with a mechanical process

Industry

CPC
H01L2224/43847

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/43847with a mechanical process

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,901,337
- Issue date Feb 13, 2024
- Kioxia Corporation
- Yasuo Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising wire bonds configured as a heat spreader
- Patent number 11,545,411
- Issue date Jan 3, 2023
- QUALCOMM Incorporated
- Wen Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,685,934
- Issue date Jun 16, 2020
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heavy-wire bond arrangement and method for producing same
- Patent number 9,992,861
- Issue date Jun 5, 2018
- Technische Universitat Berlin
- Andreas Middendorf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of forming an electronic device including a ball bond
- Patent number 9,812,424
- Issue date Nov 7, 2017
- Semiconductor Components Industries, LLC
- Harold G. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat no lead package and production method thereof
- Patent number 9,275,941
- Issue date Mar 1, 2016
- TIANSHUI HUATIAN TECHNOLOGY CO.
- Wenhui Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Core-jacket bonding wire
- Patent number 9,236,166
- Issue date Jan 12, 2016
- Heraeus Deutschland GmbH & Co. KG
- Eugen Milke
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Method and device for fabricating bonding wires on the basis of mic...
- Patent number 8,561,446
- Issue date Oct 22, 2013
- GLOBALFOUNDRIES Inc.
- Matthias Lehr
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Semiconductor device bonding wire and wire bonding method
- Patent number 8,102,061
- Issue date Jan 24, 2012
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FAULT ISOLATION ANALYSIS METHOD AND COMPUTER-READABLE STORAGE MEDIUM
- Publication number 20220254691
- Publication date Aug 11, 2022
- Changxin Memory Technologies, Inc.
- Yuanjie XU
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220238490
- Publication date Jul 28, 2022
- KIOXIA Corporation
- Yasuo OTSUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING WIRE BONDS CONFIGURED AS A HEAT SPREADER
- Publication number 20220037224
- Publication date Feb 3, 2022
- QUALCOMM Incorporated
- Wen YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190013289
- Publication date Jan 10, 2019
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND PROCESS OF FORMING THE SAME
- Publication number 20170179074
- Publication date Jun 22, 2017
- Semiconductor Components Industries, LLC
- Harold G. ANDERSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUAD FLAT NO LEAD PACKAGE AND PRODUCTION METHOD THEREOF
- Publication number 20150102476
- Publication date Apr 16, 2015
- HUATIAN TECHNOLOGY (XI'AN) CO., LTD.
- Wenhui Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Semiconductor Module
- Publication number 20140370663
- Publication date Dec 18, 2014
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAVY-WIRE BOND ARRANGEMENT AND METHOD FOR PRODUCING SAME
- Publication number 20130220673
- Publication date Aug 29, 2013
- Technische Universitaet Berlin
- Andreas Middendorf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORE-JACKET BONDING WIRE
- Publication number 20130213689
- Publication date Aug 22, 2013
- HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
- Eugen Milke
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
ALUMINUM RIBBON FOR ULTRASONIC BONDING
- Publication number 20130164559
- Publication date Jun 27, 2013
- TANAKA DENSHI KOGYO K.K.
- Michitaka Mikami
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20120104613
- Publication date May 3, 2012
- NIPPON MICROMETAL CORPORATION
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE BONDING WIRE AND WIRE BONDING METHOD
- Publication number 20100327450
- Publication date Dec 30, 2010
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR FABRICATING BONDING WIRES ON THE BASIS OF MIC...
- Publication number 20100107717
- Publication date May 6, 2010
- Matthias Lehr
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
Multilayer bonding ribbon
- Publication number 20070290373
- Publication date Dec 20, 2007
- Manfred Reinold
- H01 - BASIC ELECTRIC ELEMENTS

with a mechanical process

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method of manufacturing the same

Package comprising wire bonds configured as a heat spreader

Semiconductor package device and method of manufacturing the same

Heavy-wire bond arrangement and method for producing same

Process of forming an electronic device including a ball bond

Quad flat no lead package and production method thereof

Core-jacket bonding wire

Method and device for fabricating bonding wires on the basis of mic...

Semiconductor device bonding wire and wire bonding method

Patents Applicationslast 30 patents

FAULT ISOLATION ANALYSIS METHOD AND COMPUTER-READABLE STORAGE MEDIUM

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PACKAGE COMPRISING WIRE BONDS CONFIGURED AS A HEAT SPREADER

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICES AND PROCESS OF FORMING THE SAME

QUAD FLAT NO LEAD PACKAGE AND PRODUCTION METHOD THEREOF

Method for Producing a Semiconductor Module

HEAVY-WIRE BOND ARRANGEMENT AND METHOD FOR PRODUCING SAME

CORE-JACKET BONDING WIRE

ALUMINUM RIBBON FOR ULTRASONIC BONDING

BONDING WIRE FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE BONDING WIRE AND WIRE BONDING METHOD

METHOD AND DEVICE FOR FABRICATING BONDING WIRES ON THE BASIS OF MIC...

Multilayer bonding ribbon