with a principal constituent of the material being a liquid not provided for in groups H01L2224/292 - H01L2224/29291

Industry

CPC
H01L2224/29294

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29294with a principal constituent of the material being a liquid not provided for in groups H01L2224/292 - H01L2224/29291

Industries

Patents Grantslast 30 patents

Information Patent Grant
Silver sintering composition containing copper alloy for metal bonding
- Patent number 12,051,522
- Issue date Jul 30, 2024
- Henkel AG & Co. KGaA
- Wei Yao
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,990,435
- Issue date May 21, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 11,961,779
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC)
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with routing patch and conductive interconnec...
- Patent number 11,901,335
- Issue date Feb 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing bonded object and semiconductor device and cop...
- Patent number 11,890,681
- Issue date Feb 6, 2024
- Resonac Corporation
- Yuki Kawana
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Process and device for low-temperature pressure sintering
- Patent number 11,776,932
- Issue date Oct 3, 2023
- Danfoss Silicon Power GmbH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Memory devices with controllers under memory packages and associate...
- Patent number 11,658,154
- Issue date May 23, 2023
- Micron Technology, Inc.
- Seng Kim Ye
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Process and device for low-temperature pressure sintering
- Patent number 11,626,383
- Issue date Apr 11, 2023
- Danfoss Silicon Power GmbH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 11,557,530
- Issue date Jan 17, 2023
- Semiconductor Components Industries, LLC
- Swee Har Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternative compositions for high temperature soldering applications
- Patent number 11,440,142
- Issue date Sep 13, 2022
- Ormet Circuits, Inc.
- Catherine A Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for mounting an electrical component in which a hood is used...
- Patent number 11,424,170
- Issue date Aug 23, 2022
- Siemens Aktiengesellschaft
- Nora Busche
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced solder alloys for electronic interconnects
- Patent number 11,411,150
- Issue date Aug 9, 2022
- Alpha Assembly Solutions Inc.
- Morgana de Avila Ribas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,393,734
- Issue date Jul 19, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor package with high routing density patch
- Patent number 11,289,451
- Issue date Mar 29, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a device fixed on a substrate with an a...
- Patent number 11,233,029
- Issue date Jan 25, 2022
- Mitsubishi Electric Corporation
- Kazuo Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit package, an electronic circuit package, and methods for enc...
- Patent number 11,189,537
- Issue date Nov 30, 2021
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 11,037,852
- Issue date Jun 15, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly process for circuit carrier and circuit carrier
- Patent number 10,991,632
- Issue date Apr 27, 2021
- A.B. MIKROELEKTRONIK GESELLSCHAFT MIT BESCHRAENKTER HAFTUNG
- Andreas Karch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with multi-layer resin structure and semiconductor device...
- Patent number 10,943,857
- Issue date Mar 9, 2021
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for creating a bond between objects based on f...
- Patent number 10,923,454
- Issue date Feb 16, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dam for three-dimensional integrated circuit
- Patent number 10,867,878
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for processing high electron mobility transistor (HEMT)
- Patent number 10,861,947
- Issue date Dec 8, 2020
- RFHIC CORPORATION
- Won Sang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding material and bonding method using same
- Patent number 10,821,558
- Issue date Nov 3, 2020
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Joint manufacturing method
- Patent number 10,821,543
- Issue date Nov 3, 2020
- Nitto Denko Corporation
- Nao Kamakura
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Electronic device and mounting structure of the same
- Patent number 10,790,258
- Issue date Sep 29, 2020
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module having power device connected between heat sink and dr...
- Patent number 10,763,244
- Issue date Sep 1, 2020
- Siemens Aktiengesellschaft
- Karl Weidner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a package having a power semiconductor chip
- Patent number 10,734,250
- Issue date Aug 4, 2020
- Infineon Technologies Austria AG
- Thomas Basler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ag underlayer-attached metallic member, Ag underlayer-attached insu...
- Patent number 10,734,297
- Issue date Aug 4, 2020
- Mitsubishi Materials Corporation
- Shuji Nishimoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240304577
- Publication date Sep 12, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
- Publication number 20240266324
- Publication date Aug 8, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC PACKAGING WITH HOT SPOT THERMAL MANAGEMENT FEATURES
- Publication number 20240222218
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co, LTD.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Core-Shell Particle Die-Attach Material
- Publication number 20240182757
- Publication date Jun 6, 2024
- Wolfspeed, Inc.
- Afshin Dadvand
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PACKAGING ARCHITECTURE WITH COAXIAL PILLARS FOR HIGH-SPEED INTERCON...
- Publication number 20230420412
- Publication date Dec 28, 2023
- Intel Corporation
- Hiroki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-DENSIFYING NANO-SILVER PASTE AND A METHOD OF FORMING INTERCONN...
- Publication number 20230230950
- Publication date Jul 20, 2023
- NANO AND ADVANCED MATERIALS INSTITUTE LIMITED
- Yuechen WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILVER SINTERING COMPOSITION CONTAINING COPPER ALLOY FOR METAL BONDING
- Publication number 20220319733
- Publication date Oct 6, 2022
- Henkel AG & Co., KGaA
- Wei Yao
- B22 - CASTING POWDER METALLURGY
Information Patent Application
BONDING FILM, TAPE FOR WAFER PROCESSING, METHOD FOR PRODUCING BONDE...
- Publication number 20220139864
- Publication date May 5, 2022
- FURUKAWA ELECTRIC CO., LTD.
- Norzafriza NITTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING BONDED OBJECT AND SEMICONDUCTOR DEVICE AND COP...
- Publication number 20220028824
- Publication date Jan 27, 2022
- Showa Denko Materials Co., Ltd.
- Yuki KAWANA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...
- Publication number 20210167035
- Publication date Jun 3, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS AND DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING
- Publication number 20210104488
- Publication date Apr 8, 2021
- DANFOSS SILICON POWER GMBH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHODS FOR PROCESSING HIGH ELECTRON MOBILITY TRANSISTOR (HEMT)
- Publication number 20200287004
- Publication date Sep 10, 2020
- RFHIC Corporation
- Won Sang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY
- Publication number 20200219848
- Publication date Jul 9, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Attach Methods and Semiconductor Devices Manufactured based on...
- Publication number 20190348347
- Publication date Nov 14, 2019
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190214361
- Publication date Jul 11, 2019
- ROHM CO., LTD.
- Motoharu HAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Packaging with Hot Spot Thermal Management Features
- Publication number 20190096781
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
- Publication number 20190043829
- Publication date Feb 7, 2019
- Amkor Technology, Inc.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING TO A BOARD
- Publication number 20190013308
- Publication date Jan 10, 2019
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dam for Three-Dimensional Integrated Circuit
- Publication number 20180323118
- Publication date Nov 8, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A SUBSTRATE ARRANGEMENT, SUBSTRATE ARRANGEMENT...
- Publication number 20180286831
- Publication date Oct 4, 2018
- Heraeus Deutschland GmbH & Co. KG
- Andreas HINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP AND RELATED METHODS
- Publication number 20180197836
- Publication date Jul 12, 2018
- Semiconductor Components Industries, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR CHIPS MOUNTED OVER BOT...
- Publication number 20170373021
- Publication date Dec 28, 2017
- Micron Technology, Inc.
- Sensho Usami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Fabrication Thereof
- Publication number 20170365539
- Publication date Dec 21, 2017
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Packaging with Hot Spot Thermal Management Features
- Publication number 20170345732
- Publication date Nov 30, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT WAFER LEVEL CHIP PACKAGE STRUCTURE
- Publication number 20170338154
- Publication date Nov 23, 2017
- NIKO SEMICONDUCTOR CO., LTD.
- CHIH-CHENG HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170323848
- Publication date Nov 9, 2017
- RENESAS ELECTRONICS CORPORATION
- Takanori Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING MATERIAL AND BONDING METHOD USING SAME
- Publication number 20170252874
- Publication date Sep 7, 2017
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MATERIAL AND BONDING METHOD USING SAME
- Publication number 20170120395
- Publication date May 4, 2017
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Satoru Kurita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND MANUFACTURING METHOD FOR ELECTRONIC COMPONENT
- Publication number 20140374775
- Publication date Dec 25, 2014
- Takashi SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140374890
- Publication date Dec 25, 2014
- Renesas Electronics Corporation
- Takanori Yamashita
- H01 - BASIC ELECTRIC ELEMENTS

with a principal constituent of the material being a liquid not provided for in groups H01L2224/292 - H01L2224/29291

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Silver sintering composition containing copper alloy for metal bonding

Fingerprint sensor and manufacturing method thereof

3DIC packaging with hot spot thermal management features

Semiconductor package with routing patch and conductive interconnec...

Method for producing bonded object and semiconductor device and cop...

Process and device for low-temperature pressure sintering

Memory devices with controllers under memory packages and associate...

Process and device for low-temperature pressure sintering

Semiconductor devices and methods of making the same

Chip assembly

Alternative compositions for high temperature soldering applications

Method for mounting an electrical component in which a hood is used...

Advanced solder alloys for electronic interconnects

Fingerprint sensor and manufacturing method thereof

Sintering materials and attachment methods using same

Semiconductor package with high routing density patch

Semiconductor device having a device fixed on a substrate with an a...

Circuit package, an electronic circuit package, and methods for enc...

3DIC packaging with hot spot thermal management features

Assembly process for circuit carrier and circuit carrier

Substrate with multi-layer resin structure and semiconductor device...

Method and apparatus for creating a bond between objects based on f...

Dam for three-dimensional integrated circuit

Methods for processing high electron mobility transistor (HEMT)

Bonding material and bonding method using same

Joint manufacturing method

Electronic device and mounting structure of the same

Power module having power device connected between heat sink and dr...

Method of manufacturing a package having a power semiconductor chip

Ag underlayer-attached metallic member, Ag underlayer-attached insu...

Patents Applicationslast 30 patents

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH

3DIC PACKAGING WITH HOT SPOT THERMAL MANAGEMENT FEATURES

Core-Shell Particle Die-Attach Material

PACKAGING ARCHITECTURE WITH COAXIAL PILLARS FOR HIGH-SPEED INTERCON...

SELF-DENSIFYING NANO-SILVER PASTE AND A METHOD OF FORMING INTERCONN...

SILVER SINTERING COMPOSITION CONTAINING COPPER ALLOY FOR METAL BONDING

BONDING FILM, TAPE FOR WAFER PROCESSING, METHOD FOR PRODUCING BONDE...

METHOD FOR PRODUCING BONDED OBJECT AND SEMICONDUCTOR DEVICE AND COP...

METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...

PROCESS AND DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING

METHODS FOR PROCESSING HIGH ELECTRON MOBILITY TRANSISTOR (HEMT)

METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY

Die Attach Methods and Semiconductor Devices Manufactured based on...

SEMICONDUCTOR DEVICE

3DIC Packaging with Hot Spot Thermal Management Features

SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH

DIE BONDING TO A BOARD

Dam for Three-Dimensional Integrated Circuit

METHOD FOR PRODUCING A SUBSTRATE ARRANGEMENT, SUBSTRATE ARRANGEMENT...

CLIP AND RELATED METHODS

SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR CHIPS MOUNTED OVER BOT...

Semiconductor Packages and Methods of Fabrication Thereof

3DIC Packaging with Hot Spot Thermal Management Features

FAN-OUT WAFER LEVEL CHIP PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

BONDING MATERIAL AND BONDING METHOD USING SAME

BONDING MATERIAL AND BONDING METHOD USING SAME

ELECTRONIC COMPONENT AND MANUFACTURING METHOD FOR ELECTRONIC COMPONENT

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME