with a principal constituent of the material being a metal or a metalloid

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H01L2224/834

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/834with a principal constituent of the material being a metal or a metalloid

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,183,701
- Issue date Dec 31, 2024
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene-coated heat spreader for integrated circuit device assemblies
- Patent number 12,154,839
- Issue date Nov 26, 2024
- Advanced Micro Devices, Inc.
- Xiaoyang Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Connection structure and manufacturing method therefor
- Patent number 12,100,923
- Issue date Sep 24, 2024
- Resonac Corporation
- Kunihiko Akai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package with pre-applied filler material
- Patent number 12,094,725
- Issue date Sep 17, 2024
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure production method and bonding structure
- Patent number 12,094,850
- Issue date Sep 17, 2024
- Osaka University
- Katsuaki Suganuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thick-silver layer interface
- Patent number 12,094,801
- Issue date Sep 17, 2024
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,080,680
- Issue date Sep 3, 2024
- Kabushiki Kaisba Toshiba
- Makoto Mizukami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having routable encapsulated conductive subst...
- Patent number 12,062,588
- Issue date Aug 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,062,637
- Issue date Aug 13, 2024
- Innolux Corporation
- Pai-Chiao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding sheet and bonded structure
- Patent number 12,046,572
- Issue date Jul 23, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Kei Anai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Systems and methods for fabricating silicon die stacks for electron...
- Patent number 12,027,489
- Issue date Jul 2, 2024
- Ukyo Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including semiconductor chips and method for producing such...
- Patent number 12,027,481
- Issue date Jul 2, 2024
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation structure, manufacturing method for heat dissipati...
- Patent number 12,002,733
- Issue date Jun 4, 2024
- Lenovo (Singapore) Pte. Ltd.
- Masahiro Kitamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for repairing a light-emitting device and a method for manuf...
- Patent number 11,916,041
- Issue date Feb 27, 2024
- ASTI GLOBAL INC., TAIWAN
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder material
- Patent number 11,850,685
- Issue date Dec 26, 2023
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 11,842,975
- Issue date Dec 12, 2023
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,810,881
- Issue date Nov 7, 2023
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element bonding structure, method for producing semic...
- Patent number 11,810,885
- Issue date Nov 7, 2023
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting clip design for pressure sintering
- Patent number 11,804,421
- Issue date Oct 31, 2023
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing stacked semiconductor die assemblies with...
- Patent number 11,776,877
- Issue date Oct 3, 2023
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a solder compound containing a compo...
- Patent number 11,776,927
- Issue date Oct 3, 2023
- Infineon Technologies AG
- Thomas Behrens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dielectric-dielectric and metallization bonding via plasma activati...
- Patent number 11,735,689
- Issue date Aug 22, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and fluidic manufacture thereof
- Patent number 11,721,792
- Issue date Aug 8, 2023
- eLux Inc.
- Kenji Alexander Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with frame having arms
- Patent number 11,715,677
- Issue date Aug 1, 2023
- STMicroelectronics, Inc.
- Jefferson Sismundo Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,626,352
- Issue date Apr 11, 2023
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with redundant electrical connectors and ass...
- Patent number 11,626,388
- Issue date Apr 11, 2023
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication process and structure of fine pitch traces for a solid...
- Patent number 11,594,509
- Issue date Feb 28, 2023
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Employing deformable contacts and pre-applied underfill for bonding...
- Patent number 11,575,069
- Issue date Feb 7, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- G02 - OPTICS
Information Patent Grant
Device including semiconductor chips and method for producing such...
- Patent number 11,569,186
- Issue date Jan 31, 2023
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIE-SUBSTRATE INTERFACE INCLUDING LOCKING FEATURES
- Publication number 20250015044
- Publication date Jan 9, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Hao YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID METALLIZATION SURFACES FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20250006616
- Publication date Jan 2, 2025
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240421026
- Publication date Dec 19, 2024
- Siliconware Precision Industries Co., Ltd.
- Chiu-Ling CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PRESSURE SINTERING POWDER
- Publication number 20240413117
- Publication date Dec 12, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Application
THICK-SILVER LAYER INTERFACE
- Publication number 20240404914
- Publication date Dec 5, 2024
- NXP USA, Inc.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...
- Publication number 20240404902
- Publication date Dec 5, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Won Bae BANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE
- Publication number 20240395654
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FABRICATING SILICON DIE STACKS FOR ELECTRON...
- Publication number 20240371819
- Publication date Nov 7, 2024
- NANO-X IMAGING LTD.
- Ukyo JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240363582
- Publication date Oct 31, 2024
- InnoLux Corporation
- Pai-Chiao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...
- Publication number 20240355767
- Publication date Oct 24, 2024
- INFINEON TECHNOLOGIES AG
- Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lid Structure With Openings To Alleviate Leakage Of Thermal Interfa...
- Publication number 20240332113
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240312860
- Publication date Sep 19, 2024
- Kabushiki Kaisha Toshiba
- Daisuke KOIKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20240178125
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINT STRUCTURE
- Publication number 20240149340
- Publication date May 9, 2024
- Mitsui Mining and Smelting Co., Ltd.
- Shinichi YAMAUCHI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240153836
- Publication date May 9, 2024
- ROHM CO., LTD.
- Naoaki TSURUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH HYBRID BONDED DIES AND METHODS OF...
- Publication number 20240113088
- Publication date Apr 4, 2024
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Power Semiconductor Device
- Publication number 20240096842
- Publication date Mar 21, 2024
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM
- Publication number 20240088087
- Publication date Mar 14, 2024
- INFINEON TECHNOLOGIES AG
- Alexander HEINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240071847
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Huan Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Package and Method Forming the Same
- Publication number 20240072034
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240055332
- Publication date Feb 15, 2024
- ROHM CO., LTD.
- Xiaopeng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FABRICATING SILICON DIE STACKS FOR ELECTRON...
- Publication number 20240047415
- Publication date Feb 8, 2024
- NANO-X IMAGING LTD
- Ukyo JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...
- Publication number 20230395463
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILVER SINTERED MOLYBDENUM (SSM) PACKAGING FOR POWER SEMICONDUCTOR...
- Publication number 20230352372
- Publication date Nov 2, 2023
- McMaster University
- Yuhang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Comprising a Combined Power and Logic Substrate
- Publication number 20230352462
- Publication date Nov 2, 2023
- INFINEON TECHNOLOGIES AG
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230326835
- Publication date Oct 12, 2023
- NEXPERIA B.V.
- Hing Suan Cheam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PCB FOR TOPSIDE POWER DELIVERY
- Publication number 20230317706
- Publication date Oct 5, 2023
- Intel Corporation
- Kyle ARRINGTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230298983
- Publication date Sep 21, 2023
- Hitachi Astemo, Ltd.
- Osamu IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR JOINING, SEMICONDUCTOR DEVICE
- Publication number 20230282601
- Publication date Sep 7, 2023
- Fuji Electric Co., Ltd.
- Yoshinori UEZATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20230282611
- Publication date Sep 7, 2023
- FUJI ELECTRIC CO., LTD.
- Hiroki TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS

with a principal constituent of the material being a metal or a metalloid

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Graphene-coated heat spreader for integrated circuit device assemblies

Low pressure sintering powder

Connection structure and manufacturing method therefor

Leadframe package with pre-applied filler material

Bonding structure production method and bonding structure

Thick-silver layer interface

Semiconductor device

Semiconductor package having routable encapsulated conductive subst...

Electronic device

Bonding sheet and bonded structure

Systems and methods for fabricating silicon die stacks for electron...

Device including semiconductor chips and method for producing such...

Heat dissipation structure, manufacturing method for heat dissipati...

Method for repairing a light-emitting device and a method for manuf...

Solder material

Electronic device with multi-layer contact and system

Semiconductor device

Semiconductor element bonding structure, method for producing semic...

Connecting clip design for pressure sintering

Methods of manufacturing stacked semiconductor die assemblies with...

Semiconductor device including a solder compound containing a compo...

Dielectric-dielectric and metallization bonding via plasma activati...

Light emitting device and fluidic manufacture thereof

Semiconductor device with frame having arms

Semiconductor device and method for manufacturing the same

Interconnect structure with redundant electrical connectors and ass...

Fabrication process and structure of fine pitch traces for a solid...

Employing deformable contacts and pre-applied underfill for bonding...

Device including semiconductor chips and method for producing such...

Patents Applicationslast 30 patents

DIE-SUBSTRATE INTERFACE INCLUDING LOCKING FEATURES

HYBRID METALLIZATION SURFACES FOR INTEGRATED CIRCUIT PACKAGES

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

LOW PRESSURE SINTERING POWDER

THICK-SILVER LAYER INTERFACE

SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...

STACKED SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE

SYSTEMS AND METHODS FOR FABRICATING SILICON DIE STACKS FOR ELECTRON...

ELECTRONIC DEVICE

DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...

Lid Structure With Openings To Alleviate Leakage Of Thermal Interfa...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE

JOINT STRUCTURE

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT PACKAGES WITH HYBRID BONDED DIES AND METHODS OF...

Method for Fabricating a Power Semiconductor Device

ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM

SEMICONDUCTOR PACKAGE AND METHOD

3DIC Package and Method Forming the Same

SEMICONDUCTOR DEVICE

SYSTEMS AND METHODS FOR FABRICATING SILICON DIE STACKS FOR ELECTRON...

METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...

SILVER SINTERED MOLYBDENUM (SSM) PACKAGING FOR POWER SEMICONDUCTOR...

Semiconductor Package Comprising a Combined Power and Logic Substrate

MOLDED ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME

METAL PCB FOR TOPSIDE POWER DELIVERY

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR JOINING, SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE MANUFACTURING METHOD