Wire or wire-like electrical connections between devices

Industry

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H01L2225/06506

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/06506Wire or wire-like electrical connections between devices

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and a method of manufacturing the semiconduct...
- Patent number 12,368,136
- Issue date Jul 22, 2025
- Samsung Electronics Co., Ltd.
- Hyunsu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked column floorplan for NAND
- Patent number 12,367,931
- Issue date Jul 22, 2025
- SanDisk Technologies, Inc.
- Yuki Mizutani
- G11 - INFORMATION STORAGE
Information Patent Grant
Power management
- Patent number 12,367,939
- Issue date Jul 22, 2025
- Micron Technology, Inc.
- Liang Yu
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package comprising semiconductor chip with stepped po...
- Patent number 12,362,318
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Seunghyun Baik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cross stack bridge bonding devices and associated methods
- Patent number 12,362,319
- Issue date Jul 15, 2025
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 12,362,320
- Issue date Jul 15, 2025
- Advanced Semiconductor Engineering, Inc.
- Chien-Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,354,999
- Issue date Jul 8, 2025
- Kioxia Corporation
- Masayuki Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete three-dimensional processor
- Patent number 12,355,023
- Issue date Jul 8, 2025
- Hong Kong HaiCun Technology Co., Limited
- Guobiao Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-role semiconductor device substrates, semiconductor device as...
- Patent number 12,354,939
- Issue date Jul 8, 2025
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package die stacking system and method
- Patent number 12,347,810
- Issue date Jul 1, 2025
- Western Digital Technologies, Inc.
- Yazhou Zhang
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device
- Patent number 12,347,808
- Issue date Jul 1, 2025
- Kioxia Corporation
- Yasuo Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,341,131
- Issue date Jun 24, 2025
- Samsung Electronics Co., Ltd.
- Hyunmog Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor dies for semiconductor device assemblies
- Patent number 12,341,128
- Issue date Jun 24, 2025
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 12,334,177
- Issue date Jun 17, 2025
- Kioxia Corporation
- Masayoshi Tagami
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package having chip stack
- Patent number 12,327,821
- Issue date Jun 10, 2025
- Samsung Electronics Co., Ltd.
- Won-young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device including staggered semiconductor memo...
- Patent number 12,324,102
- Issue date Jun 3, 2025
- SanDisk Technologies, Inc.
- Fu Xing Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and electronic system including the same
- Patent number 12,302,576
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Jeeyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including differential height PCB
- Patent number 12,300,557
- Issue date May 13, 2025
- SanDisk Technologies, Inc.
- Nandha Kumar Mohanraj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,300,668
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Raehyung Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including shielding cover that covers molded...
- Patent number 12,293,977
- Issue date May 6, 2025
- Samsung Electronics Co., Ltd.
- Young-Woo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies with systems and methods for managing high...
- Patent number 12,293,992
- Issue date May 6, 2025
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device interface and method
- Patent number 12,277,056
- Issue date Apr 15, 2025
- Micron Technology, Inc.
- Brent Keeth
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package
- Patent number 12,272,652
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Jiwon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including through-package debug features
- Patent number 12,272,609
- Issue date Apr 8, 2025
- SanDisk Technologies, Inc.
- Nir Amir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standby exit for memory die stack
- Patent number 12,254,948
- Issue date Mar 18, 2025
- Micron Technology, Inc.
- Hari Giduturi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device interface and method
- Patent number 12,253,943
- Issue date Mar 18, 2025
- Brent Keeth
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 12,255,184
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,243,852
- Issue date Mar 4, 2025
- Kioxia Corporation
- Akihito Sawanobori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,237,302
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Kihong Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Concurrent multi-bit self-referenced read of programmable resistanc...
- Patent number 12,237,010
- Issue date Feb 25, 2025
- SanDisk Technologies, Inc.
- Nathan Franklin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT DEVICES HAVING REFLECTIVE STRUCTURES THEREIN THA...
- Publication number 20250240958
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Seongkeun Cho
- G11 - INFORMATION STORAGE
Information Patent Application
MEMORY DEVICE
- Publication number 20250239278
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Kohji Kanamori
- G11 - INFORMATION STORAGE
Information Patent Application
Discrete Three-Dimensional Processor
- Publication number 20250239580
- Publication date Jul 24, 2025
- ShenZhen CunDi Technology Co., Ltd.
- Guobiao ZHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF FABRICATING THE SAME, AND ELECTRONI...
- Publication number 20250240960
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Ju Mi Bak
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250233093
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Jungmin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-VOLATILE MEMORY DEVICE, METHOD OF MANUFACTURING THE SAME, AND M...
- Publication number 20250227933
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Garam Kim
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250226336
- Publication date Jul 10, 2025
- MEDIATEK SINGAPORE PTE LTD
- Zhigang DUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250218968
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Buwon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages And Methods Of Forming The Same
- Publication number 20250219024
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRO...
- Publication number 20250220900
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Juseong MIN
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210533
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- JIWON SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210580
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Hee Woo AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250210592
- Publication date Jun 26, 2025
- KIOXIA Corporation
- Yasuo TAKEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY SYSTEM AND SEMICONDUCTOR STORAGE DEVICE
- Publication number 20250210588
- Publication date Jun 26, 2025
- KIOXIA Corporation
- Yuichi SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210570
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Hakmin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME
- Publication number 20250201280
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Junsuk KIM
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250201755
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Kihong Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH STACK BRIDGE BONDING DEVICES AND ASSOCIATED METHODS
- Publication number 20250192102
- Publication date Jun 12, 2025
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STANDBY EXIT FOR MEMORY DIE STACK
- Publication number 20250191620
- Publication date Jun 12, 2025
- Micron Technology, Inc.
- Hari Giduturi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH DUAL CHIP-PAD STRUCTURE AND SEMICONDUCTOR P...
- Publication number 20250192035
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Keunyoung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK CHIP PACKAGE
- Publication number 20250183238
- Publication date Jun 5, 2025
- SK HYNIX INC.
- Dong Sop LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183147
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Hongjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-DENSITY SEMICONDUCTOR CHIP PACKAGE
- Publication number 20250183227
- Publication date Jun 5, 2025
- Micron Technology, Inc.
- Kelvin Aik Boo TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STORAGE DEVICE HAVING BUFFER CHIP INCLUDING INPUT/OUTPUT MACROS
- Publication number 20250174598
- Publication date May 29, 2025
- SK HYNIX INC.
- Min Soon HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250174556
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Jitaek OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250174603
- Publication date May 29, 2025
- KIOXIA Corporation
- Akihito SAWANOBORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250174617
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Junbyeong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20250167115
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Jimo GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20250159885
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- JUNGYEOM KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20250149443
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- SUJIN PARK
- H01 - BASIC ELECTRIC ELEMENTS

Wire or wire-like electrical connections between devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and a method of manufacturing the semiconduct...

Stacked column floorplan for NAND

Power management

Semiconductor package comprising semiconductor chip with stepped po...

Cross stack bridge bonding devices and associated methods

Semiconductor package structure

Semiconductor device and method of manufacturing the same

Discrete three-dimensional processor

Multi-role semiconductor device substrates, semiconductor device as...

Semiconductor device package die stacking system and method

Semiconductor device

Semiconductor package

Stacked semiconductor dies for semiconductor device assemblies

Semiconductor memory device

Semiconductor package having chip stack

Semiconductor storage device including staggered semiconductor memo...

Integrated circuit device and electronic system including the same

Semiconductor device including differential height PCB

Semiconductor package

Semiconductor package including shielding cover that covers molded...

Semiconductor assemblies with systems and methods for managing high...

Memory device interface and method

Semiconductor package

Semiconductor device including through-package debug features

Standby exit for memory die stack

Memory device interface and method

Semiconductor packages and methods of forming the same

Semiconductor package and manufacturing method thereof

Semiconductor package

Concurrent multi-bit self-referenced read of programmable resistanc...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT DEVICES HAVING REFLECTIVE STRUCTURES THEREIN THA...

MEMORY DEVICE

Discrete Three-Dimensional Processor

SEMICONDUCTOR DEVICE, METHOD OF FABRICATING THE SAME, AND ELECTRONI...

SEMICONDUCTOR PACKAGE

NON-VOLATILE MEMORY DEVICE, METHOD OF MANUFACTURING THE SAME, AND M...

SEMICONDUCTOR PACKAGE STRUCTURE

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

Semiconductor Packages And Methods Of Forming The Same

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRO...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

MEMORY SYSTEM AND SEMICONDUCTOR STORAGE DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

THROUGH STACK BRIDGE BONDING DEVICES AND ASSOCIATED METHODS

STANDBY EXIT FOR MEMORY DIE STACK

SEMICONDUCTOR CHIP WITH DUAL CHIP-PAD STRUCTURE AND SEMICONDUCTOR P...

STACK CHIP PACKAGE

SEMICONDUCTOR PACKAGE

HIGH-DENSITY SEMICONDUCTOR CHIP PACKAGE

STORAGE DEVICE HAVING BUFFER CHIP INCLUDING INPUT/OUTPUT MACROS

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME