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with a principal constituent of the material being a liquid not provided for in groups H01L2224/804 - H01L2224/80491
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CPC
H01L2224/80494
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/80494
with a principal constituent of the material being a liquid not provided for in groups H01L2224/804 - H01L2224/80491
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Patent Grant
Method of liquid assisted micro cold binding
Patent number
10,672,736
Issue date
Jun 2, 2020
MIKRO MESA TECHNOLOGY CO., LTD.
Li-Yi Chen
H01 - BASIC ELECTRIC ELEMENTS