with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material

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CPC
H01L2224/45198

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/45198with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method and system for composite bond wires
- Patent number 8,134,073
- Issue date Mar 13, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chris Wyland
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
On-chip magnetic components
- Patent number 7,719,112
- Issue date May 18, 2010
- University of Central Florida Research Foundation, Inc.
- Zheng John Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire and bonded connection
- Patent number 7,319,196
- Issue date Jan 15, 2008
- EUPEC Europaeische Gesellschaft fur Leistungshalbleiter mbH
- Guy LeFranc
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND SYSTEM FOR COMPOSITE BOND WIRES
- Publication number 20090301757
- Publication date Dec 10, 2009
- Chris Wyland
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
On-Chip Magnetic Components
- Publication number 20080029845
- Publication date Feb 7, 2008
- UNIVERSITY OF CENTRAL FLORIDA RESEARCH FOUNDATION
- Zheng John Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding wire and bonded connection
- Publication number 20060055041
- Publication date Mar 16, 2006
- Eupec Europaische Gesellschaft fur Leistungshalbleiter mbH
- Guy LeFranc
- H01 - BASIC ELECTRIC ELEMENTS