Wire-like or pin-like cooling fins or heat sinks

Industry

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H01L23/3677

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/3677Wire-like or pin-like cooling fins or heat sinks

Industries

Patents Grantslast 30 patents

Information Patent Grant
Heat sink, heat sink arrangement and module for liquid immersion co...
- Patent number 11,968,802
- Issue date Apr 23, 2024
- ICEOTOPE GROUP LIMITED
- David Amos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 11,961,779
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC)
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module, power conversion device, and manufacturing me...
- Patent number 11,961,780
- Issue date Apr 16, 2024
- Hitachi Astemo, Ltd.
- Nobutake Tsuyuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor component and method for producing a power semi...
- Patent number 11,955,402
- Issue date Apr 9, 2024
- Vitesco Technologies GbmH
- Christina Quest-Matt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal resistor and method of manufacturing the same
- Patent number 11,942,392
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jaw-Juinn Horng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System in package with flip chip die over multi-layer heatsink stan...
- Patent number 11,942,391
- Issue date Mar 26, 2024
- Qorvo US, Inc.
- Kelly M. Lear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation device having anisotropic thermally conductive sec...
- Patent number 11,933,555
- Issue date Mar 19, 2024
- Intel Corporation
- Feras Eid
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
3D semiconductor device and structure with bonding
- Patent number 11,923,230
- Issue date Mar 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Carrier, assembly with a carrier, and method for producing a carrier
- Patent number 11,923,303
- Issue date Mar 5, 2024
- Osram Opto Semiconductors GmbH
- Konrad Wagner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated thermal-electrical component for power electronics conve...
- Patent number 11,917,797
- Issue date Feb 27, 2024
- The Florida State University Research Foundation, Inc.
- Yanjun Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with memory
- Patent number 11,901,210
- Issue date Feb 13, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with resistive element
- Patent number 11,901,289
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wan-Te Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Iintegrated fan-out packages with embedded heat dissipation structure
- Patent number 11,901,258
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with integrated heat distribution and manufact...
- Patent number 11,901,343
- Issue date Feb 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,894,308
- Issue date Feb 6, 2024
- Advanced Semiconductor Engineering, Inc.
- Sheng-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with single-crystal layers
- Patent number 11,876,011
- Issue date Jan 16, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Nanowires plated on nanoparticles
- Patent number 11,869,864
- Issue date Jan 9, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink with protrusions on multiple sides thereof and apparatus...
- Patent number 11,864,348
- Issue date Jan 2, 2024
- Gerald Ho Kim
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method for producing a 3D semiconductor device and structure with m...
- Patent number 11,862,503
- Issue date Jan 2, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,862,580
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure for heat dissipation
- Patent number 11,854,785
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 11,854,857
- Issue date Dec 26, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power conversion apparatus
- Patent number 11,855,528
- Issue date Dec 26, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shinya Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with through substrate vias and manufacturi...
- Patent number 11,855,021
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package for direct cooling multiple power modules
- Patent number 11,848,320
- Issue date Dec 19, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and fabrication method thereof
- Patent number 11,842,941
- Issue date Dec 12, 2023
- Samsung Electronics Co., Ltd.
- Youngho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic systems with inverted circuit board with heat sink to ch...
- Patent number 11,842,943
- Issue date Dec 12, 2023
- Intel Corporation
- Barrett M. Faneuf
- G11 - INFORMATION STORAGE
Information Patent Grant
Wire bonded air heat sink
- Patent number 11,837,521
- Issue date Dec 5, 2023
- Raytheon Company
- James S. Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverter
- Patent number 11,837,523
- Issue date Dec 5, 2023
- Tesla, Inc.
- Wenjun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,837,516
- Issue date Dec 5, 2023
- Mitsubishi Electric Corporation
- Takanobu Kajihara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR PRODUCING A 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH...
- Publication number 20240145289
- Publication date May 2, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
QUANTUM DEVICE
- Publication number 20240136274
- Publication date Apr 25, 2024
- NEC Corporation
- Katsumi KIKUCHI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC MODULE AND ELECTRONIC APPARATUS
- Publication number 20240128193
- Publication date Apr 18, 2024
- Advanced Semiconductor Engineering, Inc.
- Pao-Nan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY
- Publication number 20240128116
- Publication date Apr 18, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240128151
- Publication date Apr 18, 2024
- HON HAI PRECISION INDUSTRY CO., LTD.
- Chun-Yen PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE FOR DIRECT COOLING MULTIPLE POWER MODULES
- Publication number 20240120328
- Publication date Apr 11, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR MANAGING HEAT DISTRIBUTION IN A SEMICONDUC...
- Publication number 20240121919
- Publication date Apr 11, 2024
- CIENA CORPORATION
- Charles Baudot
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS
- Publication number 20240112942
- Publication date Apr 4, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY
- Publication number 20240105490
- Publication date Mar 28, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
Semiconductor Device and Method of Forming Graphene-Coated Core Emb...
- Publication number 20240096736
- Publication date Mar 21, 2024
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240096735
- Publication date Mar 21, 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Rai SHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240096733
- Publication date Mar 21, 2024
- WISTRON NEWEB CORPORATION
- KUO-HUA HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PACKAGE WITH SEALED DIE ENCLOSURES
- Publication number 20240088081
- Publication date Mar 14, 2024
- QUALCOMM Incorporated
- Bart KASSTEEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240088063
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20240079288
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Youngho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING HEAT PIPE SURROUNDING MULTIPLE INTEGRAT...
- Publication number 20240074028
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Youngho YOON
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Package with Improved Heat Dissipation Efficiency and Method for Fo...
- Publication number 20240063079
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240063081
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEMS WITH INVERTED CIRCUIT BOARD WITH HEAT SINK TO CH...
- Publication number 20240063082
- Publication date Feb 22, 2024
- Intel Corporation
- Barrett M. Faneuf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED STRUCTURAL MEMBER AND/OR BOND LAYER FOR MULTICHI...
- Publication number 20240063091
- Publication date Feb 22, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compliant Pad Spacer for Three-Dimensional Integrated Circuit Package
- Publication number 20240055317
- Publication date Feb 15, 2024
- Google LLC
- Emad Samadiani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20240055393
- Publication date Feb 15, 2024
- Invensas LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH BONDING
- Publication number 20240055291
- Publication date Feb 15, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
WIRE BONDED AIR HEAT SINK
- Publication number 20240055318
- Publication date Feb 15, 2024
- Raytheon Company
- James S. Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240047296
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Yeongbeom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pin Fin Placement Assembly for Forming Temperature Control Element...
- Publication number 20240038620
- Publication date Feb 1, 2024
- Google LLC
- Yingshi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY PACKAGE DESIGN
- Publication number 20240030091
- Publication date Jan 25, 2024
- Dell Products L.P.
- Qinghong He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION DEVICE FOR A CONVERTER FOR A VEHICLE, POWER CONVER...
- Publication number 20240030094
- Publication date Jan 25, 2024
- ZF Friedrichshafen AG
- Thomas Bosch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH IMPROVED ESD PERFORMANCE, ESD RELIABILITY...
- Publication number 20240030162
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Aruldas DIVAKARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURE OF COOLING PLATE FOR POWER SEMICONDUCTOR...
- Publication number 20240030090
- Publication date Jan 25, 2024
- ZHENGHAI GROUP CO., LTD.
- Changcheng WANG
- H01 - BASIC ELECTRIC ELEMENTS

Wire-like or pin-like cooling fins or heat sinks

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Heat sink, heat sink arrangement and module for liquid immersion co...

3DIC packaging with hot spot thermal management features

Semiconductor module, power conversion device, and manufacturing me...

Power semiconductor component and method for producing a power semi...

Thermal resistor and method of manufacturing the same

System in package with flip chip die over multi-layer heatsink stan...

Heat dissipation device having anisotropic thermally conductive sec...

3D semiconductor device and structure with bonding

Carrier, assembly with a carrier, and method for producing a carrier

Integrated thermal-electrical component for power electronics conve...

3D semiconductor device and structure with memory

Semiconductor device structure with resistive element

Iintegrated fan-out packages with embedded heat dissipation structure

Semiconductor device with integrated heat distribution and manufact...

Semiconductor package and method of manufacturing the same

3D semiconductor device and structure with single-crystal layers

Nanowires plated on nanoparticles

Heat sink with protrusions on multiple sides thereof and apparatus...

Method for producing a 3D semiconductor device and structure with m...

Semiconductor package

Package structure for heat dissipation

Methods for producing a 3D semiconductor device and structure with...

Power conversion apparatus

Semiconductor structure with through substrate vias and manufacturi...

Power module package for direct cooling multiple power modules

Semiconductor package structure and fabrication method thereof

Electronic systems with inverted circuit board with heat sink to ch...

Wire bonded air heat sink

Inverter

Semiconductor device

Patents Applicationslast 30 patents

METHODS FOR PRODUCING A 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH...

QUANTUM DEVICE

ELECTRONIC MODULE AND ELECTRONIC APPARATUS

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY

PACKAGE STRUCTURE

POWER MODULE PACKAGE FOR DIRECT COOLING MULTIPLE POWER MODULES

METHOD AND APPARATUS FOR MANAGING HEAT DISTRIBUTION IN A SEMICONDUC...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY

Semiconductor Device and Method of Forming Graphene-Coated Core Emb...

SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

DIE PACKAGE WITH SEALED DIE ENCLOSURES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

ELECTRONIC DEVICE INCLUDING HEAT PIPE SURROUNDING MULTIPLE INTEGRAT...

Package with Improved Heat Dissipation Efficiency and Method for Fo...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

ELECTRONIC SYSTEMS WITH INVERTED CIRCUIT BOARD WITH HEAT SINK TO CH...

THERMALLY ENHANCED STRUCTURAL MEMBER AND/OR BOND LAYER FOR MULTICHI...

Compliant Pad Spacer for Three-Dimensional Integrated Circuit Package

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH BONDING

WIRE BONDED AIR HEAT SINK

SEMICONDUCTOR PACKAGE

Pin Fin Placement Assembly for Forming Temperature Control Element...

BALL GRID ARRAY PACKAGE DESIGN

HEAT DISSIPATION DEVICE FOR A CONVERTER FOR A VEHICLE, POWER CONVER...

SEMICONDUCTOR DEVICE WITH IMPROVED ESD PERFORMANCE, ESD RELIABILITY...

HEAT DISSIPATION STRUCTURE OF COOLING PLATE FOR POWER SEMICONDUCTOR...