with a principal constituent of the material being a metal or a metalloid

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H01L2224/814

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/814with a principal constituent of the material being a metal or a metalloid

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Chip packaging structure and related inner lead bonding method
- Patent number 12,334,470
- Issue date Jun 17, 2025
- Sitronix Technology Corp.
- Ying-Chen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,327,784
- Issue date Jun 10, 2025
- Samsung Electronics Co., Ltd.
- Sangcheon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic device with reduced substrate wa...
- Patent number 12,315,741
- Issue date May 27, 2025
- Innolux Corporation
- Chuan-Ming Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal and connection method
- Patent number 12,261,138
- Issue date Mar 25, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Jo Umezawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 12,255,167
- Issue date Mar 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of manufacturing electronic device
- Patent number 12,211,811
- Issue date Jan 28, 2025
- Industrial Technology Research Institute
- Yu-Ming Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate pad and die pillar design modifications to enable extreme...
- Patent number 12,199,064
- Issue date Jan 14, 2025
- NXP USA, INC.
- Kabir Mirpuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of an electronic apparatus
- Patent number 12,191,277
- Issue date Jan 7, 2025
- INNOLUX CORPORATION
- Ming-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 12,132,002
- Issue date Oct 29, 2024
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with nickel layer
- Patent number 12,125,715
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ching Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out interconnect integration processes and structures
- Patent number 12,074,106
- Issue date Aug 27, 2024
- Applied Materials, Inc.
- Richard W. Plavidal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,057,380
- Issue date Aug 6, 2024
- Samsung Electronics Co., Ltd.
- Myungsam Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive using standard commodity programmable logic IC chips co...
- Patent number 12,057,837
- Issue date Aug 6, 2024
- iCometrue Company Ltd.
- Jin-Yuan Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Packaged die and RDL with bonding structures therebetween
- Patent number 11,996,401
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,990,435
- Issue date May 21, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,961,810
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing loss in stacked quantum devices
- Patent number 11,955,465
- Issue date Apr 9, 2024
- Google LLC
- Theodore Charles White
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,948,808
- Issue date Apr 2, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing a semiconductor device including a joint a...
- Patent number 11,894,330
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate pad and die pillar design modifications to enable extreme...
- Patent number 11,875,988
- Issue date Jan 16, 2024
- NXP USA, INC.
- Kabir Mirpuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of embedding magnetic structures in substrates
- Patent number 11,862,552
- Issue date Jan 2, 2024
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,848,346
- Issue date Dec 19, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and apparatuses for implementing a pad on solder mask (POSM...
- Patent number 11,823,994
- Issue date Nov 21, 2023
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-speed RFID tag assembly using impulse heating
- Patent number 11,790,206
- Issue date Oct 17, 2023
- Impinj, Inc.
- Ronald Lee Koepp
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Elastic wave device
- Patent number 11,764,752
- Issue date Sep 19, 2023
- Murata Manufacturing Co., Ltd.
- Masatoshi Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat no-lead (QFN) package without leadframe and direct contac...
- Patent number 11,749,534
- Issue date Sep 5, 2023
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication process and structure of fine pitch traces for a solid...
- Patent number 11,749,595
- Issue date Sep 5, 2023
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with conductive adhesive layer
- Patent number 11,728,180
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ching Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive using standard commodity programmable logic IC chips co...
- Patent number 11,711,082
- Issue date Jul 25, 2023
- iCometrue Company Ltd.
- Mou-Shiung Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Fan-out interconnect integration processes and structures
- Patent number 11,699,651
- Issue date Jul 11, 2023
- Applied Materials, Inc.
- Richard W. Plavidal
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTROLESS NICKEL-ELECTROLESS PALLADIUM-IMMERSION GOLD (ENEPIG) AS...
- Publication number 20250218924
- Publication date Jul 3, 2025
- Intel Corporation
- Prithwish Chatterjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLESS NICKEL-ELECTROLESS PALLADIUM-IMMERSION GOLD (ENEPIG) WI...
- Publication number 20250218925
- Publication date Jul 3, 2025
- Intel Corporation
- Shruti Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
- Publication number 20250201753
- Publication date Jun 19, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
- Publication number 20250183217
- Publication date Jun 5, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250157981
- Publication date May 15, 2025
- Mitsubishi Electric Corporation
- Naohiro OGUSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND A METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20250132220
- Publication date Apr 24, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Dong Hyeon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR INTEGRATED CIRCUIT PACKAGE INTERCONNECTS
- Publication number 20250118641
- Publication date Apr 10, 2025
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
- Publication number 20250015004
- Publication date Jan 9, 2025
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILEVEL PACKAGE SUBSTRATE FOR INTERLEVEL DIELECTRIC CRACK MITIGA...
- Publication number 20250006661
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Guangxu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240421054
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Seongho Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH NICKEL LAYER
- Publication number 20240387192
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ching HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, PACKAGE STRUCTURE AND METHOD OF FABRICATING T...
- Publication number 20240387432
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC DRIVE USING STANDARD COMMODITY PROGRAMMABLE LOGIC IC CHIPS CO...
- Publication number 20240380401
- Publication date Nov 14, 2024
- iCometrue Company Ltd.
- Jin-Yuan Lee
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE
- Publication number 20240332157
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- Sangjin Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240332032
- Publication date Oct 3, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312868
- Publication date Sep 19, 2024
- Shinko Electric Industries Co., Ltd.
- Yukinori Hatori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240304577
- Publication date Sep 12, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC PACKAGE, PACKAGING SUBSTRATE AND FABRICATING METHOD THEREOF
- Publication number 20240282689
- Publication date Aug 22, 2024
- Siliconware Precision Industries Co., Ltd.
- Chan-Yu YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240258218
- Publication date Aug 1, 2024
- InnoLux Corporation
- Cheng-Chi WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240234364
- Publication date Jul 11, 2024
- LG Innotek Co., Ltd.
- Tae Sup CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASING TO ATTACH DIE TO LEAD FRAME
- Publication number 20240145419
- Publication date May 2, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Daiki KOMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240136322
- Publication date Apr 25, 2024
- LG Innotek Co., Ltd.
- Tae Sup CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PAD AND DIE PILLAR DESIGN MODIFICATIONS TO ENABLE EXTREME...
- Publication number 20240113069
- Publication date Apr 4, 2024
- NXP USA, Inc.
- Kabir Mirpuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20240071990
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240071847
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Huan Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CU-CU DIRECT WELDING FOR PACKAGING APPLICATION IN SEMICONDUCTOR IND...
- Publication number 20240021574
- Publication date Jan 18, 2024
- The University of Hong Kong
- Mingxin HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING CONNECTION LAYER
- Publication number 20240021530
- Publication date Jan 18, 2024
- YOONYOUNG JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240015883
- Publication date Jan 11, 2024
- Shinko Electric Industries Co., LTD.
- Shuhei Momose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH INDUCTOR IN MAGNETIC PACKAGE
- Publication number 20240006392
- Publication date Jan 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Anton Winkler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH INDUCTOR IN MAGNETIC PACKAGE
- Publication number 20240006259
- Publication date Jan 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Hidetoshi Inoue
- H01 - BASIC ELECTRIC ELEMENTS

with a principal constituent of the material being a metal or a metalloid

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip packaging structure and related inner lead bonding method

Semiconductor package

Method of manufacturing electronic device with reduced substrate wa...

Terminal and connection method

Semiconductor packages with an intermetallic layer

Electronic device and method of manufacturing electronic device

Substrate pad and die pillar design modifications to enable extreme...

Manufacturing method of an electronic apparatus

Bridge interconnection with layered interconnect structures

Chip package structure with nickel layer

Fan-out interconnect integration processes and structures

Semiconductor package

Logic drive using standard commodity programmable logic IC chips co...

Packaged die and RDL with bonding structures therebetween

Fingerprint sensor and manufacturing method thereof

Solderless interconnection structure and method of forming same

Reducing loss in stacked quantum devices

Semiconductor device and manufacturing method thereof

Methods of manufacturing a semiconductor device including a joint a...

Substrate pad and die pillar design modifications to enable extreme...

Methods of embedding magnetic structures in substrates

Semiconductor device and method of manufacturing the same

Systems and apparatuses for implementing a pad on solder mask (POSM...

High-speed RFID tag assembly using impulse heating

Elastic wave device

Quad flat no-lead (QFN) package without leadframe and direct contac...

Fabrication process and structure of fine pitch traces for a solid...

Chip package structure with conductive adhesive layer

Logic drive using standard commodity programmable logic IC chips co...

Fan-out interconnect integration processes and structures

Patents Applicationslast 30 patents

ELECTROLESS NICKEL-ELECTROLESS PALLADIUM-IMMERSION GOLD (ENEPIG) AS...

ELECTROLESS NICKEL-ELECTROLESS PALLADIUM-IMMERSION GOLD (ENEPIG) WI...

SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER

SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

ELECTRONIC DEVICES AND A METHODS OF MANUFACTURING ELECTRONIC DEVICES

PLANAR INTEGRATED CIRCUIT PACKAGE INTERCONNECTS

BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES

MULTILEVEL PACKAGE SUBSTRATE FOR INTERLEVEL DIELECTRIC CRACK MITIGA...

SEMICONDUCTOR PACKAGE

CHIP PACKAGE STRUCTURE WITH NICKEL LAYER

SEMICONDUCTOR DEVICE, PACKAGE STRUCTURE AND METHOD OF FABRICATING T...

LOGIC DRIVE USING STANDARD COMMODITY PROGRAMMABLE LOGIC IC CHIPS CO...

SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE, PACKAGING SUBSTRATE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR PACKAGE DEVICE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR

LASING TO ATTACH DIE TO LEAD FRAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR

SUBSTRATE PAD AND DIE PILLAR DESIGN MODIFICATIONS TO ENABLE EXTREME...

EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES

SEMICONDUCTOR PACKAGE AND METHOD

CU-CU DIRECT WELDING FOR PACKAGING APPLICATION IN SEMICONDUCTOR IND...

SEMICONDUCTOR PACKAGE INCLUDING CONNECTION LAYER

WIRING SUBSTRATE

INTEGRATED CIRCUIT WITH INDUCTOR IN MAGNETIC PACKAGE

INTEGRATED CIRCUIT WITH INDUCTOR IN MAGNETIC PACKAGE