Wire or wire-like electrical connections between devices

Industry

CPC
H01L2225/06506

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/06506Wire or wire-like electrical connections between devices

Industries

Patents Grantslast 30 patents

Information Patent Grant
Three-dimensional bonding scheme and associated systems and methods
- Patent number 12,148,736
- Issue date Nov 19, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separate inter-die connectors for data and error correction informa...
- Patent number 12,141,084
- Issue date Nov 12, 2024
- Lodestar Licensing Group LLC
- Vijayakrishna J. Vankayala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device assemblies and systems with one or more dies a...
- Patent number 12,125,816
- Issue date Oct 22, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 12,119,323
- Issue date Oct 15, 2024
- Kioxia Corporation
- Soichi Homma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and driving circuit structure
- Patent number 12,112,669
- Issue date Oct 8, 2024
- E Ink Holdings Inc.
- Shu-Fen Tsai
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Chip-middle type fan-out panel-level package and packaging method t...
- Patent number 12,094,809
- Issue date Sep 17, 2024
- Powertech Technology Inc.
- Hiroyuki Fujishima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold compound dispensing system and method
- Patent number 12,083,715
- Issue date Sep 10, 2024
- Morgan, Lewis & Bockius LLP
- Xianlu Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Board unit and semiconductor device
- Patent number 12,080,677
- Issue date Sep 3, 2024
- Kioxia Corporation
- Katsuya Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device with bonding electrodes
- Patent number 12,080,666
- Issue date Sep 3, 2024
- Kioxia Corporation
- Hideaki Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack with cascade and vertical connections
- Patent number 12,068,283
- Issue date Aug 20, 2024
- Intel Corporation
- Min-Tih Ted Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package mold flow control system and method
- Patent number 12,062,625
- Issue date Aug 13, 2024
- SanDisk Technologies, Inc.
- Hope Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory package, storage device including memory package, and storag...
- Patent number 12,057,191
- Issue date Aug 6, 2024
- Samsung Electronics Co., Ltd.
- Ji-Yeon Shin
- G11 - INFORMATION STORAGE
Information Patent Grant
Neural computing dies with stacked neural core regions
- Patent number 12,052,873
- Issue date Jul 30, 2024
- Intel Corporation
- Dmitri E. Nikonov
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Microelectronic assembly from processed substrate
- Patent number 12,051,621
- Issue date Jul 30, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
NAND memory with different pass voltage ramp rates for binary and m...
- Patent number 12,046,314
- Issue date Jul 23, 2024
- SanDisk Technologies, Inc.
- Abu Naser Zainuddin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device including a suspended reinforcing layer and me...
- Patent number 12,033,958
- Issue date Jul 9, 2024
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for interconnecting stacked semiconductor devices
- Patent number 12,033,983
- Issue date Jul 9, 2024
- Intel Corporation
- Junfeng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating the same
- Patent number 12,033,977
- Issue date Jul 9, 2024
- Samsung Electronics Co., Ltd.
- Seong Gwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection substrate, semiconductor package, and method of man...
- Patent number 12,027,452
- Issue date Jul 2, 2024
- Kioxia Corporation
- Motoshi Seto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing keep-out-zone area for a semiconductor device
- Patent number 12,021,060
- Issue date Jun 25, 2024
- Western Digital Technologies, Inc.
- Kevin Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-volatile memory package and storage device comprising the same
- Patent number 12,020,765
- Issue date Jun 25, 2024
- Samsung Electronics Co., Ltd.
- Ji Woon Park
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory chip including control logic circuit with dynamic random-acc...
- Patent number 12,016,183
- Issue date Jun 18, 2024
- Hon Hai Precision Industry Co., Ltd.
- Yan-Ru Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intra-package memory die communication structures
- Patent number 12,014,765
- Issue date Jun 18, 2024
- Micron Technology, Inc.
- Hari Giduturi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 12,009,344
- Issue date Jun 11, 2024
- SK hynix Inc.
- Jin Kyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device
- Patent number 11,996,142
- Issue date May 28, 2024
- Kioxia Corporation
- Kosuke Yanagidaira
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 11,996,392
- Issue date May 28, 2024
- SK hynix Inc.
- Eun Hye Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate and method for manufacturing the same
- Patent number 11,990,396
- Issue date May 21, 2024
- Resonac Corporation
- Kazuyuki Mitsukura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including first structure having peripheral circuit and seco...
- Patent number 11,990,450
- Issue date May 21, 2024
- Samsung Electronics Co., Ltd.
- Eunji Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Neuromorphic memory device and method
- Patent number 11,989,141
- Issue date May 21, 2024
- Micron Technology, Inc.
- Brent Keeth
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Nonvolatile memory device and storage device including the nonvolat...
- Patent number 11,984,170
- Issue date May 14, 2024
- Samsung Electronics Co., Ltd.
- Tongsung Kim
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20240389325
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Hyunmook Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY SYSTEM INCLUDING SEMICONDUCTOR CHIPS
- Publication number 20240379621
- Publication date Nov 14, 2024
- SK HYNIX INC.
- Dong Sop LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING SEMICONDUCTO...
- Publication number 20240365543
- Publication date Oct 31, 2024
- Samsung Electronics Co., Ltd.
- Taegon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME
- Publication number 20240355735
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- Hyemi LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20240357806
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- JEA-YEON LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240347437
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Jinho Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240347499
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Hongjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME
- Publication number 20240339403
- Publication date Oct 10, 2024
- Samsung Electronics Co., Ltd.
- Moorym Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGES
- Publication number 20240339436
- Publication date Oct 10, 2024
- SK HYNIX INC.
- Eun Hye DO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTRA-PACKAGE MEMORY DIE COMMUNICATION STRUCTURES
- Publication number 20240331757
- Publication date Oct 3, 2024
- Micron Technology, Inc.
- Hari Giduturi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20240321363
- Publication date Sep 26, 2024
- KIOXIA Corporation
- Kiichi TACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADSORPTION DEVICE FOR REFLOW PROCESS AND METHOD OF ATTACHING CONNEC...
- Publication number 20240321622
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- YOUNG-JA KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20240324194
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Dongjin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE
- Publication number 20240324221
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Kohji Kanamori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGING METHOD AND PACKAGING STRUCTURE OF STACKED CHIPS T...
- Publication number 20240321704
- Publication date Sep 26, 2024
- TONGFU MICROELECTRONICS CO., LTD.
- Maohua DU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...
- Publication number 20240321774
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Kitae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE AND CHIP
- Publication number 20240321828
- Publication date Sep 26, 2024
- ALi Corporation
- Liang-Cai Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-VOLATILE MEMORY DEVICE AND MEMORY SYSTEM INCLUDING THE SAME
- Publication number 20240324233
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Kyeonghoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND MANUFACTURING METHODS OF THE SAME, AND EL...
- Publication number 20240315039
- Publication date Sep 19, 2024
- Samsung Electronics Co., Ltd.
- Gyeongsik EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE
- Publication number 20240314929
- Publication date Sep 19, 2024
- KIOXIA Corporation
- Kiyokazu ISHIZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM...
- Publication number 20240312902
- Publication date Sep 19, 2024
- Samsung Electronics Co., Ltd.
- Donghoon Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package with Die Stackup and Interposer
- Publication number 20240312916
- Publication date Sep 19, 2024
- Western Digital Technologies, Inc.
- Nagesh Vodrahalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE, METHOD FOR FABRICATING THE SAME AND EL...
- Publication number 20240306383
- Publication date Sep 12, 2024
- Samsung Electronics Co., Ltd.
- Ki Joon KIM
- G11 - INFORMATION STORAGE
Information Patent Application
MICROELECTRONIC DEVICES, AND RELATED MEMORY DEVICE PACKAGES AND ELE...
- Publication number 20240304598
- Publication date Sep 12, 2024
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE
- Publication number 20240306405
- Publication date Sep 12, 2024
- KIOXIA Corporation
- Junichi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME
- Publication number 20240297117
- Publication date Sep 5, 2024
- Samsung Electronics Co., Ltd.
- Hyunjung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20240298441
- Publication date Sep 5, 2024
- Samsung Electronics Co., Ltd.
- Hyo-Jung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES AND METHODS FOR COUPLING A PLURALITY OF SEMICONDUCTOR D...
- Publication number 20240290752
- Publication date Aug 29, 2024
- Micron Technology, Inc.
- Matthew B. Leslie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE WITH INTERPLANE PAD PART
- Publication number 20240292634
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Myunghun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NONVOLATILE MEMORY PACKAGE, STORAGE DEVICE HAVING THE SAME, AND MET...
- Publication number 20240284683
- Publication date Aug 22, 2024
- Samsung Electronics Co., Ltd.
- Jungmin Seo
- H01 - BASIC ELECTRIC ELEMENTS

Wire or wire-like electrical connections between devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Three-dimensional bonding scheme and associated systems and methods

Separate inter-die connectors for data and error correction informa...

Semiconductor device assemblies and systems with one or more dies a...

Semiconductor device and method of manufacturing semiconductor device

Display device and driving circuit structure

Chip-middle type fan-out panel-level package and packaging method t...

Mold compound dispensing system and method

Board unit and semiconductor device

Semiconductor storage device with bonding electrodes

Die stack with cascade and vertical connections

Semiconductor device package mold flow control system and method

Memory package, storage device including memory package, and storag...

Neural computing dies with stacked neural core regions

Microelectronic assembly from processed substrate

NAND memory with different pass voltage ramp rates for binary and m...

Semiconductor device including a suspended reinforcing layer and me...

Method for interconnecting stacked semiconductor devices

Semiconductor package and method for fabricating the same

Interconnection substrate, semiconductor package, and method of man...

Reducing keep-out-zone area for a semiconductor device

Non-volatile memory package and storage device comprising the same

Memory chip including control logic circuit with dynamic random-acc...

Intra-package memory die communication structures

Semiconductor package including stacked semiconductor chips

Semiconductor storage device

Semiconductor package including stacked semiconductor chips

Substrate and method for manufacturing the same

Device including first structure having peripheral circuit and seco...

Neuromorphic memory device and method

Nonvolatile memory device and storage device including the nonvolat...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

MEMORY SYSTEM INCLUDING SEMICONDUCTOR CHIPS

SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING SEMICONDUCTO...

SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME

STACK PACKAGES

INTRA-PACKAGE MEMORY DIE COMMUNICATION STRUCTURES

SEMICONDUCTOR MEMORY DEVICE

ADSORPTION DEVICE FOR REFLOW PROCESS AND METHOD OF ATTACHING CONNEC...

INTEGRATED CIRCUIT DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

MEMORY DEVICE

FAN-OUT PACKAGING METHOD AND PACKAGING STRUCTURE OF STACKED CHIPS T...

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...

INTEGRATED CIRCUIT STRUCTURE AND CHIP

NON-VOLATILE MEMORY DEVICE AND MEMORY SYSTEM INCLUDING THE SAME

SEMICONDUCTOR DEVICES AND MANUFACTURING METHODS OF THE SAME, AND EL...

SEMICONDUCTOR STORAGE DEVICE

THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM...

Semiconductor Device Package with Die Stackup and Interposer

SEMICONDUCTOR MEMORY DEVICE, METHOD FOR FABRICATING THE SAME AND EL...

MICROELECTRONIC DEVICES, AND RELATED MEMORY DEVICE PACKAGES AND ELE...

SEMICONDUCTOR STORAGE DEVICE

SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

APPARATUSES AND METHODS FOR COUPLING A PLURALITY OF SEMICONDUCTOR D...

MEMORY DEVICE WITH INTERPLANE PAD PART

NONVOLATILE MEMORY PACKAGE, STORAGE DEVICE HAVING THE SAME, AND MET...