TREA

wherein the bump connectors are disposed only on the mounting substrate

Follow

Industry

  • CPC
  • H01L2021/6024
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

Current Industry

H01L2021/6024wherein the bump connectors are disposed only on the mounting substrate
Industries