Wire or wire-like electrical connections between devices

Industry

CPC
H01L2225/06506

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/06506Wire or wire-like electrical connections between devices

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor memory device and memory system
- Patent number 12,183,405
- Issue date Dec 31, 2024
- Kioxia Corporation
- Mitsuhiro Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Divided clock transmission in a three-dimensional stacked memory de...
- Patent number 12,176,031
- Issue date Dec 24, 2024
- Micron Technology, Inc.
- Vijayakrishna J. Vankayala
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package
- Patent number 12,166,007
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Byeonguk Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 12,159,856
- Issue date Dec 3, 2024
- Kioxia Corporation
- Satoshi Tsukiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing same
- Patent number 12,154,859
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Woonchun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device including vertical contact...
- Patent number 12,154,860
- Issue date Nov 26, 2024
- SanDisk Technologies, Inc.
- Zhongli Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional bonding scheme and associated systems and methods
- Patent number 12,148,736
- Issue date Nov 19, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separate inter-die connectors for data and error correction informa...
- Patent number 12,141,084
- Issue date Nov 12, 2024
- Lodestar Licensing Group LLC
- Vijayakrishna J. Vankayala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device assemblies and systems with one or more dies a...
- Patent number 12,125,816
- Issue date Oct 22, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 12,119,323
- Issue date Oct 15, 2024
- Kioxia Corporation
- Soichi Homma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and driving circuit structure
- Patent number 12,112,669
- Issue date Oct 8, 2024
- E Ink Holdings Inc.
- Shu-Fen Tsai
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Chip-middle type fan-out panel-level package and packaging method t...
- Patent number 12,094,809
- Issue date Sep 17, 2024
- Powertech Technology Inc.
- Hiroyuki Fujishima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold compound dispensing system and method
- Patent number 12,083,715
- Issue date Sep 10, 2024
- Morgan, Lewis & Bockius LLP
- Xianlu Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Board unit and semiconductor device
- Patent number 12,080,677
- Issue date Sep 3, 2024
- Kioxia Corporation
- Katsuya Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device with bonding electrodes
- Patent number 12,080,666
- Issue date Sep 3, 2024
- Kioxia Corporation
- Hideaki Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack with cascade and vertical connections
- Patent number 12,068,283
- Issue date Aug 20, 2024
- Intel Corporation
- Min-Tih Ted Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package mold flow control system and method
- Patent number 12,062,625
- Issue date Aug 13, 2024
- SanDisk Technologies, Inc.
- Hope Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory package, storage device including memory package, and storag...
- Patent number 12,057,191
- Issue date Aug 6, 2024
- Samsung Electronics Co., Ltd.
- Ji-Yeon Shin
- G11 - INFORMATION STORAGE
Information Patent Grant
Neural computing dies with stacked neural core regions
- Patent number 12,052,873
- Issue date Jul 30, 2024
- Intel Corporation
- Dmitri E. Nikonov
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Microelectronic assembly from processed substrate
- Patent number 12,051,621
- Issue date Jul 30, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
NAND memory with different pass voltage ramp rates for binary and m...
- Patent number 12,046,314
- Issue date Jul 23, 2024
- SanDisk Technologies, Inc.
- Abu Naser Zainuddin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device including a suspended reinforcing layer and me...
- Patent number 12,033,958
- Issue date Jul 9, 2024
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for interconnecting stacked semiconductor devices
- Patent number 12,033,983
- Issue date Jul 9, 2024
- Intel Corporation
- Junfeng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating the same
- Patent number 12,033,977
- Issue date Jul 9, 2024
- Samsung Electronics Co., Ltd.
- Seong Gwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection substrate, semiconductor package, and method of man...
- Patent number 12,027,452
- Issue date Jul 2, 2024
- Kioxia Corporation
- Motoshi Seto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing keep-out-zone area for a semiconductor device
- Patent number 12,021,060
- Issue date Jun 25, 2024
- Western Digital Technologies, Inc.
- Kevin Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-volatile memory package and storage device comprising the same
- Patent number 12,020,765
- Issue date Jun 25, 2024
- Samsung Electronics Co., Ltd.
- Ji Woon Park
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory chip including control logic circuit with dynamic random-acc...
- Patent number 12,016,183
- Issue date Jun 18, 2024
- Hon Hai Precision Industry Co., Ltd.
- Yan-Ru Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intra-package memory die communication structures
- Patent number 12,014,765
- Issue date Jun 18, 2024
- Micron Technology, Inc.
- Hari Giduturi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 12,009,344
- Issue date Jun 11, 2024
- SK hynix Inc.
- Jin Kyoung Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20250008726
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Kang Lib KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240429110
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Jangwoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240429114
- Publication date Dec 26, 2024
- KIOXIA Corporation
- Yoshiharu OKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240429118
- Publication date Dec 26, 2024
- KIOXIA Corporation
- Keisuke TOKUBUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20240431113
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Kang Lib KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240421014
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Injae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME
- Publication number 20240422976
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Dongyoung KIM
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240421121
- Publication date Dec 19, 2024
- KIOXIA Corporation
- Masayuki MIURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20240422983
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Kohji Kanamori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240407171
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- PYEONGWOO KIM
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE
- Publication number 20240404946
- Publication date Dec 5, 2024
- KIOXIA Corporation
- Yoshiyuki HORII
- G11 - INFORMATION STORAGE
Information Patent Application
APPARATUS INCLUDING SELECTABLE CIRCUIT PLACEMENT MECHANISM AND METH...
- Publication number 20240404995
- Publication date Dec 5, 2024
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES
- Publication number 20240404931
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Hyejin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE SPACER
- Publication number 20240404994
- Publication date Dec 5, 2024
- Western Digital Technologies, Inc.
- Jayavel Pachamuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MANUFACTURING A SOLAR CELL
- Publication number 20240404763
- Publication date Dec 5, 2024
- Panasonic Intellectual Property Management ,Co, Ltd.
- Taisuke MATSUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND ELE...
- Publication number 20240397715
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Joonyoung Kwon
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM HAVING THE SAME
- Publication number 20240397726
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Ilho Myeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MEMORY DEVICE WITH OVERHANG SUPPORT STRUCTURE
- Publication number 20240397735
- Publication date Nov 28, 2024
- Western Digital Technologies, Inc.
- Shujun Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM HAVING THE SAME
- Publication number 20240397716
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Siyeong YANG
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A VERTICAL MEMORY DEVICE AND AN ELEC...
- Publication number 20240397727
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Ilho Myeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFORMER-BASED ISOLATOR WITH SENSE COIL
- Publication number 20240395736
- Publication date Nov 28, 2024
- ALLEGRO MICROSYSTEMS, LLC
- John Horan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20240389325
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Hyunmook Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY SYSTEM INCLUDING SEMICONDUCTOR CHIPS
- Publication number 20240379621
- Publication date Nov 14, 2024
- SK HYNIX INC.
- Dong Sop LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING SEMICONDUCTO...
- Publication number 20240365543
- Publication date Oct 31, 2024
- Samsung Electronics Co., Ltd.
- Taegon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20240357806
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- JEA-YEON LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME
- Publication number 20240355735
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- Hyemi LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240347437
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Jinho Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240347499
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Hongjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME
- Publication number 20240339403
- Publication date Oct 10, 2024
- Samsung Electronics Co., Ltd.
- Moorym Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGES
- Publication number 20240339436
- Publication date Oct 10, 2024
- SK HYNIX INC.
- Eun Hye DO
- H01 - BASIC ELECTRIC ELEMENTS

Wire or wire-like electrical connections between devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor memory device and memory system

Divided clock transmission in a three-dimensional stacked memory de...

Semiconductor package

Method for manufacturing semiconductor device

Semiconductor package and method of manufacturing same

Method of forming a semiconductor device including vertical contact...

Three-dimensional bonding scheme and associated systems and methods

Separate inter-die connectors for data and error correction informa...

Semiconductor device assemblies and systems with one or more dies a...

Semiconductor device and method of manufacturing semiconductor device

Display device and driving circuit structure

Chip-middle type fan-out panel-level package and packaging method t...

Mold compound dispensing system and method

Board unit and semiconductor device

Semiconductor storage device with bonding electrodes

Die stack with cascade and vertical connections

Semiconductor device package mold flow control system and method

Memory package, storage device including memory package, and storag...

Neural computing dies with stacked neural core regions

Microelectronic assembly from processed substrate

NAND memory with different pass voltage ramp rates for binary and m...

Semiconductor device including a suspended reinforcing layer and me...

Method for interconnecting stacked semiconductor devices

Semiconductor package and method for fabricating the same

Interconnection substrate, semiconductor package, and method of man...

Reducing keep-out-zone area for a semiconductor device

Non-volatile memory package and storage device comprising the same

Memory chip including control logic circuit with dynamic random-acc...

Intra-package memory die communication structures

Semiconductor package including stacked semiconductor chips

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STORAGE DEVICE

APPARATUS INCLUDING SELECTABLE CIRCUIT PLACEMENT MECHANISM AND METH...

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES

THERMALLY CONDUCTIVE SPACER

METHODS FOR MANUFACTURING A SOLAR CELL

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND ELE...

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM HAVING THE SAME

PACKAGED MEMORY DEVICE WITH OVERHANG SUPPORT STRUCTURE

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM HAVING THE SAME

SEMICONDUCTOR DEVICE INCLUDING A VERTICAL MEMORY DEVICE AND AN ELEC...

TRANSFORMER-BASED ISOLATOR WITH SENSE COIL

INTEGRATED CIRCUIT DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

MEMORY SYSTEM INCLUDING SEMICONDUCTOR CHIPS

SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING SEMICONDUCTO...

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME

STACK PACKAGES