TREA

with a principal constituent of the material being a metal or a metalloid

Follow

Industry

  • CPC
  • H01L2224/453
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/453with a principal constituent of the material being a metal or a metalloid
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Method and system for composite bond wires
    • Patent number 8,134,073
    • Issue date Mar 13, 2012
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chris Wyland
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Grant

    Bonding wire and bonded connection
    • Patent number 7,319,196
    • Issue date Jan 15, 2008
    • EUPEC Europaeische Gesellschaft fur Leistungshalbleiter mbH
    • Guy LeFranc
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Silver-gold wire for wire bonding
    • Patent number 6,150,262
    • Issue date Nov 21, 2000
    • Texas Instruments Incorporated
    • Bernard A. Go
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents