with a principal constituent of the material being a liquid not provided for in groups H01L2224/804 - H01L2224/80491

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CPC
H01L2224/80494

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/80494with a principal constituent of the material being a liquid not provided for in groups H01L2224/804 - H01L2224/80491

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Patents Grantslast 30 patents

Information Patent Grant
Method of liquid assisted micro cold binding
- Patent number 10,672,736
- Issue date Jun 2, 2020
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents