with a principal constituent of the material being a metal or a metalloid

Industry

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H01L2224/052

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/052with a principal constituent of the material being a metal or a metalloid

Industries

Patents Grantslast 30 patents

Information Patent Grant
P-type amorphous oxide semiconductor including gallium, method of m...
- Patent number 10,797,192
- Issue date Oct 6, 2020
- University-Industry Cooperation Group of Kyung Hee University
- Jin Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for reducing volume of resource allocation inf...
- Patent number 10,770,419
- Issue date Sep 8, 2020
- Samsung Electronics Co., Ltd.
- Hee-Kwun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for reducing volume of resource allocation inf...
- Patent number 10,763,233
- Issue date Sep 1, 2020
- Samsung Electronics Co., Ltd.
- Hee-Kwun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package with resilient conductive paste post and...
- Patent number 10,685,943
- Issue date Jun 16, 2020
- Mediatek Inc.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad structure, bonding ring structure, and MEMS device pack...
- Patent number 10,134,698
- Issue date Nov 20, 2018
- Semiconductor Manufacturing International (Beijing) Corporation
- Fucheng Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 10,090,231
- Issue date Oct 2, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reliable interconnect
- Patent number 9,960,130
- Issue date May 1, 2018
- UTAC HEADQUARTERS PTE. LTD.
- Rui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices having a metallisati...
- Patent number 9,887,152
- Issue date Feb 6, 2018
- Infineon Technologies Austria AG
- Rudolf Zelsacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 9,793,198
- Issue date Oct 17, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus and method for manufacturing electronic apparatus
- Patent number 9,754,904
- Issue date Sep 5, 2017
- Fujitsu Limited
- Masaru Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector between die pad and z-interconnect for stacked...
- Patent number 9,508,689
- Issue date Nov 29, 2016
- Invensas Corporation
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector between die pad and z-interconnect for stacked...
- Patent number 9,153,517
- Issue date Oct 6, 2015
- Invensas Corporation
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices having a metallisati...
- Patent number 9,030,028
- Issue date May 12, 2015
- Infineon Technologies Austria AG
- Rudolf Zelsacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low viscosity precursor compositions and methods for the deposition...
- Patent number 7,691,664
- Issue date Apr 6, 2010
- Cabot Corporation
- Toivo T. Kodas
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METALLIZED SEMICONDUCTOR DIE AND MANUFACTURING METHOD
- Publication number 20240194623
- Publication date Jun 13, 2024
- TDK Electronics AG
- Mehrdad Shayganpoor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20230411317
- Publication date Dec 21, 2023
- Walton Advanced Engineering, Inc
- HONG-CHI YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR REDUCING VOLUME OF RESOURCE ALLOCATION INF...
- Publication number 20190206826
- Publication date Jul 4, 2019
- Samsung Electronics Co., Ltd.
- Hee-Kwun CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Packaging Structure and Related Inner Lead Bonding Method
- Publication number 20180114769
- Publication date Apr 26, 2018
- SITRONIX TECHNOLOGY CORP.
- Ying-Chen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...
- Publication number 20180019191
- Publication date Jan 18, 2018
- Invensas Corporation
- Cyprian Emeka UZOH
- B32 - LAYERED PRODUCTS
Information Patent Application
BONDING PAD STRUCTURE, BONDING RING STRUCTURE, AND MEMS DEVICE PACK...
- Publication number 20170084557
- Publication date Mar 23, 2017
- Semiconductor Manufacturing International (Beijing) Corporation
- FUCHENG CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING ELECTRONIC APPARATUS
- Publication number 20170047302
- Publication date Feb 16, 2017
- Fujitsu Limited
- Masaru Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A METALLISATI...
- Publication number 20140284819
- Publication date Sep 25, 2014
- Infineon Technologies Austria AG
- Rudolf Zelsacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20130277850
- Publication date Oct 24, 2013
- NAPRA CO., LTD.
- Shigenobu Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGING CONNECTOR AND METHODS FOR ITS PRODUCTION
- Publication number 20130087371
- Publication date Apr 11, 2013
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Connector Between Die Pad and Z-Interconnect for Stacked...
- Publication number 20120119385
- Publication date May 17, 2012
- Vertical Circuits, Inc.
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A METALLISATI...
- Publication number 20120013029
- Publication date Jan 19, 2012
- Infineon Technologies Austria AG
- Rudolf Zelsacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low viscosity precursor compositions and methods for the deposition...
- Publication number 20100034986
- Publication date Feb 11, 2010
- Cabot Corporation
- Toivo T. Kodas
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE HAVING ELECTRICAL CONNECTING PADS
- Publication number 20080290528
- Publication date Nov 27, 2008
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low viscosity precursor compositions and methods for the deposition...
- Publication number 20080108218
- Publication date May 8, 2008
- Cabot Corporation
- Toivo T. Kodas
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Low viscosity precursor compositions and methods for the deposition...
- Publication number 20080093422
- Publication date Apr 24, 2008
- Cabot Corporation
- Toivo T. Kodas
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Low viscosity precursor compositions and methods for the deposition...
- Publication number 20080093423
- Publication date Apr 24, 2008
- Cabot Corporation
- Toivo T. Kodas
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Low viscosity precursor compositions and methods for the deposition...
- Publication number 20070221887
- Publication date Sep 27, 2007
- Cabot Corporation
- Toivo T. Kodas
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESSES FOR FORMING PHOTOVOLTAIC FEATURES
- Publication number 20070207565
- Publication date Sep 6, 2007
- Cabot Corporation
- Toivo T. Kodas
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW VISCOSITY PRECURSOR COMPOSITIONS AND METHODS FOR THE DEPOSITION...
- Publication number 20070181844
- Publication date Aug 9, 2007
- Cabot Corporation
- Toivo T. Kodas
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Low viscosity precursor compositions and methods for the deposition...
- Publication number 20070125989
- Publication date Jun 7, 2007
- Cabot Corporation
- Toivo T. Kodas
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Low viscosity precursor compositions and methods for the deposition...
- Publication number 20070120097
- Publication date May 31, 2007
- Cabot Corporation
- Toivo T. Kodas
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Low viscosity precursor compositions and methods for the deposition...
- Publication number 20070120099
- Publication date May 31, 2007
- Cabot Corporation
- Toivo T. Kodas
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Low viscosity precursor compositions and methods for the deposition...
- Publication number 20070120098
- Publication date May 31, 2007
- Cabot Corporation
- Toivo T. Kodas
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Low viscosity precursor compositions and methods for the deposition...
- Publication number 20070120096
- Publication date May 31, 2007
- Cabot Corporation
- Toivo T. Kodas
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Low viscosity precursor compositions and methods for the deposition...
- Publication number 20070104879
- Publication date May 10, 2007
- Cabot Corporation
- Toivo T. Kodas
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Low viscosity precursor compositions and methods for the deposition...
- Publication number 20070104883
- Publication date May 10, 2007
- Cabot Corporation
- Toivo T. Kodas
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Low viscosity precursor compositions and methods for the deposition...
- Publication number 20070102683
- Publication date May 10, 2007
- Cabot Corporation
- Toivo T. Kodas
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Low viscosity precursor compositions and methods for the deposition...
- Publication number 20070102685
- Publication date May 10, 2007
- Cabot Corporation
- Toivo T. Kodas
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Low viscosity precursor compositions and methods for the deposition...
- Publication number 20070104870
- Publication date May 10, 2007
- Cabot Corporation
- Toivo T. Kodas
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

with a principal constituent of the material being a metal or a metalloid

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

P-type amorphous oxide semiconductor including gallium, method of m...

Apparatus and method for reducing volume of resource allocation inf...

Apparatus and method for reducing volume of resource allocation inf...

Semiconductor chip package with resilient conductive paste post and...

Bonding pad structure, bonding ring structure, and MEMS device pack...

Conductive connections, structures with such connections, and metho...

Reliable interconnect

Method for manufacturing semiconductor devices having a metallisati...

Conductive connections, structures with such connections, and metho...

Electronic apparatus and method for manufacturing electronic apparatus

Electrical connector between die pad and z-interconnect for stacked...

Electrical connector between die pad and z-interconnect for stacked...

Method for manufacturing semiconductor devices having a metallisati...

Low viscosity precursor compositions and methods for the deposition...

Patents Applicationslast 30 patents

METALLIZED SEMICONDUCTOR DIE AND MANUFACTURING METHOD

CHIP PACKAGE

APPARATUS AND METHOD FOR REDUCING VOLUME OF RESOURCE ALLOCATION INF...

Chip Packaging Structure and Related Inner Lead Bonding Method

CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...

BONDING PAD STRUCTURE, BONDING RING STRUCTURE, AND MEMS DEVICE PACK...

ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING ELECTRONIC APPARATUS

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A METALLISATI...

ELECTRONIC DEVICE

ELECTRONIC PACKAGING CONNECTOR AND METHODS FOR ITS PRODUCTION

Electrical Connector Between Die Pad and Z-Interconnect for Stacked...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A METALLISATI...

Low viscosity precursor compositions and methods for the deposition...

SEMICONDUCTOR PACKAGE SUBSTRATE HAVING ELECTRICAL CONNECTING PADS

Low viscosity precursor compositions and methods for the deposition...

Low viscosity precursor compositions and methods for the deposition...

Low viscosity precursor compositions and methods for the deposition...

Low viscosity precursor compositions and methods for the deposition...

PROCESSES FOR FORMING PHOTOVOLTAIC FEATURES

LOW VISCOSITY PRECURSOR COMPOSITIONS AND METHODS FOR THE DEPOSITION...

Low viscosity precursor compositions and methods for the deposition...

Low viscosity precursor compositions and methods for the deposition...

Low viscosity precursor compositions and methods for the deposition...

Low viscosity precursor compositions and methods for the deposition...

Low viscosity precursor compositions and methods for the deposition...

Low viscosity precursor compositions and methods for the deposition...

Low viscosity precursor compositions and methods for the deposition...

Low viscosity precursor compositions and methods for the deposition...

Low viscosity precursor compositions and methods for the deposition...

Low viscosity precursor compositions and methods for the deposition...