with a principal constituent of the material being a metal or a metalloid

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H01L2224/056

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/056with a principal constituent of the material being a metal or a metalloid

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Conductive buffer layers for semiconductor die assemblies and assoc...
- Patent number 12,315,833
- Issue date May 27, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplated indium bump stacks for cryogenic electronics
- Patent number 12,315,834
- Issue date May 27, 2025
- Microsoft Technology Licensing, LLC
- Christopher Cantaloube
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal capacitor within metallization structure
- Patent number 12,315,791
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Han Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Build-up package for integrated circuit devices, and methods of mak...
- Patent number 12,315,769
- Issue date May 27, 2025
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seamless bonding layers in semiconductor packages and methods of fo...
- Patent number 12,300,639
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,300,649
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Yong Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bond pad structure
- Patent number 12,300,670
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sin-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 12,300,598
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector and method for forming the same
- Patent number 12,300,645
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder material
- Patent number 12,296,409
- Issue date May 13, 2025
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protective semiconductor elements for bonded structures
- Patent number 12,300,634
- Issue date May 13, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and manufacturing method thereof, and electronic term...
- Patent number 12,300,705
- Issue date May 13, 2025
- SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Zhuhui Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,300,668
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Raehyung Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding pads and methods of forming the same
- Patent number 12,300,644
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint recognition module and electronic device comprising same
- Patent number 12,300,676
- Issue date May 13, 2025
- LG Innotek Co., Ltd
- Seung Ho Jeon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,293,991
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel including driving backplane
- Patent number 12,295,172
- Issue date May 6, 2025
- WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Can Huang
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Display device
- Patent number 12,295,225
- Issue date May 6, 2025
- Samsung Display Co., Ltd.
- Chungi You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,288,739
- Issue date Apr 29, 2025
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel
- Patent number 12,289,921
- Issue date Apr 29, 2025
- Au Optronics Corporation
- I-Peng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including re-distribution pads disposed at dif...
- Patent number 12,288,761
- Issue date Apr 29, 2025
- SK Hynix Inc.
- Jun Yong Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,288,764
- Issue date Apr 29, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Gyu Wan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,288,777
- Issue date Apr 29, 2025
- Japan Display Inc.
- Yoshinori Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure
- Patent number 12,283,557
- Issue date Apr 22, 2025
- United Microelectronics Corp.
- Aaron Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and manufacturing method therefor
- Patent number 12,278,320
- Issue date Apr 15, 2025
- Stanley Electric Co., Ltd.
- Yoshiaki Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive bump of a semiconductor device and fabricating method th...
- Patent number 12,278,199
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,272,296
- Issue date Apr 8, 2025
- Samsung Display Co., Ltd.
- Hyun Joon Kim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Thermal structure for semiconductor device and method of forming th...
- Patent number 12,272,613
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of flip chip package structure
- Patent number 12,266,620
- Issue date Apr 1, 2025
- Amazing Cool Technology Corp
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel, method of manufacturing display panel, and display d...
- Patent number 12,266,621
- Issue date Apr 1, 2025
- TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Jinming Shi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167085
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Yonghwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167104
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hao HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE INCLUDING FUSE STRUCTURE AND METHODS FOR FORMING...
- Publication number 20250167078
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL PACKAGE STRUCTURE, PACKAGE STRUCTURE, AND METHOD FOR FORMIN...
- Publication number 20250164709
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE OBTAINED BY 3D INTEGRATION AND CORRESPONDING...
- Publication number 20250167157
- Publication date May 22, 2025
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Pablo RENAUD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SUBSTRATE PAD
- Publication number 20250167087
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Dowan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167090
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Duckgyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF AN ELECTRONIC CIRCUIT COMPRISING CONTACT PADS
- Publication number 20250167148
- Publication date May 22, 2025
- STMicroelectronics International N.V.
- Pierre BAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES WITH THROUGH VIA
- Publication number 20250167077
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ke-Gang Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250157961
- Publication date May 15, 2025
- DENSO CORPORATION
- Shiro MIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250157980
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Jinkyeong SEOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250157983
- Publication date May 15, 2025
- SAMSUNG ELECTRONICS CO., LTD.
- HYUNGJUN JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLIES EMPLOYING COPPER IN MULTIPLE LOCATIONS
- Publication number 20250157969
- Publication date May 15, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD OVER ACTIVE SENSOR CELLS INTEGRATED IN A CHIP PACKAGE
- Publication number 20250160219
- Publication date May 15, 2025
- INFINEON TECHNOLOGIES AG
- Walter HARTNER
- G01 - MEASURING TESTING
Information Patent Application
BONDING STRUCTURES FOR HIGH-DENSITY METAL-TO-METAL BONDING AND METH...
- Publication number 20250157966
- Publication date May 15, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Keisuke IZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250158002
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Ae-Nee JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC ASSEMBLY FOR ENHANCED BONDING YIELD AND METHODS FOR FORMIN...
- Publication number 20250149477
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING WITH SELECTIVELY FORMED DIELECTRIC MATERIAL
- Publication number 20250149499
- Publication date May 8, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Ravi Prakash SRIVASTAVA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT TO IMPROVE THERMAL DISSIPATION AWAY FROM SEMICONDU...
- Publication number 20250149509
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY SUBSTRATE, TILED DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20250149522
- Publication date May 8, 2025
- BOE TECHNOLOGY GROUP CO., LTD.
- Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250149479
- Publication date May 8, 2025
- SAMSUNG ELECTRONICS CO., LTD.
- Haksun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF STACKED CHIPS
- Publication number 20250149526
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Wonjung JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Dielectric Capping for Hybrid Bonding
- Publication number 20250149474
- Publication date May 8, 2025
- Applied Materials, Inc.
- Prayudi LIANTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250149478
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Yongho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250149480
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Wonhee LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250149475
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Min Seung JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SCHEME FOR SEMICONDUCTOR PACKAGING
- Publication number 20250149488
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co, LTD.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID QUAD FLAT PACKAGE ELECTRONIC DEVICE
- Publication number 20250140653
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL VIAS AND HEAT SPREA...
- Publication number 20250140632
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Isha Datye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC-FILLED BOND PADS IN CLIP PACKAGES
- Publication number 20250140718
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jose Arvin M. PLOMANTES
- H01 - BASIC ELECTRIC ELEMENTS

with a principal constituent of the material being a metal or a metalloid

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Conductive buffer layers for semiconductor die assemblies and assoc...

Electroplated indium bump stacks for cryogenic electronics

Metal-insulator-metal capacitor within metallization structure

Build-up package for integrated circuit devices, and methods of mak...

Seamless bonding layers in semiconductor packages and methods of fo...

Semiconductor package

Hybrid bond pad structure

Package structure and method of fabricating the same

Connector and method for forming the same

Solder material

Protective semiconductor elements for bonded structures

Display panel and manufacturing method thereof, and electronic term...

Semiconductor package

Die bonding pads and methods of forming the same

Fingerprint recognition module and electronic device comprising same

Semiconductor packages and methods of forming same

Display panel including driving backplane

Display device

Semiconductor device and method for manufacturing the same

Display panel

Semiconductor device including re-distribution pads disposed at dif...

Semiconductor device and manufacturing method thereof

Display device

Integrated circuit structure

Light emitting device and manufacturing method therefor

Conductive bump of a semiconductor device and fabricating method th...

Display device

Thermal structure for semiconductor device and method of forming th...

Manufacturing method of flip chip package structure

Display panel, method of manufacturing display panel, and display d...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DIE INCLUDING FUSE STRUCTURE AND METHODS FOR FORMING...

OPTICAL PACKAGE STRUCTURE, PACKAGE STRUCTURE, AND METHOD FOR FORMIN...

MICROELECTRONIC DEVICE OBTAINED BY 3D INTEGRATION AND CORRESPONDING...

SEMICONDUCTOR PACKAGE WITH SUBSTRATE PAD

SEMICONDUCTOR PACKAGE

MANUFACTURING METHOD OF AN ELECTRONIC CIRCUIT COMPRISING CONTACT PADS

SEMICONDUCTOR STRUCTURES WITH THROUGH VIA

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

ELECTRONIC ASSEMBLIES EMPLOYING COPPER IN MULTIPLE LOCATIONS

PAD OVER ACTIVE SENSOR CELLS INTEGRATED IN A CHIP PACKAGE

BONDING STRUCTURES FOR HIGH-DENSITY METAL-TO-METAL BONDING AND METH...

SEMICONDUCTOR PACKAGE

PHOTONIC ASSEMBLY FOR ENHANCED BONDING YIELD AND METHODS FOR FORMIN...

HYBRID BONDING WITH SELECTIVELY FORMED DIELECTRIC MATERIAL

BACKSIDE CONTACT TO IMPROVE THERMAL DISSIPATION AWAY FROM SEMICONDU...

DISPLAY SUBSTRATE, TILED DISPLAY PANEL AND DISPLAY DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF STACKED CHIPS

Selective Dielectric Capping for Hybrid Bonding

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

BONDING SCHEME FOR SEMICONDUCTOR PACKAGING

HYBRID QUAD FLAT PACKAGE ELECTRONIC DEVICE

INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL VIAS AND HEAT SPREA...

DIELECTRIC-FILLED BOND PADS IN CLIP PACKAGES