3310858

Information

• Patent Grant
• 3310858

• References
• Source

• Patent Number

  3,310,858

• Date Filed

  Not available

• Date Issued

  Tuesday, March 28, 1967
  57 years ago

• CPC

  • H01L24/85 - using a wire connector
  • H01L21/288 - from a liquid
  • H01L23/047 - the other leads being parallel to the base
  • H01L24/48 - of an individual wire connector
  • H01L24/49 - of a plurality of wire connectors
  • H01L29/00 - Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier
  • H01L24/45 - of an individual wire connector
  • H01L2224/45015 - being circular
  • H01L2224/45144 - Gold (Au) as principal constituent
  • H01L2224/45164 - Palladium (Pd) as principal constituent
  • H01L2224/45647 - Copper (Cu) as principal constituent
  • H01L2224/48091 - Arched
  • H01L2224/48472 - the other connecting portion not on the bonding area also being a wedge bond
  • H01L2224/48599 - Principal constituent of the connecting portion of the wire connector being Gold (Au)
  • H01L2224/4911 - the connectors being bonded to at least one common bonding area
  • H01L2224/49425 - Wedge bonds
  • H01L2224/85 - using a wire connector
  • H01L2224/85203 - Thermocompression bonding
  • H01L2924/00014 - the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
  • H01L2924/01006 - Carbon [C]
  • H01L2924/01014 - Silicon [Si]
  • H01L2924/01028 - Nickel [Ni]
  • H01L2924/01029 - Copper [Cu]
  • H01L2924/01033 - Arsenic [As]
  • H01L2924/01042 - Molybdenum [Mo]
  • H01L2924/01047 - Silver [Ag]
  • H01L2924/01078 - Platinum [Pt]
  • H01L2924/01079 - Gold [Au]
  • H01L2924/01082 - Lead [Pb]
  • H01L2924/10253 - Silicon [Si]
  • H01L2924/19107 - off-chip wires
  • Y10S228/904 - Wire bonding
  • Y10T29/49179 - by metal fusion bonding

• US Classifications

  • 228 - Metal fusion bonding
  • 029 - Metal working
  • 257 - Active solid-state devices
  • 438 - Semiconductor device manufacturing: process