with a principal constituent of the material being a metal or a metalloid

Industry

CPC
H01L2924/167

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/167with a principal constituent of the material being a metal or a metalloid

Industries

Patents Grantslast 30 patents

Information Patent Grant
Hermetic package for high CTE mismatch
- Patent number 12,119,281
- Issue date Oct 15, 2024
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded lid for low cost and improved thermal performance
- Patent number 12,021,004
- Issue date Jun 25, 2024
- Texas Instruments Incorporated
- Hiep Xuan Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 11,961,779
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC)
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with partitioned logic and ass...
- Patent number 11,562,986
- Issue date Jan 24, 2023
- Micron Technology, Inc.
- Jian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting an electrical component in which a hood is used...
- Patent number 11,424,170
- Issue date Aug 23, 2022
- Siemens Aktiengesellschaft
- Nora Busche
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated interposer solutions for 2D and 3D IC packaging
- Patent number 11,302,616
- Issue date Apr 12, 2022
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded package assemblies with integrated capacitor
- Patent number 11,049,819
- Issue date Jun 29, 2021
- International Business Machines Corporation
- Mark C. Lamorey
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 11,037,852
- Issue date Jun 15, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,011,431
- Issue date May 18, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state image pickup device and electronic apparatus to increas...
- Patent number 10,986,292
- Issue date Apr 20, 2021
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Kenji Mishima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with partitioned logic and ass...
- Patent number 10,978,427
- Issue date Apr 13, 2021
- Micron Technology, Inc.
- Jian Li
- G11 - INFORMATION STORAGE
Information Patent Grant
Fabricating an integrated circuit chip module with stiffening frame...
- Patent number 10,892,170
- Issue date Jan 12, 2021
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability wafer level semiconductor packaging
- Patent number 10,790,208
- Issue date Sep 29, 2020
- Semiconductor Components Industries, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,777,467
- Issue date Sep 15, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor components having substantially rigid suppor...
- Patent number 10,763,185
- Issue date Sep 1, 2020
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with heat transfer structure formed f...
- Patent number 10,748,878
- Issue date Aug 18, 2020
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component housing package and electronic apparatus
- Patent number 10,645,824
- Issue date May 5, 2020
- Kyocera Corporation
- Noritaka Niino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a chip module with stiffening frame and ortho...
- Patent number 10,566,215
- Issue date Feb 18, 2020
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with heat transfer structure formed f...
- Patent number 10,559,551
- Issue date Feb 11, 2020
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded package assemblies with integrated capacitor
- Patent number 10,553,544
- Issue date Feb 4, 2020
- International Business Machines Corporation
- Mark C. Lamorey
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Thermally conductive sheet, production method for thermally conduct...
- Patent number 10,526,519
- Issue date Jan 7, 2020
- Dexerials Corporation
- Hiroki Kanaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and corresponding method
- Patent number 10,522,504
- Issue date Dec 31, 2019
- STMicroelectronics S.r.l.
- Pierangelo Magni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 10,461,009
- Issue date Oct 29, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip module with stiffening frame and orthogonal heat spreader
- Patent number 10,424,494
- Issue date Sep 24, 2019
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor components having substantially rigid suppor...
- Patent number 10,312,173
- Issue date Jun 4, 2019
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with heat transfer structure formed f...
- Patent number 10,297,577
- Issue date May 21, 2019
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability wafer level semiconductor packaging
- Patent number 10,290,556
- Issue date May 14, 2019
- Semiconductor Components Industries, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shield cap and method for manufacturing the same
- Patent number 10,271,468
- Issue date Apr 23, 2019
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated interposer solutions for 2D and 3D IC packaging
- Patent number 10,256,177
- Issue date Apr 9, 2019
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 10,236,227
- Issue date Mar 19, 2019
- Siliconware Prescision Industries Co., Ltd.
- Lung-Shan Chuang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240228264
- Publication date Jul 11, 2024
- STMicroelectronics International N.V.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
3DIC PACKAGING WITH HOT SPOT THERMAL MANAGEMENT FEATURES
- Publication number 20240222218
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co, LTD.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240132340
- Publication date Apr 25, 2024
- STMicroelectronics (Malta) Ltd.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
REINFORCED STRUCTURE WITH CAPPING LAYER AND METHODS OF FORMING THE...
- Publication number 20230395450
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jing-Ye Juang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20230378024
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH GAS RELEASE HOLES
- Publication number 20230307302
- Publication date Sep 28, 2023
- STMicroelectronics LTD
- David GANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED LID FOR LOW COST AND IMPROVED THERMAL PERFORMANCE
- Publication number 20220319950
- Publication date Oct 6, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Hiep Xuan Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH PARTITIONED LOGIC AND ASS...
- Publication number 20210217734
- Publication date Jul 15, 2021
- Micron Technology, Inc.
- Jian Li
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200411385
- Publication date Dec 31, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- CHI-YANG YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED PACKAGE ASSEMBLIES WITH INTEGRATED CAPACITOR
- Publication number 20200083177
- Publication date Mar 12, 2020
- International Business Machines Corporation
- Mark C. Lamorey
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200066598
- Publication date Feb 27, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- CHI-YANG YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPOR...
- Publication number 20190252281
- Publication date Aug 15, 2019
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING
- Publication number 20190229025
- Publication date Jul 25, 2019
- Semiconductor Components Industries, LLC
- Yu-Te HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Packaging with Hot Spot Thermal Management Features
- Publication number 20190096781
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER
- Publication number 20180277396
- Publication date Sep 27, 2018
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPOR...
- Publication number 20180211896
- Publication date Jul 26, 2018
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING
- Publication number 20180082913
- Publication date Mar 22, 2018
- Semiconductor Components Industries, LLC
- Yu-Te HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER
- Publication number 20180061732
- Publication date Mar 1, 2018
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER
- Publication number 20180061733
- Publication date Mar 1, 2018
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIMITING ELECTRONIC PACKAGE WARPAGE
- Publication number 20180047590
- Publication date Feb 15, 2018
- International Business Machines Corporation
- Shidong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH HEAT TRANSFER STRUCTURE FORMED F...
- Publication number 20170365584
- Publication date Dec 21, 2017
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Packaging with Hot Spot Thermal Management Features
- Publication number 20170345732
- Publication date Nov 30, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING
- Publication number 20170236761
- Publication date Aug 17, 2017
- Semiconductor Components Industries, LLC
- Yu-Te HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD
- Publication number 20170125371
- Publication date May 4, 2017
- STMicroelectronics S.r.l.
- Pierangelo MAGNI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMI-HERMETIC SEMICONDUCTOR PACKAGE
- Publication number 20170062297
- Publication date Mar 2, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Andy Quang Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Top Stacking Package Structure and Method for Manufacturing t...
- Publication number 20160293509
- Publication date Oct 6, 2016
- Dawning Leading Technology Inc.
- Diann-Fang LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL FOR INTEGRATED CIRCUIT PACKAGE AND METHO...
- Publication number 20140374897
- Publication date Dec 25, 2014
- Sam Ziqun ZHAO
- B82 - NANO-TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING EMI SHIELDING FUNCTION AND HEAT DISSIP...
- Publication number 20140328023
- Publication date Nov 6, 2014
- Samsung Electronics Co., Ltd.
- IN-HO CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUID COOLED SEMICONDUCTOR DIE PACKAGE
- Publication number 20140306336
- Publication date Oct 16, 2014
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20140284785
- Publication date Sep 25, 2014
- Amkor Technology, Inc.
- Pil Je Sung
- H01 - BASIC ELECTRIC ELEMENTS

with a principal constituent of the material being a metal or a metalloid

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Hermetic package for high CTE mismatch

Embedded lid for low cost and improved thermal performance

3DIC packaging with hot spot thermal management features

Stacked semiconductor die assemblies with partitioned logic and ass...

Method for mounting an electrical component in which a hood is used...

Integrated interposer solutions for 2D and 3D IC packaging

Shielded package assemblies with integrated capacitor

3DIC packaging with hot spot thermal management features

Semiconductor structure and manufacturing method thereof

Solid-state image pickup device and electronic apparatus to increas...

Stacked semiconductor die assemblies with partitioned logic and ass...

Fabricating an integrated circuit chip module with stiffening frame...

High reliability wafer level semiconductor packaging

Semiconductor structure and manufacturing method thereof

Packaged semiconductor components having substantially rigid suppor...

Semiconductor device assembly with heat transfer structure formed f...

Electronic component housing package and electronic apparatus

Method of fabricating a chip module with stiffening frame and ortho...

Semiconductor device assembly with heat transfer structure formed f...

Shielded package assemblies with integrated capacitor

Thermally conductive sheet, production method for thermally conduct...

Semiconductor device and corresponding method

3DIC packaging with hot spot thermal management features

Chip module with stiffening frame and orthogonal heat spreader

Packaged semiconductor components having substantially rigid suppor...

Semiconductor device assembly with heat transfer structure formed f...

High reliability wafer level semiconductor packaging

Shield cap and method for manufacturing the same

Integrated interposer solutions for 2D and 3D IC packaging

Electronic package and fabrication method thereof

Patents Applicationslast 30 patents

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

3DIC PACKAGING WITH HOT SPOT THERMAL MANAGEMENT FEATURES

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

REINFORCED STRUCTURE WITH CAPPING LAYER AND METHODS OF FORMING THE...

SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR PACKAGE WITH GAS RELEASE HOLES

EMBEDDED LID FOR LOW COST AND IMPROVED THERMAL PERFORMANCE

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH PARTITIONED LOGIC AND ASS...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SHIELDED PACKAGE ASSEMBLIES WITH INTEGRATED CAPACITOR

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPOR...

HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING

3DIC Packaging with Hot Spot Thermal Management Features

CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER

PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPOR...

HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING

CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER

CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER

LIMITING ELECTRONIC PACKAGE WARPAGE

SEMICONDUCTOR DEVICE ASSEMBLY WITH HEAT TRANSFER STRUCTURE FORMED F...

3DIC Packaging with Hot Spot Thermal Management Features

HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD

SEMI-HERMETIC SEMICONDUCTOR PACKAGE

Metal Top Stacking Package Structure and Method for Manufacturing t...

THERMAL INTERFACE MATERIAL FOR INTEGRATED CIRCUIT PACKAGE AND METHO...

SEMICONDUCTOR PACKAGE HAVING EMI SHIELDING FUNCTION AND HEAT DISSIP...

FLUID COOLED SEMICONDUCTOR DIE PACKAGE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF