with a principal constituent of the material being a non metallic, non metalloid inorganic material

Industry

CPC
H01L2224/13386

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13386with a principal constituent of the material being a non metallic, non metalloid inorganic material

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Engineered polymer-based electronic materials
- Patent number 10,682,732
- Issue date Jun 16, 2020
- Alpha Assembly Solutions Inc.
- Ramakrishna Hosur Venkatagiriyappa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solid-state device including a conductive bump connected to a metal...
- Patent number 9,966,332
- Issue date May 8, 2018
- Toyoda Gosei Co., Ltd.
- Yoshinobu Suehiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elastic conductive resin, and electronic device including elastic c...
- Patent number 7,875,807
- Issue date Jan 25, 2011
- Ricoh Company, Ltd.
- Takeshi Sano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Underfill and encapsulation of semiconductor assemblies with materi...
- Patent number 7,547,978
- Issue date Jun 16, 2009
- Micron Technology, Inc.
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit die containing particle-filled through-silicon m...
- Patent number 7,528,006
- Issue date May 5, 2009
- Intel Corporation
- Leonel Arana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices at least partially covered by a composite coa...
- Patent number 7,282,806
- Issue date Oct 16, 2007
- Micron Technology, Inc.
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, mounting circuit board, method of producing t...
- Patent number 6,909,180
- Issue date Jun 21, 2005
- Matsushita Electric Industrial Co., Ltd.
- Masahiro Ono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240047446
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130248916
- Publication date Sep 26, 2013
- Toyoda Gosei Co., Ltd.
- Yoshinobu Suehiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit die containing particale-filled through-silicon...
- Publication number 20100193952
- Publication date Aug 5, 2010
- Leonel Arana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELASTIC CONDUCTIVE RESIN, AND ELECTRONIC DEVICE INCLUDING ELASTIC C...
- Publication number 20070132098
- Publication date Jun 14, 2007
- Takeshi Sano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods of underfilling and encapsulating semiconductor assemblies...
- Publication number 20070020814
- Publication date Jan 25, 2007
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit die containing particle-filled through-silicon m...
- Publication number 20070001266
- Publication date Jan 4, 2007
- Leonel Arana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor devices at least partially covered by a composite coa...
- Publication number 20070001321
- Publication date Jan 4, 2007
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Underfill and encapsulation of semicondcutor assemblies with materi...
- Publication number 20050277231
- Publication date Dec 15, 2005
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit substrate for packaging semiconductor device, method for pr...
- Publication number 20050163982
- Publication date Jul 28, 2005
- Masahiro Ono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Elastic conductive resin, and electronic device including elastic c...
- Publication number 20040108133
- Publication date Jun 10, 2004
- Takeshi Sano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device, mounting circuit board, method of producing t...
- Publication number 20030049425
- Publication date Mar 13, 2003
- Masahiro Ono
- H01 - BASIC ELECTRIC ELEMENTS

with a principal constituent of the material being a non metallic, non metalloid inorganic material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Engineered polymer-based electronic materials

Solid-state device including a conductive bump connected to a metal...

Elastic conductive resin, and electronic device including elastic c...

Underfill and encapsulation of semiconductor assemblies with materi...

Integrated circuit die containing particle-filled through-silicon m...

Semiconductor devices at least partially covered by a composite coa...

Semiconductor device, mounting circuit board, method of producing t...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME

SOLID-STATE DEVICE AND METHOD OF MANUFACTURING THE SAME

Integrated circuit die containing particale-filled through-silicon...

ELASTIC CONDUCTIVE RESIN, AND ELECTRONIC DEVICE INCLUDING ELASTIC C...

Methods of underfilling and encapsulating semiconductor assemblies...

Integrated circuit die containing particle-filled through-silicon m...

Semiconductor devices at least partially covered by a composite coa...

Underfill and encapsulation of semicondcutor assemblies with materi...

Circuit substrate for packaging semiconductor device, method for pr...

Elastic conductive resin, and electronic device including elastic c...

Semiconductor device, mounting circuit board, method of producing t...