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with a principal constituent of the material being a non metallic, non metalloid inorganic material
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H01L2224/13386
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/13386
with a principal constituent of the material being a non metallic, non metalloid inorganic material
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Patents Grants
last 30 patents
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Patent Grant
Engineered polymer-based electronic materials
Patent number
10,682,732
Issue date
Jun 16, 2020
Alpha Assembly Solutions Inc.
Ramakrishna Hosur Venkatagiriyappa
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Solid-state device including a conductive bump connected to a metal...
Patent number
9,966,332
Issue date
May 8, 2018
Toyoda Gosei Co., Ltd.
Yoshinobu Suehiro
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Elastic conductive resin, and electronic device including elastic c...
Patent number
7,875,807
Issue date
Jan 25, 2011
Ricoh Company, Ltd.
Takeshi Sano
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Underfill and encapsulation of semiconductor assemblies with materi...
Patent number
7,547,978
Issue date
Jun 16, 2009
Micron Technology, Inc.
David R. Hembree
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit die containing particle-filled through-silicon m...
Patent number
7,528,006
Issue date
May 5, 2009
Intel Corporation
Leonel Arana
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices at least partially covered by a composite coa...
Patent number
7,282,806
Issue date
Oct 16, 2007
Micron Technology, Inc.
David R. Hembree
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device, mounting circuit board, method of producing t...
Patent number
6,909,180
Issue date
Jun 21, 2005
Matsushita Electric Industrial Co., Ltd.
Masahiro Ono
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
Publication number
20240047446
Publication date
Feb 8, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Mao-Yen Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLID-STATE DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20130248916
Publication date
Sep 26, 2013
Toyoda Gosei Co., Ltd.
Yoshinobu Suehiro
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated circuit die containing particale-filled through-silicon...
Publication number
20100193952
Publication date
Aug 5, 2010
Leonel Arana
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELASTIC CONDUCTIVE RESIN, AND ELECTRONIC DEVICE INCLUDING ELASTIC C...
Publication number
20070132098
Publication date
Jun 14, 2007
Takeshi Sano
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Methods of underfilling and encapsulating semiconductor assemblies...
Publication number
20070020814
Publication date
Jan 25, 2007
David R. Hembree
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated circuit die containing particle-filled through-silicon m...
Publication number
20070001266
Publication date
Jan 4, 2007
Leonel Arana
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor devices at least partially covered by a composite coa...
Publication number
20070001321
Publication date
Jan 4, 2007
David R. Hembree
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Underfill and encapsulation of semicondcutor assemblies with materi...
Publication number
20050277231
Publication date
Dec 15, 2005
David R. Hembree
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Circuit substrate for packaging semiconductor device, method for pr...
Publication number
20050163982
Publication date
Jul 28, 2005
Masahiro Ono
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Elastic conductive resin, and electronic device including elastic c...
Publication number
20040108133
Publication date
Jun 10, 2004
Takeshi Sano
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Semiconductor device, mounting circuit board, method of producing t...
Publication number
20030049425
Publication date
Mar 13, 2003
Masahiro Ono
H01 - BASIC ELECTRIC ELEMENTS