wherein the bump connectors are disposed only on the mounting substrate

Industry

CPC
H01L2021/6024

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

Current Industry

H01L2021/6024wherein the bump connectors are disposed only on the mounting substrate

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Vertical soldering technology for 3D circuit assembly
- Patent number 11,501,982
- Issue date Nov 15, 2022
- The United States of Americas as represented by the Secretary of the Army
- Stephen Redington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-on-interposer assembly with dam structure and method of manufac...
- Patent number 11,488,882
- Issue date Nov 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated stretchable electronics
- Patent number 11,375,895
- Issue date Jul 5, 2022
- The Regents of the University of California
- Sheng Xu
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Three dimensional integrated circuits stacking approach
- Patent number 11,201,135
- Issue date Dec 14, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit stacking approach
- Patent number 11,121,118
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,069,673
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarization and flip-chip fabrication process of fine-line-geomet...
- Patent number 10,840,106
- Issue date Nov 17, 2020
- OEPic Semiconductors, Inc.
- Yi-Ching Pao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-on-interposer assembly with dam structure and method of manufac...
- Patent number 10,741,467
- Issue date Aug 11, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,672,752
- Issue date Jun 2, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-on-interposer assembly with dam structure and method of manufac...
- Patent number 10,490,474
- Issue date Nov 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,134,719
- Issue date Nov 20, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-on-interposer assembly with dam structure and method of manufac...
- Patent number 10,115,650
- Issue date Oct 30, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for manufacturing the same
- Patent number 9,978,716
- Issue date May 22, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chiang Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of attaching components to printed cirucuit board with reduc...
- Patent number 9,865,479
- Issue date Jan 9, 2018
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Wei-Shun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional integrated circuits stacking approach
- Patent number 9,502,380
- Issue date Nov 22, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number RE45932
- Issue date Mar 15, 2016
- PS4 Luxco S.A.R.L.
- Seiya Fujii
- 001 -
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,178,971
- Issue date May 15, 2012
- Elpida Memory, Inc.
- Seiya Fujii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING DISMANTLABLE STRUCTURE AND METHOD THEREFOR
- Publication number 20250125159
- Publication date Apr 17, 2025
- NXP B.V.
- Yu Ling Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS FOR EFFEC...
- Publication number 20240404839
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Dual-Side Molded System...
- Publication number 20240379480
- Publication date Nov 14, 2024
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING FAN-OUT PACKAGING DEVICE AND FAN-OUT PACKAG...
- Publication number 20240347433
- Publication date Oct 17, 2024
- SILICON BOX PTE. LTD.
- Sehat SUTARDJA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER PASTE, METHOD FOR FORMING SOLDER BUMPS, AND METHOD FOR PRODU...
- Publication number 20240105653
- Publication date Mar 28, 2024
- Resonac Corporation
- Yoshinori EJIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MOUNTING AN ELECTRONIC PACKAGE TO A CIRCUIT BOARD
- Publication number 20230402294
- Publication date Dec 14, 2023
- Skyworks Solutions, Inc.
- Anthony James LoBianco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MANUFACTURING ELECTRONIC PACKAGES AND ELECTRONIC ASSEMB...
- Publication number 20230402293
- Publication date Dec 14, 2023
- Skyworks Solutions, Inc.
- Anthony James LoBianco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die-on-Interposer Assembly with Dam Structure and Method of Manufac...
- Publication number 20200373215
- Publication date Nov 26, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANARIZATION AND FLIP-CHIP FABRICATION PROCESS OF FINE-LINE-GEOMET...
- Publication number 20200118832
- Publication date Apr 16, 2020
- OEpic SEMICONDUCTORS, INC.
- YI-CHING PAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die-on-Interposer Assembly with Dam Structure and Method of Manufac...
- Publication number 20200035578
- Publication date Jan 30, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL INTEGRATED CIRCUIT STACKING APPROACH
- Publication number 20190088620
- Publication date Mar 21, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20180006005
- Publication date Jan 4, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170317054
- Publication date Nov 2, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chiang TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ATTACHING COMPONENTS TO PRINTED CIRUCUIT BOARD WITH REDUC...
- Publication number 20170301559
- Publication date Oct 19, 2017
- Avago Technologies General IP (Singapore) PTE. LTD.
- Wei-Shun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-ON-INTERPOSER ASSEMBLY WITH DAM STRUCTURE AND METHOD OF MANUFAC...
- Publication number 20160293532
- Publication date Oct 6, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL THREE DIMENSIONAL INTEGRATED CIRCUITS STACKING APPROACH
- Publication number 20140091473
- Publication date Apr 3, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng LEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20090224403
- Publication date Sep 10, 2009
- ELPIDA MEMORY, INC.
- Seiya Fujii
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

wherein the bump connectors are disposed only on the mounting substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Vertical soldering technology for 3D circuit assembly

Die-on-interposer assembly with dam structure and method of manufac...

Three-dimensional integrated stretchable electronics

Three dimensional integrated circuits stacking approach

Integrated circuit stacking approach

Semiconductor package and manufacturing method thereof

Planarization and flip-chip fabrication process of fine-line-geomet...

Die-on-interposer assembly with dam structure and method of manufac...

Semiconductor package and manufacturing method thereof

Die-on-interposer assembly with dam structure and method of manufac...

Semiconductor package and manufacturing method thereof

Die-on-interposer assembly with dam structure and method of manufac...

Package structure and method for manufacturing the same

Method of attaching components to printed cirucuit board with reduc...

Three dimensional integrated circuits stacking approach

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE HAVING DISMANTLABLE STRUCTURE AND METHOD THEREFOR

WIRE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS FOR EFFEC...

Semiconductor Device and Method of Making a Dual-Side Molded System...

METHOD OF MANUFACTURING FAN-OUT PACKAGING DEVICE AND FAN-OUT PACKAG...

SOLDER PASTE, METHOD FOR FORMING SOLDER BUMPS, AND METHOD FOR PRODU...

METHODS FOR MOUNTING AN ELECTRONIC PACKAGE TO A CIRCUIT BOARD

METHODS FOR MANUFACTURING ELECTRONIC PACKAGES AND ELECTRONIC ASSEMB...

Die-on-Interposer Assembly with Dam Structure and Method of Manufac...

PLANARIZATION AND FLIP-CHIP FABRICATION PROCESS OF FINE-LINE-GEOMET...

Die-on-Interposer Assembly with Dam Structure and Method of Manufac...

NOVEL INTEGRATED CIRCUIT STACKING APPROACH

SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

METHOD OF ATTACHING COMPONENTS TO PRINTED CIRUCUIT BOARD WITH REDUC...

DIE-ON-INTERPOSER ASSEMBLY WITH DAM STRUCTURE AND METHOD OF MANUFAC...

NOVEL THREE DIMENSIONAL INTEGRATED CIRCUITS STACKING APPROACH

Semiconductor device and method of manufacturing the same