Wire or wire-like electrical connections from device to substrate

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H01L2225/0651

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/0651Wire or wire-like electrical connections from device to substrate

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Correction die for wafer/die stack
- Patent number 12,237,306
- Issue date Feb 25, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,237,302
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy structure of stacked and bonded semiconductor device
- Patent number 12,237,291
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through stack bridge bonding devices and associated methods
- Patent number 12,237,301
- Issue date Feb 25, 2025
- Micron Technology, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,237,308
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having plural stacked first chips sealed in a...
- Patent number 12,237,315
- Issue date Feb 25, 2025
- Kioxia Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,237,276
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bump interface compatible with different orientations and type...
- Patent number 12,237,287
- Issue date Feb 25, 2025
- Xilinx, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure
- Patent number 12,238,865
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating the same
- Patent number 12,237,253
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having supportive plating structures
- Patent number 12,237,275
- Issue date Feb 25, 2025
- Western Digital Technologies, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having pads with stepped structure
- Patent number 12,237,309
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package having wirebonded multi-die stack
- Patent number 12,237,305
- Issue date Feb 25, 2025
- Intel Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked-chip packages
- Patent number 12,237,319
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics assemblies employing copper in multiple locations
- Patent number 12,230,596
- Issue date Feb 18, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising stacked integrated devices with overhang
- Patent number 12,230,604
- Issue date Feb 18, 2025
- QUALCOMM Incorporated
- Krishna Vemuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided substrate with cavities for direct die-to-die intercon...
- Patent number 12,230,610
- Issue date Feb 18, 2025
- Intel Corporation
- Pooya Tadayon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die on interposer packages
- Patent number 12,230,582
- Issue date Feb 18, 2025
- Intel Corporation
- John S. Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 12,230,606
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device and semiconductor device
- Patent number 12,230,623
- Issue date Feb 18, 2025
- Kioxia Corporation
- Masaki Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device assembly in computer system
- Patent number 12,222,880
- Issue date Feb 11, 2025
- RAMBUS INC.
- Scott C. Best
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor wafer and semiconductor dies formed therefrom includi...
- Patent number 12,224,248
- Issue date Feb 11, 2025
- SanDisk Technologies, Inc.
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV check circuit with replica path
- Patent number 12,224,275
- Issue date Feb 11, 2025
- Micron Technology, Inc.
- Harutaka Makabe
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package
- Patent number 12,218,100
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Inhyo Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,218,070
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Hae-Jung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die connection system and method
- Patent number 12,218,093
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,218,096
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 12,218,092
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Moonyong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation structure with planar top surfaces
- Patent number 12,218,022
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip package structure with molding layer
- Patent number 12,218,104
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062177
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Han Min LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250062304
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- SEOKGEUN AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062283
- Publication date Feb 20, 2025
- SK HYNIX INC.
- Seong Ju LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH IC SUBSTRATE AND ELECTRONIC COMPONENT CONNECTED WITH D...
- Publication number 20250062261
- Publication date Feb 20, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes STAHR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND ELECTRONIC DEVICES INCLUDING THE SAME
- Publication number 20250062212
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Ki Won BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250062255
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Gyuseong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH NON-CONDUCTIVE FILM RETENTION ARRANGEMEN...
- Publication number 20250062269
- Publication date Feb 20, 2025
- Micron Technology, Inc.
- Kai Chieh Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING CHIP STACK STRUCTURE
- Publication number 20250062288
- Publication date Feb 20, 2025
- SK HYNIX INC.
- Seong Ju LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER-BONDED MEMORY STACKS WITH COPPER-BONDED INTERCONNECTION MEMO...
- Publication number 20250062306
- Publication date Feb 20, 2025
- Avago Technologies International Sales Pte. Limited
- Thomas Edward Dungan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20250063731
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Sangwoo HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTER-DIE CONNECTORS FOR DATA AND ERROR CORRECTION INFORMATION AND...
- Publication number 20250061067
- Publication date Feb 20, 2025
- Lodestar Licensing Group LLC
- Vijayakrishna J. Vankayala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE COMPRISING DUMMY STRUCTURE AT CORNER REGION T...
- Publication number 20250062210
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Seongyo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062248
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Yeongkwon KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250062303
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Joonho Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME ADAPTED TO BE APPLIED TO A QUAD FLAT NO-LEAD PACKAGE STR...
- Publication number 20250054844
- Publication date Feb 13, 2025
- Realtek Semiconductor Corp.
- Yu-Hsin Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING LARGE CHIPS THROUGH STITCHING
- Publication number 20250054879
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ALIGNMENT OF ELECTRICAL COMPONENTS OF AN ELECTRICAL APPAR...
- Publication number 20250054914
- Publication date Feb 13, 2025
- MICROCHIP TECHNOLOGY INCORPORATED
- Mankit Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250054889
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Jinhee HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20250054870
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- WOONCHUN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250054909
- Publication date Feb 13, 2025
- Macronix International Co., Ltd.
- Kai-Shiang HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION METHOD OF PLATING PATTERN AND SEMICONDUCTOR PACKAGE INCLU...
- Publication number 20250054773
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Yuseon HEO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BUFFER LAYER FOR CHIPS ON WAFER SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20250054898
- Publication date Feb 13, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR THREE-DIMENSIONALLY STACKING SYSTEMS ON CHI...
- Publication number 20250054910
- Publication date Feb 13, 2025
- Meta Platforms Technologies, LLC
- Huseyin Ekin Sumbul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING DIES ARRANGED FACE-TO-FACE
- Publication number 20250054912
- Publication date Feb 13, 2025
- MICROCHIP TECHNOLOGY INCORPORATED
- Julius Kovats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH ONE OR MORE DIES A...
- Publication number 20250046743
- Publication date Feb 6, 2025
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20250046691
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Ji Hwang KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20250046776
- Publication date Feb 6, 2025
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Power Switches and Power User Circuits Separated in D...
- Publication number 20250046700
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250038090
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Minjin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY SYSTEM
- Publication number 20250036583
- Publication date Jan 30, 2025
- KIOXIA Corporation
- Kenji SAKAUE
- G06 - COMPUTING CALCULATING COUNTING

Wire or wire-like electrical connections from device to substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Correction die for wafer/die stack

Semiconductor package

Dummy structure of stacked and bonded semiconductor device

Through stack bridge bonding devices and associated methods

Semiconductor package

Semiconductor device having plural stacked first chips sealed in a...

Package structure

Chip bump interface compatible with different orientations and type...

Integrated circuit structure

Semiconductor package and method for fabricating the same

Semiconductor devices having supportive plating structures

Semiconductor package having pads with stepped structure

Integrated circuit package having wirebonded multi-die stack

Stacked-chip packages

Electronics assemblies employing copper in multiple locations

Package comprising stacked integrated devices with overhang

Double-sided substrate with cavities for direct die-to-die intercon...

Embedded die on interposer packages

Semiconductor package and related methods

Method for manufacturing semiconductor device and semiconductor device

Stacked semiconductor device assembly in computer system

Semiconductor wafer and semiconductor dies formed therefrom includi...

TSV check circuit with replica path

Semiconductor package

Semiconductor package and method of fabricating the same

Semiconductor die connection system and method

Semiconductor package and method of forming the same

Semiconductor package and method of manufacturing semiconductor pac...

Passivation structure with planar top surfaces

Method for forming chip package structure with molding layer

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

PACKAGE WITH IC SUBSTRATE AND ELECTRONIC COMPONENT CONNECTED WITH D...

SEMICONDUCTOR PACKAGES AND ELECTRONIC DEVICES INCLUDING THE SAME

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICES WITH NON-CONDUCTIVE FILM RETENTION ARRANGEMEN...

SEMICONDUCTOR PACKAGE HAVING CHIP STACK STRUCTURE

COPPER-BONDED MEMORY STACKS WITH COPPER-BONDED INTERCONNECTION MEMO...

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

INTER-DIE CONNECTORS FOR DATA AND ERROR CORRECTION INFORMATION AND...

SEMICONDUCTOR PACKAGE COMPRISING DUMMY STRUCTURE AT CORNER REGION T...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES

LEAD FRAME ADAPTED TO BE APPLIED TO A QUAD FLAT NO-LEAD PACKAGE STR...

FORMING LARGE CHIPS THROUGH STITCHING

METHOD OF ALIGNMENT OF ELECTRICAL COMPONENTS OF AN ELECTRICAL APPAR...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR DEVICE

FORMATION METHOD OF PLATING PATTERN AND SEMICONDUCTOR PACKAGE INCLU...

BUFFER LAYER FOR CHIPS ON WAFER SEMICONDUCTOR DEVICE ASSEMBLIES

SYSTEMS AND METHODS FOR THREE-DIMENSIONALLY STACKING SYSTEMS ON CHI...

INTEGRATED CIRCUIT DEVICE INCLUDING DIES ARRANGED FACE-TO-FACE

SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH ONE OR MORE DIES A...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME

PACKAGING STRUCTURE AND PACKAGING METHOD

Packages with Power Switches and Power User Circuits Separated in D...

SEMICONDUCTOR PACKAGE

MEMORY SYSTEM