Wire connectors Manufacturing methods related thereto

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H01L2224/42

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/42Wire connectors Manufacturing methods related thereto

Industries

Patents Grantslast 30 patents

Information Patent Grant
IGBT module assembly
- Patent number 10,811,333
- Issue date Oct 20, 2020
- Gree Electric Appliances, Inc. of Zhuhai
- Jing Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for flip-chip LEDs with close spacing of LED chips
- Patent number 10,575,374
- Issue date Feb 25, 2020
- LedEngin, Inc.
- Xiantao Yan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded wire bond wires
- Patent number 10,490,528
- Issue date Nov 26, 2019
- Invensas Corporation
- Ashok S. Prabhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flange tab system
- Patent number 10,408,369
- Issue date Sep 10, 2019
- Tony Gerun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device having a protruding interposer edge face
- Patent number 10,332,937
- Issue date Jun 25, 2019
- Sumitomo Electric Industries, Ltd.
- Akira Furuya
- G02 - OPTICS
Information Patent Grant
Light emitting device and light emitting module
- Patent number 10,270,006
- Issue date Apr 23, 2019
- LG Innotek Co., Ltd
- Shuhei Matsuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead frame
- Patent number 10,236,428
- Issue date Mar 19, 2019
- Osram Opto Semiconductors GmbH
- Weng Chung Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic component comprising a conversion element, method of...
- Patent number 10,230,024
- Issue date Mar 12, 2019
- Osram Opto Semiconductors GmbH
- David O'Brien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid state imaging device and electronic apparatus
- Patent number 10,229,942
- Issue date Mar 12, 2019
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Hidetoshi Oishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical sensor
- Patent number 10,115,878
- Issue date Oct 30, 2018
- Shinko Electric Industries Co., Ltd.
- Yasuyoshi Horikawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE FOR FLIP-CHIP LEDS WITH CLOSE SPACING OF LED CHIPS
- Publication number 20190281672
- Publication date Sep 12, 2019
- LedEngin, Inc.
- Xiantao Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
- Publication number 20190181170
- Publication date Jun 13, 2019
- Sony Semiconductor Solutions Corporation
- Hidetoshi OISHI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IGBT MODULE ASSEMBLY
- Publication number 20190131205
- Publication date May 2, 2019
- GREE ELECTRIC APPLIANCES, INC. OF ZHUHAI
- Jing Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
- Publication number 20180350858
- Publication date Dec 6, 2018
- Hidetoshi OISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC COMPONENT COMPRISING A CONVERSION ELEMENT, METHOD OF...
- Publication number 20180198034
- Publication date Jul 12, 2018
- Osram Opto Semiconductors GmbH
- David O'Brien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE AND LIGHT EMITTING MODULE (As Amended)
- Publication number 20180190868
- Publication date Jul 5, 2018
- LG Innotek Co., Ltd.
- Shuhei MATSUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20180175113
- Publication date Jun 21, 2018
- Sumitomo Electric Industries, Ltd.
- Akira FURUYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED MODULE
- Publication number 20180158992
- Publication date Jun 7, 2018
- TRIDONIC JENNERSDORF GMBH
- Robert HÖBER-NEUHOLD
- F21 - LIGHTING
Information Patent Application
Lead Frame
- Publication number 20170373233
- Publication date Dec 28, 2017
- Osram Opto Semiconductors GmbH
- Weng Chung Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR
- Publication number 20170358723
- Publication date Dec 14, 2017
- Shinko Electric Industries Co., LTD.
- Yasuyoshi Horikawa
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
HIGH VOLTAGE DEVICES AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150145055
- Publication date May 28, 2015
- Samsung Electronics Co., Ltd.
- Jong-Sam KIM
- H01 - BASIC ELECTRIC ELEMENTS

Wire connectors Manufacturing methods related thereto

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

IGBT module assembly

Package for flip-chip LEDs with close spacing of LED chips

Embedded wire bond wires

Flange tab system

Semiconductor device having a protruding interposer edge face

Light emitting device and light emitting module

Lead frame

Optoelectronic component comprising a conversion element, method of...

Solid state imaging device and electronic apparatus

Optical sensor

Patents Applicationslast 30 patents

PACKAGE FOR FLIP-CHIP LEDS WITH CLOSE SPACING OF LED CHIPS

SOLID STATE IMAGING DEVICE AND ELECTRONIC APPARATUS

IGBT MODULE ASSEMBLY

SOLID STATE IMAGING DEVICE AND ELECTRONIC APPARATUS

OPTOELECTRONIC COMPONENT COMPRISING A CONVERSION ELEMENT, METHOD OF...

LIGHT EMITTING DEVICE AND LIGHT EMITTING MODULE (As Amended)

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

LED MODULE

Lead Frame

OPTICAL SENSOR

HIGH VOLTAGE DEVICES AND METHOD OF MANUFACTURING THE SAME