wherein only contours around conductors are removed for insulation

Industry

CPC
H05K2201/09363

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09363wherein only contours around conductors are removed for insulation

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method and device for a high temperature vacuum-safe solder resist...
- Patent number 11,135,669
- Issue date Oct 5, 2021
- Cree, Inc.
- Jennifer Stabach
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resource allocation for traffic-profile-dependent scheduling request
- Patent number 10,708,807
- Issue date Jul 7, 2020
- QUALCOMM Incorporated
- Chong Li
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electro-optic display backplane structure with drive components and...
- Patent number 10,317,767
- Issue date Jun 11, 2019
- E Ink Corporation
- Richard J. Paolini
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pattern safety device for preventing interference between patterns
- Patent number 10,285,262
- Issue date May 7, 2019
- G-SMATT CO., LTD.
- Ho Joon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board
- Patent number 10,129,978
- Issue date Nov 13, 2018
- Fujikura Ltd.
- Yuki Ishida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Collective lamination substrate forming pseudo waveguide
- Patent number 10,122,088
- Issue date Nov 6, 2018
- DENSO CORPORATION
- Kazuhiro Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for a high temperature vacuum-safe solder stop ut...
- Patent number 10,076,800
- Issue date Sep 18, 2018
- Cree Fayetteville, Inc.
- Jennifer Stabach
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting device
- Patent number 9,590,152
- Issue date Mar 7, 2017
- Nichia Corporation
- Motokazu Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate having a circuit pattern and method for making th...
- Patent number 9,474,161
- Issue date Oct 18, 2016
- Taiwan Green Point Enterprises Co., Ltd.
- Sheng-Hung Yi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for partially stripping a defined area of a conductive layer
- Patent number 9,414,499
- Issue date Aug 9, 2016
- LPKF Laser & Electronics AG
- Jan van Aalst
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light-emitting device
- Patent number 9,391,242
- Issue date Jul 12, 2016
- Sharp Kabushiki Kaisha
- Toshio Hata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Motherboard with electrostatic discharge protection function
- Patent number 9,313,879
- Issue date Apr 12, 2016
- Wistron Corp.
- Lung-Fai Tuen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting device
- Patent number 9,209,364
- Issue date Dec 8, 2015
- Nichia Corporation
- Motokazu Yamada
- F21 - LIGHTING
Information Patent Grant
Organic light emitting diode and circuit board for control thereof
- Patent number 9,054,333
- Issue date Jun 9, 2015
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Jan Hesse
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High frequency wiring board comprised of interconnected first and s...
- Patent number 9,019,035
- Issue date Apr 28, 2015
- NEC Corporation
- Risato Ohhira
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting device
- Patent number 8,916,903
- Issue date Dec 23, 2014
- Nichia Corporation
- Motokazu Yamada
- F21 - LIGHTING
Information Patent Grant
Circuit board and method of manufacturing the same
- Patent number 8,338,716
- Issue date Dec 25, 2012
- Panasonic Corporation
- Youichiro Nakahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board reliably achieving electric connection with el...
- Patent number 8,305,767
- Issue date Nov 6, 2012
- Fujitsu Limited
- Naoki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit for five LEDs in series
- Patent number 8,246,201
- Issue date Aug 21, 2012
- Pierre-Alain Dumas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Backlight device and planar display device using the same
- Patent number 8,157,430
- Issue date Apr 17, 2012
- Sharp Kabushiki Kaisha
- Tetsuya Hamada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed board
- Patent number 8,124,879
- Issue date Feb 28, 2012
- Panasonic Corporation
- Motonari Ogura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductor carrier and arrangement comprising a conductor carrier
- Patent number 8,039,754
- Issue date Oct 18, 2011
- Continental Automotive GmbH
- Martin Fink
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Variable width conductive lines having substantially constant imped...
- Patent number 7,875,826
- Issue date Jan 25, 2011
- Efficere, Inc.
- William A. Miller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tape carrier package including a heat dissipation element
- Patent number 7,821,115
- Issue date Oct 26, 2010
- NEC Electronics Corporation
- Chihiro Sasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED illumination assembly with compliant foil construction
- Patent number 7,806,560
- Issue date Oct 5, 2010
- 3M Innovative Properties Company
- John C. Schultz
- F21 - LIGHTING
Information Patent Grant
Printed wiring board
- Patent number 7,755,911
- Issue date Jul 13, 2010
- Yazaki Corporation
- Masaoki Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board for direct flip chip attachment
- Patent number 7,749,813
- Issue date Jul 6, 2010
- Lumination LLC
- Boris Kolodin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Illumination assembly with enhanced thermal conductivity
- Patent number 7,710,045
- Issue date May 4, 2010
- 3M Innovative Properties Company
- John C. Schultz
- F21 - LIGHTING
Information Patent Grant
Ultra-thin alphanumeric display
- Patent number 7,683,384
- Issue date Mar 23, 2010
- Nicomatic LP
- David Fisher
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Large area circuitry using appliqués
- Patent number 7,678,997
- Issue date Mar 16, 2010
- The Boeing Company
- Diane C. Rawlings
- B64 - AIRCRAFT AVIATION COSMONAUTICS

Patents Applicationslast 30 patents

Information Patent Application
MOTHERBOARD WITH ELECTROSTATIC DISCHARGE PROTECTION FUNCTION
- Publication number 20140240876
- Publication date Aug 28, 2014
- WISTRON CORP.
- Lung-Fai TUEN
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
THERMALLY ENHANCED WIRING BOARD WITH THERMAL PAD AND ELECTRICAL POST
- Publication number 20140048313
- Publication date Feb 20, 2014
- Bridge Semiconductor Corporation
- Wei-Kuang PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20140008694
- Publication date Jan 9, 2014
- Motokazu YAMADA
- F21 - LIGHTING
Information Patent Application
Power Supply System
- Publication number 20130314849
- Publication date Nov 28, 2013
- Raymond Mazzullo
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
METHOD FOR PARTIALLY STRIPPING A DEFINED AREA OF A CONDUCTIVE LAYER
- Publication number 20130048618
- Publication date Feb 28, 2013
- LPKF Laser & Electronics AG
- Jan van Aalst
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SUBSTRATE HAVING A CIRCUIT PATTERN AND METHOD FOR MAKING TH...
- Publication number 20120273261
- Publication date Nov 1, 2012
- TAIWAN GREEN POINT ENTERPRISES CO., LTD.
- Sheng-Hung YI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lighting element
- Publication number 20110298359
- Publication date Dec 8, 2011
- Jan Hesse
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-FREQUENCY WIRING BOARD AND HIGH-FREQUENCY MODULE THAT USES THE...
- Publication number 20110128100
- Publication date Jun 2, 2011
- Risato Ohhira
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT FOR FIVE LEDS IN SERIES
- Publication number 20110103058
- Publication date May 5, 2011
- Pierre-Alain Dumas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Carrier Structure for Electronic Components and Fabrication Method...
- Publication number 20100307799
- Publication date Dec 9, 2010
- Cheng-Feng CHIANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100263921
- Publication date Oct 21, 2010
- Panasonic Electric Works Co., Ltd.
- Youichiro Nakahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT SOURCE UNIT AND DISPLAY DEVICE HAVING THE SAME
- Publication number 20100177498
- Publication date Jul 15, 2010
- DONG-WAN CHOI
- G02 - OPTICS
Information Patent Application
LIGHTING APPARATUS HAVING LIGHT EMITTING DIODES FOR LIGHT SOURCE
- Publication number 20100053950
- Publication date Mar 4, 2010
- Toshiba Lighting & Technology Corporation
- Kazunari HIGUCHI
- F21 - LIGHTING
Information Patent Application
BACKLIGHT DEVICE AND PLANAR DISPLAY DEVICE USING THE SAME
- Publication number 20100027291
- Publication date Feb 4, 2010
- Tetsuya Hamada
- G02 - OPTICS
Information Patent Application
Electronic circuit board including surface mount device
- Publication number 20090316375
- Publication date Dec 24, 2009
- DENSO CORPORATION
- Kouji Ueda
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
LED ILLUMINATION ASSEMBLY WITH COMPLIANT FOIL CONSTRUCTION
- Publication number 20090273925
- Publication date Nov 5, 2009
- 3M Innovative Properties Company
- John C. Schultz
- F21 - LIGHTING
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF FORMING FINE PITCH THE...
- Publication number 20090266587
- Publication date Oct 29, 2009
- Samsung Techwin Co., Ltd.
- Chong-han Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power Converter Having Multiple Layer Heat Sinks
- Publication number 20090237889
- Publication date Sep 24, 2009
- IGO, INC.
- Jason Walter Swanson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductor Carrier and Arrangement Comprising a Conductor Carrier
- Publication number 20090229863
- Publication date Sep 17, 2009
- CONTINENTAL AUTOMOTIVE GMBH
- Martin Fink
- B60 - VEHICLES IN GENERAL
Information Patent Application
CIRCUIT BOARD FOR DIRECT FLIP CHIP ATTACHMENT
- Publication number 20090212317
- Publication date Aug 27, 2009
- Lumination LLC
- Boris Kolodin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED BOARD
- Publication number 20090107700
- Publication date Apr 30, 2009
- PANASONIC CORPORATION
- Motonari Ogura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interposer chip, method of manufacturing the interposer chip, and m...
- Publication number 20090014895
- Publication date Jan 15, 2009
- SAMSUNG ELECTRONICS CO,. LTD.
- Jong-Seok Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board
- Publication number 20080310133
- Publication date Dec 18, 2008
- YAZAKI CORPORATION
- Masaoki Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LARGE AREA CIRCUITRY USING APPLIQUES
- Publication number 20080142238
- Publication date Jun 19, 2008
- The Boeing Company
- Diane C. Rawlings
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board reliably achieving electric connection with el...
- Publication number 20080080153
- Publication date Apr 3, 2008
- FUJITSU LIMITED
- Naoki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board and printed circuit board
- Publication number 20080047738
- Publication date Feb 28, 2008
- Pioneer Corporation
- Tomoya Kanehira
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ILLUMINATION ASSEMBLY WITH ENHANCED THERMAL CONDUCTIVITY
- Publication number 20070216274
- Publication date Sep 20, 2007
- 3M Innovative Properties Company
- John C. Schultz
- G02 - OPTICS
Information Patent Application
VARIABLE WIDTH CONDUCTIVE LINES HAVING SUBSTANTIALLY CONSTANT IMPED...
- Publication number 20070212878
- Publication date Sep 13, 2007
- EFFICERE, LLC
- Morgan Johnson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power converter having multiple layer heat sinks
- Publication number 20070175655
- Publication date Aug 2, 2007
- Jason Walter Swanson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LED ILLUMINATION ASSEMBLY WITH COMPLIANT FOIL CONSTRUCTION
- Publication number 20070177380
- Publication date Aug 2, 2007
- 3M Innovative Properties Company
- John C. Schultz
- G02 - OPTICS

wherein only contours around conductors are removed for insulation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method and device for a high temperature vacuum-safe solder resist...

Resource allocation for traffic-profile-dependent scheduling request

Electro-optic display backplane structure with drive components and...

Pattern safety device for preventing interference between patterns

Printed wiring board

Collective lamination substrate forming pseudo waveguide

Method and device for a high temperature vacuum-safe solder stop ut...

Light emitting device

Circuit substrate having a circuit pattern and method for making th...

Method for partially stripping a defined area of a conductive layer

Light-emitting device

Motherboard with electrostatic discharge protection function

Light emitting device

Organic light emitting diode and circuit board for control thereof

High frequency wiring board comprised of interconnected first and s...

Light emitting device

Circuit board and method of manufacturing the same

Printed wiring board reliably achieving electric connection with el...

Printed circuit for five LEDs in series

Backlight device and planar display device using the same

Printed board

Conductor carrier and arrangement comprising a conductor carrier

Variable width conductive lines having substantially constant imped...

Tape carrier package including a heat dissipation element

LED illumination assembly with compliant foil construction

Printed wiring board

Circuit board for direct flip chip attachment

Illumination assembly with enhanced thermal conductivity

Ultra-thin alphanumeric display

Large area circuitry using appliqués

Patents Applicationslast 30 patents

MOTHERBOARD WITH ELECTROSTATIC DISCHARGE PROTECTION FUNCTION

THERMALLY ENHANCED WIRING BOARD WITH THERMAL PAD AND ELECTRICAL POST

LIGHT EMITTING DEVICE

Power Supply System

METHOD FOR PARTIALLY STRIPPING A DEFINED AREA OF A CONDUCTIVE LAYER

CIRCUIT SUBSTRATE HAVING A CIRCUIT PATTERN AND METHOD FOR MAKING TH...

Lighting element

HIGH-FREQUENCY WIRING BOARD AND HIGH-FREQUENCY MODULE THAT USES THE...

PRINTED CIRCUIT FOR FIVE LEDS IN SERIES

Carrier Structure for Electronic Components and Fabrication Method...

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

LIGHT SOURCE UNIT AND DISPLAY DEVICE HAVING THE SAME

LIGHTING APPARATUS HAVING LIGHT EMITTING DIODES FOR LIGHT SOURCE

BACKLIGHT DEVICE AND PLANAR DISPLAY DEVICE USING THE SAME

Electronic circuit board including surface mount device

LED ILLUMINATION ASSEMBLY WITH COMPLIANT FOIL CONSTRUCTION

FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF FORMING FINE PITCH THE...

Power Converter Having Multiple Layer Heat Sinks

Conductor Carrier and Arrangement Comprising a Conductor Carrier

CIRCUIT BOARD FOR DIRECT FLIP CHIP ATTACHMENT

PRINTED BOARD

Interposer chip, method of manufacturing the interposer chip, and m...

Printed wiring board

LARGE AREA CIRCUITRY USING APPLIQUES

Printed wiring board reliably achieving electric connection with el...

Printed wiring board and printed circuit board

ILLUMINATION ASSEMBLY WITH ENHANCED THERMAL CONDUCTIVITY

VARIABLE WIDTH CONDUCTIVE LINES HAVING SUBSTANTIALLY CONSTANT IMPED...

Power converter having multiple layer heat sinks

LED ILLUMINATION ASSEMBLY WITH COMPLIANT FOIL CONSTRUCTION