiconductor device

CONNECTION DEVICE BEWTEEN TRANSISTOR AND LEAD FRAME

Wire bonding method

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Semiconductor and Method For Producing the Same

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Semiconductor device and manufacturing method thereof

INTEGRATED CIRCUIT PACKAGE SYSTEM

Double density method for wirebond interconnect

Wire bonding method

Double density method for wirebond interconnect

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof