with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material

Industry

CPC
H01L2924/15798

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/15798with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material

Industries

Patents Grantslast 30 patents

Information Patent Grant
Laminate and electronic device
- Patent number 11,798,863
- Issue date Oct 24, 2023
- Sekisui Chemical Co., Ltd.
- Kouji Ashiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a trench penetrating a main body
- Patent number 10,056,325
- Issue date Aug 21, 2018
- Advanced Semiconductor Engineering, Inc.
- Chin-Li Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Miniaturized SMD diode package and process for producing the same
- Patent number 9,691,736
- Issue date Jun 27, 2017
- SFI ELECTRONICS TECHNOLOGY INC.
- Ching-Hohn Lien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Miniaturized SMD diode package and process for producing the same
- Patent number 9,691,735
- Issue date Jun 27, 2017
- SFI Electronics Technology Inc.
- Ching-Hohn Lien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including interconnection members
- Patent number 9,478,515
- Issue date Oct 25, 2016
- SK hynix Inc.
- Jung Tae Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package with conductive clip
- Patent number 9,118,126
- Issue date Aug 25, 2015
- International Rectifier Corporation
- Hsueh-Rong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional structure in which wiring is provided on its surface
- Patent number 9,070,393
- Issue date Jun 30, 2015
- Panasonic Corporation
- Shingo Yoshioka
- G11 - INFORMATION STORAGE
Information Patent Grant
Interposer and electronic device using the same
- Patent number 8,975,529
- Issue date Mar 10, 2015
- Kyocera Corporation
- Katsura Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device reducing risks of a wire short-circuit and a w...
- Patent number 8,975,760
- Issue date Mar 10, 2015
- PS4 Luxco S.A.R.L.
- Shori Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic integration double-ended converter
- Patent number 8,822,276
- Issue date Sep 2, 2014
- Huawei Technologies Co., Ltd.
- Leif Bergstedt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a chip bonding using a resin adhesive f...
- Patent number 8,436,479
- Issue date May 7, 2013
- Sumitomo Bakelite Co., Ltd.
- Akitsugu Sasaki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
IGBT power semiconductor package having a conductive clip
- Patent number 8,354,733
- Issue date Jan 15, 2013
- International Rectifier Corporation
- Hsueh-Rong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and electronic device
- Patent number 8,125,789
- Issue date Feb 28, 2012
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing electronic component package
- Patent number 7,816,176
- Issue date Oct 19, 2010
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wafer level package with die receiving through-hole and method of t...
- Patent number 7,812,434
- Issue date Oct 12, 2010
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a device having a contacting structure
- Patent number 7,427,532
- Issue date Sep 23, 2008
- Siemens Aktiengesellschaft
- Norbert Seliger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding to dual metal covered pad surfaces
- Patent number 6,759,597
- Issue date Jul 6, 2004
- International Business Machines Corporation
- Lawrence Richard Cutting
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Window-type multi-chip semiconductor package
- Patent number 6,703,713
- Issue date Mar 9, 2004
- Siliconware Precision Industries Co., Ltd.
- Wei-Cheng Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave package
- Patent number 6,617,946
- Issue date Sep 9, 2003
- Skyworks Solutions, Inc.
- John D. Kennedy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with stacked semiconductor chips
- Patent number 6,600,221
- Issue date Jul 29, 2003
- NEC Electronics Corporation
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding to dual metal covered pad surfaces
- Patent number 6,519,845
- Issue date Feb 18, 2003
- International Business Machines Corporation
- Lawrence Richard Cutting
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package and method of making same
- Patent number 6,426,565
- Issue date Jul 30, 2002
- International Business Machines Corporation
- Ashwinkumar C. Bhatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-board BGA package
- Patent number 6,385,049
- Issue date May 7, 2002
- Walsin Advanced Electronics LTD
- Hung Chia-Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LAMINATE AND ELECTRONIC DEVICE
- Publication number 20200388551
- Publication date Dec 10, 2020
- Sekisui Chemical Co., Ltd
- Kouji ASHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20170133311
- Publication date May 11, 2017
- Advanced Semiconductor Engineering, Inc.
- Chin-Li KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING INTERCONNECTION MEMBERS
- Publication number 20160307867
- Publication date Oct 20, 2016
- SK HYNIX INC.
- Jung Tae JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MINIATURIZED SMD DIODE PACKAGE AND PROCESS FOR PRODUCING THE SAME
- Publication number 20160035697
- Publication date Feb 4, 2016
- SFI Electronics Technology Inc.
- Ching-Hohn LIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STRUCTURE IN WHICH WIRING IS PROVIDED ON ITS SURFACE
- Publication number 20140183751
- Publication date Jul 3, 2014
- PANASONIC CORPORATION
- Shingo YOSHIOKA
- G11 - INFORMATION STORAGE
Information Patent Application
Power Semiconductor Package with Conductive Clip
- Publication number 20130140602
- Publication date Jun 6, 2013
- International Rectifier Corporation
- Hsueh-Rong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE REDUCING RISKS OF A WIRE SHORT-CIRCUIT AND A W...
- Publication number 20130037941
- Publication date Feb 14, 2013
- Elpida Memory, Inc.
- Shori FUJIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND ELECTRONIC DEVICE USING THE SAME
- Publication number 20130027895
- Publication date Jan 31, 2013
- KYOCERA CORPORATION
- Katsura Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE STRUCTURE CONFIGURED BY...
- Publication number 20130026650
- Publication date Jan 31, 2013
- Osamu Yamagata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR POWER MODULE AND POWER MODULE
- Publication number 20120298408
- Publication date Nov 29, 2012
- MITSUBISHI MATERIALS CORPORATION
- Yoshiyuki Nagatomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC INTEGRATION DOUBLE-ENDED CONVERTER
- Publication number 20120241959
- Publication date Sep 27, 2012
- Huawei Technologies Co., Ltd
- Leif Bergstedt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IGBT Power Semiconductor Package Having a Conductive Clip
- Publication number 20120223415
- Publication date Sep 6, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Hsueh-Rong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20110180939
- Publication date Jul 28, 2011
- Akitsugu Sasaki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Module with Flat Construction and Method for Placing Components
- Publication number 20090174054
- Publication date Jul 9, 2009
- Christian Block
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE ON CHIP PACKAGE TO SUBSTANTIALLY MATCH STIFFNESS OF CHIP
- Publication number 20090045501
- Publication date Feb 19, 2009
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing electronic component package
- Publication number 20080295328
- Publication date Dec 4, 2008
- HEADWAY TECHNOLOGIES, INC.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20080223608
- Publication date Sep 18, 2008
- Fujitsu Limited
- Takao NISHIMURA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Wafer level package with die receiving through-hole and method of t...
- Publication number 20080157396
- Publication date Jul 3, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20080073786
- Publication date Mar 27, 2008
- Matsushita Electric Industrial Co., Ltd.
- Manabu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Internal connection system for power semiconductors comprising larg...
- Publication number 20060252253
- Publication date Nov 9, 2006
- Norbert Seliger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulation of circuit components to reduce thermal cycling stress
- Publication number 20060189119
- Publication date Aug 24, 2006
- Michael Jin
- G02 - OPTICS
Information Patent Application
Semiconductor device
- Publication number 20020053727
- Publication date May 9, 2002
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microwave package
- Publication number 20010032740
- Publication date Oct 25, 2001
- John D. Kennedy
- H01 - BASIC ELECTRIC ELEMENTS

with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Laminate and electronic device

Semiconductor package having a trench penetrating a main body

Miniaturized SMD diode package and process for producing the same

Miniaturized SMD diode package and process for producing the same

Semiconductor packages including interconnection members

Power semiconductor package with conductive clip

Three-dimensional structure in which wiring is provided on its surface

Interposer and electronic device using the same

Semiconductor device reducing risks of a wire short-circuit and a w...

Magnetic integration double-ended converter

Semiconductor device having a chip bonding using a resin adhesive f...

IGBT power semiconductor package having a conductive clip

Wiring substrate and electronic device

Method of manufacturing electronic component package

Wafer level package with die receiving through-hole and method of t...

Method of manufacturing a device having a contacting structure

Wire bonding to dual metal covered pad surfaces

Window-type multi-chip semiconductor package

Microwave package

Semiconductor device with stacked semiconductor chips

Wire bonding to dual metal covered pad surfaces

Electronic package and method of making same

Multi-board BGA package

Patents Applicationslast 30 patents

LAMINATE AND ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGES INCLUDING INTERCONNECTION MEMBERS

MINIATURIZED SMD DIODE PACKAGE AND PROCESS FOR PRODUCING THE SAME

THREE-DIMENSIONAL STRUCTURE IN WHICH WIRING IS PROVIDED ON ITS SURFACE

Power Semiconductor Package with Conductive Clip

SEMICONDUCTOR DEVICE REDUCING RISKS OF A WIRE SHORT-CIRCUIT AND A W...

INTERPOSER AND ELECTRONIC DEVICE USING THE SAME

SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE STRUCTURE CONFIGURED BY...

SUBSTRATE FOR POWER MODULE AND POWER MODULE

MAGNETIC INTEGRATION DOUBLE-ENDED CONVERTER

IGBT Power Semiconductor Package Having a Conductive Clip

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Module with Flat Construction and Method for Placing Components

STRUCTURE ON CHIP PACKAGE TO SUBSTANTIALLY MATCH STIFFNESS OF CHIP

Method of manufacturing electronic component package

WIRING SUBSTRATE AND ELECTRONIC DEVICE

Wafer level package with die receiving through-hole and method of t...

Semiconductor device and method of manufacturing the same

Internal connection system for power semiconductors comprising larg...

Encapsulation of circuit components to reduce thermal cycling stress

Semiconductor device

Microwave package