with a graded temperature profile

Industry

CPC
H01L2224/81204

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81204with a graded temperature profile

Industries

Patents Grantslast 30 patents

Information Patent Grant
Assembly comprising hybrid interconnecting means including intermed...
- Patent number 11,011,490
- Issue date May 18, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Rabih Khazaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal pillar in a film-type seconductor package
- Patent number 10,867,948
- Issue date Dec 15, 2020
- Samsung Electronics Co., Ltd.
- Jung-woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip module with porous bonding layer and stacked structure with po...
- Patent number 10,714,448
- Issue date Jul 14, 2020
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming high routing density int...
- Patent number 10,580,749
- Issue date Mar 3, 2020
- STATS ChipPAC Pte. Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor apparatus, method for manufa...
- Patent number 10,416,557
- Issue date Sep 17, 2019
- Shin-Etsu Chemical Co., Ltd.
- Kyoko Soga
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor chip mounted on a packaging substrate
- Patent number 10,418,340
- Issue date Sep 17, 2019
- Sony Corporation
- Makoto Murai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tooling for coupling multiple electronic chips
- Patent number 10,340,239
- Issue date Jul 2, 2019
- Cufer Asset Ltd. L.L.C.
- Roger Dugas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip mounting structure
- Patent number 10,141,278
- Issue date Nov 27, 2018
- International Business Machines Corporation
- Akihiro Horibe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounted substrate, mounted-substrate production method, and mounted...
- Patent number 10,136,570
- Issue date Nov 20, 2018
- Sharp Kabushiki Kaisha
- Katsuhiro Yamaguchi
- G02 - OPTICS
Information Patent Grant
Underfill material, laminated sheet and method for producing semico...
- Patent number 10,014,235
- Issue date Jul 3, 2018
- Nitto Denko Corporation
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill material and method for manufacturing semiconductor devic...
- Patent number 9,957,411
- Issue date May 1, 2018
- Dexerials Corporation
- Takayuki Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waveguide and semiconductor packaging
- Patent number 9,960,204
- Issue date May 1, 2018
- Northrop Grumman Systems Corporation
- Chunbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip mounting structure
- Patent number 9,893,031
- Issue date Feb 13, 2018
- International Business Machines Corporation
- Akihiro Horibe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Underfill material and method for manufacturing semiconductor devic...
- Patent number 9,840,645
- Issue date Dec 12, 2017
- Dexerials Corporation
- Taichi Koyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding systems and methods of operating the same
- Patent number 9,780,066
- Issue date Oct 3, 2017
- Kulicke and Soffa Industries, Inc.
- Matthew B. Wasserman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tooling for coupling multiple electronic chips
- Patent number 9,754,907
- Issue date Sep 5, 2017
- Cufer Asset Ltd. L.L.C.
- Roger Dugas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, resin sheet, and production method for semicondu...
- Patent number 9,738,763
- Issue date Aug 22, 2017
- Toray Industries, Inc.
- Yoichi Shimba
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Thermocompression bonding systems and methods of operating the same
- Patent number 9,659,902
- Issue date May 23, 2017
- Kulicke and Soffa Industries, Inc.
- Matthew B. Wasserman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill material and method for manufacturing semiconductor devic...
- Patent number 9,653,371
- Issue date May 16, 2017
- Dexerials Corporation
- Hironobu Moriyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition and adhesive film having same, substrate provi...
- Patent number 9,617,451
- Issue date Apr 11, 2017
- Toray Industries, Inc.
- Takuro Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting apparatus and method
- Patent number 9,603,262
- Issue date Mar 21, 2017
- Shinkawa Ltd.
- Koji Hojo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating pillar solder bump
- Patent number 9,508,594
- Issue date Nov 29, 2016
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor manufacturing apparatuses comprising bonding heads
- Patent number 9,508,577
- Issue date Nov 29, 2016
- Samsung Electronics Co., Ltd.
- Byung Joon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluxing-encapsulant material for microelectronic packages assembled...
- Patent number 9,504,168
- Issue date Nov 22, 2016
- Intel Corporation
- Sivakumar Nagarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly bonding
- Patent number 9,488,853
- Issue date Nov 8, 2016
- VERILY LIFE SCIENCES LLC
- James Etzkorn
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Waveguide and semiconductor packaging
- Patent number 9,478,458
- Issue date Oct 25, 2016
- Northrop Grumman Systems Corporation
- Chunbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic device and electronic device
- Patent number 9,391,031
- Issue date Jul 12, 2016
- Fujitsu Limited
- Tetsuya Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure application apparatus and pressure application method
- Patent number 9,379,082
- Issue date Jun 28, 2016
- BONDTECH CO., LTD.
- Akira Yamauchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tooling for coupling multiple electronic chips
- Patent number 9,324,629
- Issue date Apr 26, 2016
- Cufer Asset Ltd. L.L.C.
- Roger Dugas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for handling very thin device wafers
- Patent number 9,252,111
- Issue date Feb 2, 2016
- Intel Corporation
- Kevin J. Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS FOR FLUXLESS BONDING USING AN ATMOSPHERIC PRESSURE PLASMA A...
- Publication number 20230378123
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR USING A BUFFER SHEET
- Publication number 20230095879
- Publication date Mar 30, 2023
- Showa Denko Materials Co., Ltd.
- Yuta Koseki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM-TYPE SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20190304941
- Publication date Oct 3, 2019
- Samsung Electronics Co., Ltd.
- Jung-woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MOUNTING STRUCTURE
- Publication number 20180076162
- Publication date Mar 15, 2018
- International Business Machines Corporation
- Akihiro HORIBE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TOOLING FOR COUPLING MULTIPLE ELECTRONIC CHIPS
- Publication number 20180033754
- Publication date Feb 1, 2018
- Cufer Asset Ltd. L.L.C.
- Roger Dugas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOOLING FOR COUPLING MULTIPLE ELECTRONIC CHIPS
- Publication number 20160322320
- Publication date Nov 3, 2016
- Cufer Asset Ltd. L.L.C.
- Roger Dugas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-UNIFORM HEATER FOR REDUCED TEMPERATURE GRADIENT DURING THERMAL...
- Publication number 20150060527
- Publication date Mar 5, 2015
- Weihua Tang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Forming High Routing Density Int...
- Publication number 20140319692
- Publication date Oct 30, 2014
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAVEGUIDE AND SEMICONDUCTOR PACKAGING
- Publication number 20140254979
- Publication date Sep 11, 2014
- Northrop Grumman Systems Corporation
- Chunbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D ASSEMBLY FOR INTERPOSER BOW
- Publication number 20140209666
- Publication date Jul 31, 2014
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLING THIN SILICON CHIPS ON A CONTACT LENS
- Publication number 20140085599
- Publication date Mar 27, 2014
- Google Inc.
- James Etzkorn
- G02 - OPTICS
Information Patent Application
ASSEMBLING THIN SILICON CHIPS ON A CONTACT LENS
- Publication number 20140084489
- Publication date Mar 27, 2014
- James Etzkorn
- G02 - OPTICS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE
- Publication number 20140084491
- Publication date Mar 27, 2014
- Tetsuya TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPO...
- Publication number 20130324641
- Publication date Dec 5, 2013
- SUMITOMO BAKELITE CO., LTD.
- Kenzou MAEJIMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR HANDLING VERY THIN DEVICE WAFERS
- Publication number 20130264707
- Publication date Oct 10, 2013
- Kevin J. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUXING-ENCAPSULANT MATERIAL FOR MICROELECTRONIC PACKAGES ASSEMBLED...
- Publication number 20130263446
- Publication date Oct 10, 2013
- Intel Corporation
- Sivakumar Nagarajan
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRONIC COMPONENT MOUNTING APPARATUS AND METHOD
- Publication number 20130153644
- Publication date Jun 20, 2013
- SHINKAWA LTD.
- Koji Hojo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE ADHESIVE COMPOSITION, PHOTOSENSITIVE ADHESIVE FILM,...
- Publication number 20130105998
- Publication date May 2, 2013
- TORAY INDUSTRIES, INC.
- Kazuyuki Matsumura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FLIP CHIP PACKAGE MANUFACTURING METHOD
- Publication number 20130065362
- Publication date Mar 14, 2013
- ABLEPRINT TECHNOLOGY CO., LTD.
- HORNG CHIH HORNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip Chip Interconnection having Narrow Interconnection Sites on th...
- Publication number 20130026628
- Publication date Jan 31, 2013
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming High Routing Density Int...
- Publication number 20120241946
- Publication date Sep 27, 2012
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Flip Chip Interconnection Having Narrow Interconnection Sites on th...
- Publication number 20120211880
- Publication date Aug 23, 2012
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electrical Component Having an Electrical Connection Arrangement an...
- Publication number 20120212918
- Publication date Aug 23, 2012
- MICRO SYSTEMS ENGINEERING GMBH
- Rainer Dohle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE APPLICATION APPARATUS AND PRESSURE APPLICATION METHOD
- Publication number 20120127485
- Publication date May 24, 2012
- BONDTECH CO., LTD.
- Akira Yamauchi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ADHESIVE COMPOSITION, ADHESIVE SHEET, CIRCUIT BOARD AND SEMICONDUCT...
- Publication number 20120129988
- Publication date May 24, 2012
- TORAY INDUSTRIES, INC.
- Koichi Fujimaru
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Thermal Compressive Bonding with Separate Die-Attach and Reflow Pro...
- Publication number 20120111922
- Publication date May 10, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING APPARATUS
- Publication number 20120091186
- Publication date Apr 19, 2012
- TOKYO ELECTRON LIMITED
- Naoki AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20120091187
- Publication date Apr 19, 2012
- TOKYO ELECTRON LIMITED
- Naoki AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPO...
- Publication number 20120061820
- Publication date Mar 15, 2012
- Kenzou Maejima
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
IN-SITU MELT AND REFLOW PROCESS FOR FORMING FLIP-CHIP INTERCONNECTI...
- Publication number 20110287560
- Publication date Nov 24, 2011
- ORION SYSTEMS INTEGRATION PTE LTD
- Hwee Seng Chew
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

with a graded temperature profile

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Assembly comprising hybrid interconnecting means including intermed...

Metal pillar in a film-type seconductor package

Chip module with porous bonding layer and stacked structure with po...

Semiconductor device and method of forming high routing density int...

Method for manufacturing semiconductor apparatus, method for manufa...

Semiconductor chip mounted on a packaging substrate

Tooling for coupling multiple electronic chips

Chip mounting structure

Mounted substrate, mounted-substrate production method, and mounted...

Underfill material, laminated sheet and method for producing semico...

Underfill material and method for manufacturing semiconductor devic...

Waveguide and semiconductor packaging

Chip mounting structure

Underfill material and method for manufacturing semiconductor devic...

Thermocompression bonding systems and methods of operating the same

Tooling for coupling multiple electronic chips

Resin composition, resin sheet, and production method for semicondu...

Thermocompression bonding systems and methods of operating the same

Underfill material and method for manufacturing semiconductor devic...

Adhesive composition and adhesive film having same, substrate provi...

Electronic component mounting apparatus and method

Fabricating pillar solder bump

Semiconductor manufacturing apparatuses comprising bonding heads

Fluxing-encapsulant material for microelectronic packages assembled...

Assembly bonding

Waveguide and semiconductor packaging

Method for manufacturing electronic device and electronic device

Pressure application apparatus and pressure application method

Tooling for coupling multiple electronic chips

Method for handling very thin device wafers

Patents Applicationslast 30 patents

SYSTEMS FOR FLUXLESS BONDING USING AN ATMOSPHERIC PRESSURE PLASMA A...

METHOD FOR USING A BUFFER SHEET

FILM-TYPE SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP MOUNTING STRUCTURE

TOOLING FOR COUPLING MULTIPLE ELECTRONIC CHIPS

TOOLING FOR COUPLING MULTIPLE ELECTRONIC CHIPS

NON-UNIFORM HEATER FOR REDUCED TEMPERATURE GRADIENT DURING THERMAL...

Semiconductor Device and Method of Forming High Routing Density Int...

WAVEGUIDE AND SEMICONDUCTOR PACKAGING

3D ASSEMBLY FOR INTERPOSER BOW

ASSEMBLING THIN SILICON CHIPS ON A CONTACT LENS

ASSEMBLING THIN SILICON CHIPS ON A CONTACT LENS

METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPO...

METHOD FOR HANDLING VERY THIN DEVICE WAFERS

FLUXING-ENCAPSULANT MATERIAL FOR MICROELECTRONIC PACKAGES ASSEMBLED...

ELECTRONIC COMPONENT MOUNTING APPARATUS AND METHOD

PHOTOSENSITIVE ADHESIVE COMPOSITION, PHOTOSENSITIVE ADHESIVE FILM,...

FLIP CHIP PACKAGE MANUFACTURING METHOD

Flip Chip Interconnection having Narrow Interconnection Sites on th...

Semiconductor Device and Method of Forming High Routing Density Int...

Flip Chip Interconnection Having Narrow Interconnection Sites on th...

Electrical Component Having an Electrical Connection Arrangement an...

PRESSURE APPLICATION APPARATUS AND PRESSURE APPLICATION METHOD

ADHESIVE COMPOSITION, ADHESIVE SHEET, CIRCUIT BOARD AND SEMICONDUCT...

Thermal Compressive Bonding with Separate Die-Attach and Reflow Pro...

BONDING APPARATUS

BONDING APPARATUS AND BONDING METHOD

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPO...

IN-SITU MELT AND REFLOW PROCESS FOR FORMING FLIP-CHIP INTERCONNECTI...