with a principal constituent of the material being a non metallic, non metalloid inorganic material

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H01L2224/13186

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13186with a principal constituent of the material being a non metallic, non metalloid inorganic material

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device and method of manufacturing electronic device
- Patent number 12,211,811
- Issue date Jan 28, 2025
- Industrial Technology Research Institute
- Yu-Ming Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for fabricating the same
- Patent number 12,125,838
- Issue date Oct 22, 2024
- Samsung Display Co., Ltd.
- Seung Geun Lee
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Display device and method for fabricating the same
- Patent number 11,784,177
- Issue date Oct 10, 2023
- Samsung Display Co., Ltd.
- Seung Geun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal pad modification
- Patent number 11,756,911
- Issue date Sep 12, 2023
- International Business Machines Corporation
- Krishna Tunga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film scheme for bumping
- Patent number 11,302,663
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film scheme for bumping
- Patent number 11,164,836
- Issue date Nov 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of manufacturing the same
- Patent number 10,777,522
- Issue date Sep 15, 2020
- NANYA TECHNOLOGY CORPORATION
- Chih-Ching Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film scheme for bumping
- Patent number 10,658,318
- Issue date May 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal pad modification
- Patent number 10,593,639
- Issue date Mar 17, 2020
- International Business Machines Corporation
- Krishna Tunga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer printed device repair
- Patent number 10,438,859
- Issue date Oct 8, 2019
- X-CELEPRINT LIMITED
- Ronald S. Cok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extrusion-resistant solder interconnect structures and methods of f...
- Patent number 10,049,897
- Issue date Aug 14, 2018
- GLOBALFOUNDRIES Inc.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems, methods and devices for inter-substrate coupling
- Patent number 9,728,489
- Issue date Aug 8, 2017
- Elwha LLC
- William David Duncan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extrusion-resistant solder interconnect structures and methods of f...
- Patent number 9,607,862
- Issue date Mar 28, 2017
- GLOBALFOUNDRIES Inc.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management in electronic devices with yielding substrates
- Patent number 9,583,691
- Issue date Feb 28, 2017
- COOLEDGE LIGHTING INC.
- Michael A. Tischler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip assembly process comprising pre-coating interconnect elem...
- Patent number 9,406,662
- Issue date Aug 2, 2016
- Commisariat A l'Energie Atomique et Aux Energies Alternatives
- François Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 9,355,974
- Issue date May 31, 2016
- SOCIONEXT INC.
- Masashi Takenaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package structure and fabrication method thereof
- Patent number 9,343,387
- Issue date May 17, 2016
- Siliconware Precision Industries Co., Ltd.
- Chu-Chi Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management in electronic devices with yielding substrates
- Patent number 9,324,930
- Issue date Apr 26, 2016
- Cooledge Lighting, Inc.
- Michael A. Tischler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming compliant conductive int...
- Patent number 9,245,834
- Issue date Jan 26, 2016
- STATS ChipPAC, Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a conducting contact on a conducting element
- Patent number 9,224,708
- Issue date Dec 29, 2015
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jean-Philippe Colonna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 9,142,516
- Issue date Sep 22, 2015
- SOCIONEXT INC.
- Masashi Takenaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming bumps in substrates with through vias
- Patent number 8,759,215
- Issue date Jun 24, 2014
- STMicroelectronics S.R.L.
- Gian Pietro Vanalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, stack module, and memory card
- Patent number 8,710,591
- Issue date Apr 29, 2014
- Samsung Electronics Co., Ltd.
- Hyong-ryol Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode arrays and methods of fabricating the same using printing...
- Patent number 8,546,257
- Issue date Oct 1, 2013
- International Business Machines Corporation
- Tobias Kraus
- G01 - MEASURING TESTING
Information Patent Grant
Stress reduction in chip packaging by using a low-temperature chip-...
- Patent number 8,482,123
- Issue date Jul 9, 2013
- GLOBALFOUNDRIES Inc.
- Michael Grillberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of attaching a solder ball and method of repairing a memory...
- Patent number 8,070,048
- Issue date Dec 6, 2011
- Samsung Electronics Co., Ltd.
- Nam-Yong Oh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microball attachment using self-assembly for substrate bumping
- Patent number 7,651,021
- Issue date Jan 26, 2010
- Intel Corporation
- Lakshmi Supriya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF MAKING
- Publication number 20240387500
- Publication date Nov 21, 2024
- Yibu Semiconductor Co., Ltd.
- Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240290677
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Gyuseong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING SUBSTRATE, MANUFACTURING METHOD THEREOF, AND DISPLAY...
- Publication number 20230420431
- Publication date Dec 28, 2023
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Peihai WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUANTUM DEVICE
- Publication number 20230309419
- Publication date Sep 28, 2023
- NEC Corporation
- Katsumi KIKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL AND METHOD OF FORMING THE...
- Publication number 20230154885
- Publication date May 18, 2023
- Samsung Electronics Co., LTD
- Jinyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20230154877
- Publication date May 18, 2023
- Industrial Technology Research Institute
- Yu-Ming Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR FABRICATION THEREOF
- Publication number 20230053037
- Publication date Feb 16, 2023
- SAMSUNG DISPLAY CO., LTD.
- Jin Woo CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM SCHEME FOR BUMPING
- Publication number 20200243469
- Publication date Jul 30, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200211991
- Publication date Jul 2, 2020
- NANYA TECHNOLOGY CORPORATION
- Chih-Ching LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND METHOD OF MANUFACTURING PACKAGE THEREOF
- Publication number 20160255726
- Publication date Sep 1, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Jin O YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ON PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20150255360
- Publication date Sep 10, 2015
- Siliconware Precision Industries Co., Ltd.
- Chu-Chi Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT IN ELECTRONIC DEVICES WITH YIELDING SUBSTRATES
- Publication number 20140264427
- Publication date Sep 18, 2014
- Michael A. Tischler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING BUMPS IN SUBSTRATES WITH THROUGH VIAS
- Publication number 20140264852
- Publication date Sep 18, 2014
- STMicroelectronics S.r.l
- Gian Pietro Vanalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTRUSION-RESISTANT SOLDER INTERCONNECT STRUCTURES AND METHODS OF F...
- Publication number 20140070401
- Publication date Mar 13, 2014
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Compliant Conductive Int...
- Publication number 20130241071
- Publication date Sep 19, 2013
- STATS ChipPAC, Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND STACKED SEMICONDUCTOR PACKAGE
- Publication number 20130099359
- Publication date Apr 25, 2013
- SK HYNIX INC.
- Sung Min KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Bump Bonding In Semiconductor Package Using Solder Balls Hav...
- Publication number 20130043573
- Publication date Feb 21, 2013
- Advanced Analogic Technologies (Hong Kong) Limited
- Richard K. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20130026649
- Publication date Jan 31, 2013
- FUJITSU SEMICONDUCTOR LIMITED
- Masashi Takenaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODE ARRAYS AND METHODS OF FABRICATING THE SAME USING PRINTING...
- Publication number 20120282771
- Publication date Nov 8, 2012
- International Business Machines Corporation
- Tobias Kraus
- G01 - MEASURING TESTING
Information Patent Application
Stress Reduction in Chip Packaging by Using a Low-Temperature Chip-...
- Publication number 20120049350
- Publication date Mar 1, 2012
- GLOBALFOUNDRIES INC.
- Michael Grillberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, STACK MODULE, AND MEMORY CARD
- Publication number 20110095373
- Publication date Apr 28, 2011
- Hyong-ryol HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ATTACHING A SOLDER BALL AND METHOD OF REPAIRING A MEMORY...
- Publication number 20110068151
- Publication date Mar 24, 2011
- Samsung Electronics Co., Ltd.
- Nam-Yong OH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING BUMPS IN SUBSTRATES WITH THROUGH VIAS
- Publication number 20100032834
- Publication date Feb 11, 2010
- STMicroelectronics S.r.l.
- Gian Pietro Vanalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODE ARRAYS AND METHODS OF FABRICATING THE SAME USING PRINTING...
- Publication number 20090278213
- Publication date Nov 12, 2009
- International Business Machines Corporation
- Tobias Kraus
- G01 - MEASURING TESTING
Information Patent Application
MICROBALL ATTACHMENT USING SELF-ASSEMBLY FOR SUBSTRATE BUMPING
- Publication number 20090166396
- Publication date Jul 2, 2009
- Lakshmi SUPRIYA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

with a principal constituent of the material being a non metallic, non metalloid inorganic material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device and method of manufacturing electronic device

Display device and method for fabricating the same

Display device and method for fabricating the same

Metal pad modification

Film scheme for bumping

Film scheme for bumping

Semiconductor structure and method of manufacturing the same

Film scheme for bumping

Metal pad modification

Transfer printed device repair

Extrusion-resistant solder interconnect structures and methods of f...

Systems, methods and devices for inter-substrate coupling

Extrusion-resistant solder interconnect structures and methods of f...

Thermal management in electronic devices with yielding substrates

Flip-chip assembly process comprising pre-coating interconnect elem...

Semiconductor device and manufacturing method therefor

Package on package structure and fabrication method thereof

Thermal management in electronic devices with yielding substrates

Semiconductor device and method of forming compliant conductive int...

Method for manufacturing a conducting contact on a conducting element

Semiconductor device and manufacturing method therefor

Method for forming bumps in substrates with through vias

Semiconductor chip, stack module, and memory card

Electrode arrays and methods of fabricating the same using printing...

Stress reduction in chip packaging by using a low-temperature chip-...

Method of attaching a solder ball and method of repairing a memory...

Microball attachment using self-assembly for substrate bumping

Patents Applicationslast 30 patents

MULTI-CHIP PACKAGE AND METHOD OF MAKING

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

LIGHT-EMITTING SUBSTRATE, MANUFACTURING METHOD THEREOF, AND DISPLAY...

QUANTUM DEVICE

SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL AND METHOD OF FORMING THE...

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

DISPLAY DEVICE AND METHOD FOR FABRICATION THEREOF

FILM SCHEME FOR BUMPING

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

PACKAGE AND METHOD OF MANUFACTURING PACKAGE THEREOF

PACKAGE ON PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

THERMAL MANAGEMENT IN ELECTRONIC DEVICES WITH YIELDING SUBSTRATES

METHOD FOR FORMING BUMPS IN SUBSTRATES WITH THROUGH VIAS

EXTRUSION-RESISTANT SOLDER INTERCONNECT STRUCTURES AND METHODS OF F...

Semiconductor Device and Method of Forming Compliant Conductive Int...

SEMICONDUCTOR PACKAGE AND STACKED SEMICONDUCTOR PACKAGE

Solder Bump Bonding In Semiconductor Package Using Solder Balls Hav...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

ELECTRODE ARRAYS AND METHODS OF FABRICATING THE SAME USING PRINTING...

Stress Reduction in Chip Packaging by Using a Low-Temperature Chip-...

SEMICONDUCTOR CHIP, STACK MODULE, AND MEMORY CARD

METHOD OF ATTACHING A SOLDER BALL AND METHOD OF REPAIRING A MEMORY...

METHOD FOR FORMING BUMPS IN SUBSTRATES WITH THROUGH VIAS

ELECTRODE ARRAYS AND METHODS OF FABRICATING THE SAME USING PRINTING...

MICROBALL ATTACHMENT USING SELF-ASSEMBLY FOR SUBSTRATE BUMPING