Membership
Tour
Register
Log in
with a principal constituent of the material being a metal or a metalloid
Follow
Industry
CPC
H01L2224/054
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/054
with a principal constituent of the material being a metal or a metalloid
Industries
Overview
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Bottom up electroplating with release layer
Patent number
10,957,628
Issue date
Mar 23, 2021
Corning Incorporated
Robert Alan Bellman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip package with resilient conductive paste post and...
Patent number
10,685,943
Issue date
Jun 16, 2020
Mediatek Inc.
Shiann-Tsong Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for obtaining a palladium surface finish for copper wire bon...
Patent number
8,987,910
Issue date
Mar 24, 2015
Atotech Deutschland GmbH
Mustafa Özkök
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
Semiconductor Device and Method of Making a Dual-Side Molded System...
Publication number
20240379480
Publication date
Nov 14, 2024
STATS ChipPAC Pte Ltd.
YongMoo Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE BONDING METHOD
Publication number
20240145416
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Wonyoung CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BOTTOM UP ELECTROPLATING WITH RELEASE LAYER
Publication number
20200111726
Publication date
Apr 9, 2020
Corning Incorporated
Robert Alan Bellman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR OBTAINING A PALLADIUM SURFACE FINISH FOR COPPER WIRE BON...
Publication number
20130288475
Publication date
Oct 31, 2013
Atotech Deutschland GmbH
Mustafa Özkök
H01 - BASIC ELECTRIC ELEMENTS