Wire or wire-like electrical connections from device to substrate

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H01L2225/0651

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/0651Wire or wire-like electrical connections from device to substrate

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for laser drilling process for an integrated circuit package
- Patent number 12,368,053
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Shen Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic devices with through-substrate interconnects and as...
- Patent number 12,368,096
- Issue date Jul 22, 2025
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,368,122
- Issue date Jul 22, 2025
- Samsung Electronics Co., Ltd.
- Jinhee Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and a method of manufacturing the semiconduct...
- Patent number 12,368,136
- Issue date Jul 22, 2025
- Samsung Electronics Co., Ltd.
- Hyunsu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power management
- Patent number 12,367,939
- Issue date Jul 22, 2025
- Micron Technology, Inc.
- Liang Yu
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor chip package having underfill material surrounding a...
- Patent number 12,368,127
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package comprising semiconductor chip with stepped po...
- Patent number 12,362,318
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Seunghyun Baik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of packaging semiconductor devices and packaged semiconduct...
- Patent number 12,362,260
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding with passivated silver-based contacting m...
- Patent number 12,363,878
- Issue date Jul 15, 2025
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,362,261
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 12,362,270
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kris Lipu Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser ablation-based surface property modification and contaminatio...
- Patent number 12,362,340
- Issue date Jul 15, 2025
- Intel Corporation
- Denis Myasishchev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic chip stacking using a die with double-sided interconnect...
- Patent number 12,362,325
- Issue date Jul 15, 2025
- Intel Corporation
- Anup Pancholi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 12,362,326
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a chip package
- Patent number 12,362,178
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory device and structure
- Patent number 12,362,219
- Issue date Jul 15, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,362,321
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,362,328
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Jaekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding with passivated gold contacting metal
- Patent number 12,363,877
- Issue date Jul 15, 2025
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cross stack bridge bonding devices and associated methods
- Patent number 12,362,319
- Issue date Jul 15, 2025
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 12,362,320
- Issue date Jul 15, 2025
- Advanced Semiconductor Engineering, Inc.
- Chien-Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package
- Patent number 12,362,329
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogenous integration scheme for III-V/Si and Si CMOS integrated...
- Patent number 12,355,024
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chan-Hong Chern
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with conductive via structure
- Patent number 12,354,989
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete three-dimensional processor
- Patent number 12,355,023
- Issue date Jul 8, 2025
- Hong Kong HaiCun Technology Co., Limited
- Guobiao Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-role semiconductor device substrates, semiconductor device as...
- Patent number 12,354,939
- Issue date Jul 8, 2025
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,354,980
- Issue date Jul 8, 2025
- Samsung Electronics Co., Ltd.
- Boin Noh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,355,005
- Issue date Jul 8, 2025
- Samsung Electronics Co., Ltd.
- Jongho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal routing between memory die and logic die for performing oper...
- Patent number 12,354,649
- Issue date Jul 8, 2025
- Micron Technology, Inc.
- Aliasger T. Zaidy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thermocompression bonding with passivated tin-based contacting metal
- Patent number 12,356,553
- Issue date Jul 8, 2025
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FRONT-TO-FRONT BONDING IN A STACKED MEMORY SYSTEM
- Publication number 20250239574
- Publication date Jul 24, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED POWER MANAGEMENT INTE...
- Publication number 20250239522
- Publication date Jul 24, 2025
- QUALCOMM Incorporated
- Xia LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239571
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Jaejun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239572
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Minjung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE
- Publication number 20250239278
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Kohji Kanamori
- G11 - INFORMATION STORAGE
Information Patent Application
ELECTRONIC DEVICE AND A METHOD FOR FORMING THE SAME
- Publication number 20250239531
- Publication date Jul 24, 2025
- STATS ChipPAC Pte Ltd.
- TaeWoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239554
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Wonil Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION...
- Publication number 20250239543
- Publication date Jul 24, 2025
- SK HYNIX INC.
- Jae Yong AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Discrete Three-Dimensional Processor
- Publication number 20250239580
- Publication date Jul 24, 2025
- ShenZhen CunDi Technology Co., Ltd.
- Guobiao ZHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250233093
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Jungmin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH INTERPOSER
- Publication number 20250233109
- Publication date Jul 17, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND TEST METHOD OF THE SAME
- Publication number 20250233029
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Jungwoo JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250233048
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Juno Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20250233119
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SEMICOND...
- Publication number 20250226340
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Keum Hee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250226374
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Yongbum Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20250226332
- Publication date Jul 10, 2025
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...
- Publication number 20250226290
- Publication date Jul 10, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250218918
- Publication date Jul 3, 2025
- RENESAS ELECTRONICS CORPORATION
- Ryuichi OIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250218968
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Buwon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POWER GATING ELEMENT
- Publication number 20250220928
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Chang Seok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages And Methods Of Forming The Same
- Publication number 20250219024
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH BANDWIDTH MEMORY CUBE
- Publication number 20250220926
- Publication date Jul 3, 2025
- International Business Machines Corporation
- John W Golz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20250219001
- Publication date Jul 3, 2025
- STATS ChipPAC Pte Ltd.
- JongTae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package Structure with Thermelectric Self-Coolin...
- Publication number 20250218895
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Chang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-IN-PACKAGE NETWORK PROCESSORS
- Publication number 20250219964
- Publication date Jul 3, 2025
- Altera Corporation
- Kevin Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250219019
- Publication date Jul 3, 2025
- ROHM CO., LTD.
- Akihiro KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACH FILM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250210448
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Myoungchul Eum
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DIE INCLUDING PACKAGE-SIDE CONDUCTIVE PATH
- Publication number 20250210496
- Publication date Jun 26, 2025
- Christopher Schaef
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210533
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- JIWON SHIN
- H01 - BASIC ELECTRIC ELEMENTS

Wire or wire-like electrical connections from device to substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for laser drilling process for an integrated circuit package

Microelectronic devices with through-substrate interconnects and as...

Semiconductor package

Semiconductor package and a method of manufacturing the semiconduct...

Power management

Semiconductor chip package having underfill material surrounding a...

Semiconductor package comprising semiconductor chip with stepped po...

Methods of packaging semiconductor devices and packaged semiconduct...

Thermocompression bonding with passivated silver-based contacting m...

Semiconductor device and method of manufacture

Package structure and method of fabricating the same

Laser ablation-based surface property modification and contaminatio...

Monolithic chip stacking using a die with double-sided interconnect...

Semiconductor package and method of manufacturing semiconductor pac...

Method for fabricating a chip package

3D semiconductor memory device and structure

Semiconductor package

Semiconductor package and method of fabricating the same

Thermocompression bonding with passivated gold contacting metal

Cross stack bridge bonding devices and associated methods

Semiconductor package structure

Method of fabricating semiconductor package

Heterogenous integration scheme for III-V/Si and Si CMOS integrated...

Package structure with conductive via structure

Discrete three-dimensional processor

Multi-role semiconductor device substrates, semiconductor device as...

Semiconductor package

Semiconductor package and method of fabricating the same

Signal routing between memory die and logic die for performing oper...

Thermocompression bonding with passivated tin-based contacting metal

Patents Applicationslast 30 patents

FRONT-TO-FRONT BONDING IN A STACKED MEMORY SYSTEM

INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED POWER MANAGEMENT INTE...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

MEMORY DEVICE

ELECTRONIC DEVICE AND A METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION...

Discrete Three-Dimensional Processor

SEMICONDUCTOR PACKAGE

PACKAGE ARCHITECTURE WITH INTERPOSER

SEMICONDUCTOR DEVICE AND TEST METHOD OF THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SEMICOND...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

MICROELECTRONIC ASSEMBLIES

EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...

ELECTRONIC DEVICE

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICE WITH POWER GATING ELEMENT

Semiconductor Packages And Methods Of Forming The Same

HIGH BANDWIDTH MEMORY CUBE

SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME

Integrated Circuit Package Structure with Thermelectric Self-Coolin...

SYSTEM-IN-PACKAGE NETWORK PROCESSORS

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

DIE ATTACH FILM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DIE INCLUDING PACKAGE-SIDE CONDUCTIVE PATH

SEMICONDUCTOR PACKAGE