Wire connectors having connecting portions of different types on the semiconductor or solid-state body

Industry

CPC
H01L2224/4945

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4945Wire connectors having connecting portions of different types on the semiconductor or solid-state body

Industries

Patents Grantslast 30 patents

Information Patent Grant
LED lighting apparatus
- Patent number 10,976,011
- Issue date Apr 13, 2021
- Rohm Co., Ltd.
- Tomoharu Horio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED lighting apparatus
- Patent number 10,655,793
- Issue date May 19, 2020
- Rohm Co., Ltd.
- Tomoharu Horio
- F21 - LIGHTING
Information Patent Grant
Light emitting device
- Patent number 10,559,721
- Issue date Feb 11, 2020
- Nichia Corporation
- Motokazu Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,170,402
- Issue date Jan 1, 2019
- Renesas Electronics Corporation
- Yosuke Imazeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,157,974
- Issue date Dec 18, 2018
- Renesas Electronics Corporation
- Takuo Funaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED lighting apparatus
- Patent number 9,863,584
- Issue date Jan 9, 2018
- Rohm Co., Ltd.
- Tomoharu Horio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High brightness light emitting diode (LED) packages, systems and me...
- Patent number 9,859,471
- Issue date Jan 2, 2018
- Cree, Inc.
- Christopher P. Hussell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,818,815
- Issue date Nov 14, 2017
- Renesas Electronics Corporation
- Takuo Funaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 9,806,234
- Issue date Oct 31, 2017
- Nichia Corporation
- Motokazu Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting module
- Patent number 9,634,211
- Issue date Apr 25, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Masumi Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for diminishing delamination of packaged semic...
- Patent number 9,627,299
- Issue date Apr 18, 2017
- Texas Instruments Incorporated
- Kyle Mitchell Flessner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad arrangment design for multi-die semiconductor package s...
- Patent number 9,564,395
- Issue date Feb 7, 2017
- Mediatek Inc.
- Hsing-Chih Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced stacked microelectronic assemblies with central contacts
- Patent number 9,461,015
- Issue date Oct 4, 2016
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device with light reflecting member having protrusio...
- Patent number 9,373,767
- Issue date Jun 21, 2016
- Nichia Corporation
- Shinya Okura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,281,289
- Issue date Mar 8, 2016
- Renesas Electronics Corporation
- Yosuke Imazeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED lighting apparatus
- Patent number 9,222,625
- Issue date Dec 29, 2015
- Rohm Co., Ltd.
- Tomoharu Horio
- F21 - LIGHTING
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,219,108
- Issue date Dec 22, 2015
- Renesas Electronics Corporation
- Takuo Funaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with a semiconductor chip and a passive compon...
- Patent number 9,159,720
- Issue date Oct 13, 2015
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed wire semiconductor lead frame package
- Patent number 9,087,827
- Issue date Jul 21, 2015
- Infineon Technologies AG
- Jenny Ong Wai Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with integrated interference shielding and me...
- Patent number 8,987,889
- Issue date Mar 24, 2015
- Skyworks Solutions, Inc.
- Patrick Lawrence Welch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,987,861
- Issue date Mar 24, 2015
- Renesas Electronics Corporation
- Takuo Funaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly with joined bond elements having lowered i...
- Patent number 8,816,514
- Issue date Aug 26, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced stacked microelectronic assemblies with central contacts
- Patent number 8,787,032
- Issue date Jul 22, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with integrated interference shielding and me...
- Patent number 8,748,230
- Issue date Jun 10, 2014
- Skyworks Solutions, Inc.
- Patrick L. Welch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with tiebar-less design and met...
- Patent number 8,637,974
- Issue date Jan 28, 2014
- Stats Chippac Ltd.
- Zheng Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuit package-in-package system and method of...
- Patent number 8,617,924
- Issue date Dec 31, 2013
- Stats Chippac Ltd.
- OhSug Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a manufacturing method of the same
- Patent number 8,530,278
- Issue date Sep 10, 2013
- Renesas Electronics Corporation
- Nobuyasu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with a power semiconductor chip and a passive...
- Patent number 8,466,561
- Issue date Jun 18, 2013
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor integrated circuit device
- Patent number 8,450,150
- Issue date May 28, 2013
- Renesas Electronics Corporation
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly with joined bond elements having lowered i...
- Patent number 8,410,618
- Issue date Apr 2, 2013
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240387495
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Minwoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230378018
- Publication date Nov 23, 2023
- Rohm Co., Ltd.
- Hajime OKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED LIGHTING APPARATUS
- Publication number 20180119890
- Publication date May 3, 2018
- Rohm Co., Ltd.
- Tomoharu Horio
- F21 - LIGHTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180069073
- Publication date Mar 8, 2018
- RENESAS ELECTRONICS CORPORATION
- Takuo Funaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20180040776
- Publication date Feb 8, 2018
- Nichia Corporation.
- Motokazu YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL ENHANCEMENT FOR QUAD FLAT NO LEAD (QFN) PACKAGES
- Publication number 20170018487
- Publication date Jan 19, 2017
- BROADCOM CORPORATION
- Daijiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150035172
- Publication date Feb 5, 2015
- RENESAS ELECTRONICS CORPORATION
- Yosuke Imazeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH INTEGRATED INTERFERENCE SHIELDING AND ME...
- Publication number 20140353807
- Publication date Dec 4, 2014
- Patrick Lawrence Welch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS
- Publication number 20140239513
- Publication date Aug 28, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140175602
- Publication date Jun 26, 2014
- RENESAS ELECTRONICS CORPORATION
- Takuo Funaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...
- Publication number 20140124565
- Publication date May 8, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED LIGHTING APPARATUS
- Publication number 20140085884
- Publication date Mar 27, 2014
- Rohm Co., Ltd.
- Tomoharu Horio
- F21 - LIGHTING
Information Patent Application
SEMICONDUCTOR PACKAGE WITH INTEGRATED INTERFERENCE SHIELDING AND ME...
- Publication number 20140030852
- Publication date Jan 30, 2014
- SKYWORKS SOLUTIONS, INC.
- Patrick Lawrence Welch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH TIEBAR-LESS DESIGN AND MET...
- Publication number 20130334674
- Publication date Dec 19, 2013
- Zheng Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20130330879
- Publication date Dec 12, 2013
- RENESAS ELECTRONICS CORPORATION
- Hiroshi MAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...
- Publication number 20130292834
- Publication date Nov 7, 2013
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Module With a Semiconductor Chip and a Passive Compon...
- Publication number 20130285132
- Publication date Oct 31, 2013
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH BRIGHTNESS LIGHT EMITTING DIODE (LED) PACKAGES, SYSTEMS AND ME...
- Publication number 20120300491
- Publication date Nov 29, 2012
- Christopher P. Hussell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE, LIGHT BULB SHAPED LAMP AND LIGHTING APPARATUS
- Publication number 20120256538
- Publication date Oct 11, 2012
- PANASONIC CORPORATION
- Nobuyoshi Takeuchi
- F21 - LIGHTING
Information Patent Application
ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS
- Publication number 20120155049
- Publication date Jun 21, 2012
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH NESTED ROWS OF CONTACTS
- Publication number 20120112333
- Publication date May 10, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Qiang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXED WIRE SEMICONDUCTOR LEAD FRAME PACKAGE
- Publication number 20120091568
- Publication date Apr 19, 2012
- INFINEON TECHNOLOGIES AG
- Jenny Ong Wai Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20120007112
- Publication date Jan 12, 2012
- Nichia Corporation.
- Motokazu YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...
- Publication number 20110285020
- Publication date Nov 24, 2011
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME
- Publication number 20110269268
- Publication date Nov 3, 2011
- Renesas Electronics Corporation
- NOBUYASU MUTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...
- Publication number 20110147953
- Publication date Jun 23, 2011
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH INTEGRATED INTERFERENCE SHIELDING AND ME...
- Publication number 20110084378
- Publication date Apr 14, 2011
- SKYWORKS SOLUTIONS, INC.
- Patrick L. Welch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHOD FOR MANUFACTURING A DEVICE
- Publication number 20110049505
- Publication date Mar 3, 2011
- Johannes Grabowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20100311234
- Publication date Dec 9, 2010
- NEC Electronics Corporation
- Yukinori Tabira
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power Lead-on-Chip Ball Grid Array Package
- Publication number 20100270663
- Publication date Oct 28, 2010
- FREESCALE SEMICONDUCTOR, INC.
- James P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS

Wire connectors having connecting portions of different types on the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

LED lighting apparatus

LED lighting apparatus

Light emitting device

Semiconductor device

Semiconductor device and method of manufacturing the same

LED lighting apparatus

High brightness light emitting diode (LED) packages, systems and me...

Semiconductor device and method of manufacturing the same

Light emitting device

Light-emitting module

Structure and method for diminishing delamination of packaged semic...

Bonding pad arrangment design for multi-die semiconductor package s...

Enhanced stacked microelectronic assemblies with central contacts

Light emitting device with light reflecting member having protrusio...

Semiconductor device and method of manufacturing the same

LED lighting apparatus

Semiconductor device and method of manufacturing the same

Semiconductor module with a semiconductor chip and a passive compon...

Mixed wire semiconductor lead frame package

Semiconductor package with integrated interference shielding and me...

Semiconductor device and method of manufacturing the same

Microelectronic assembly with joined bond elements having lowered i...

Enhanced stacked microelectronic assemblies with central contacts

Semiconductor package with integrated interference shielding and me...

Integrated circuit packaging system with tiebar-less design and met...

Stacked integrated circuit package-in-package system and method of...

Semiconductor device and a manufacturing method of the same

Semiconductor module with a power semiconductor chip and a passive...

Manufacturing method of semiconductor integrated circuit device

Microelectronic assembly with joined bond elements having lowered i...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

LED LIGHTING APPARATUS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

LIGHT EMITTING DEVICE

THERMAL ENHANCEMENT FOR QUAD FLAT NO LEAD (QFN) PACKAGES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE WITH INTEGRATED INTERFERENCE SHIELDING AND ME...

ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...

LED LIGHTING APPARATUS

SEMICONDUCTOR PACKAGE WITH INTEGRATED INTERFERENCE SHIELDING AND ME...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH TIEBAR-LESS DESIGN AND MET...

MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...

Semiconductor Module With a Semiconductor Chip and a Passive Compon...

HIGH BRIGHTNESS LIGHT EMITTING DIODE (LED) PACKAGES, SYSTEMS AND ME...

LIGHT-EMITTING DEVICE, LIGHT BULB SHAPED LAMP AND LIGHTING APPARATUS

ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS

SEMICONDUCTOR DEVICE WITH NESTED ROWS OF CONTACTS

MIXED WIRE SEMICONDUCTOR LEAD FRAME PACKAGE

LIGHT EMITTING DEVICE

MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME

MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...

SEMICONDUCTOR PACKAGE WITH INTEGRATED INTERFERENCE SHIELDING AND ME...

DEVICES AND METHOD FOR MANUFACTURING A DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Power Lead-on-Chip Ball Grid Array Package