with a principal constituent of the material being a non metallic, non metalloid inorganic material

Industry

CPC
H01L2224/45186

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/45186with a principal constituent of the material being a non metallic, non metalloid inorganic material

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 11,342,299
- Issue date May 24, 2022
- Nippon Micrometal Corporation
- Daizo Oda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Wire structure and semiconductor device having the same, and method...
- Patent number 9,373,602
- Issue date Jun 21, 2016
- Samsung Electronics Co., Ltd.
- Eun-kyung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for composite bond wires
- Patent number 8,134,073
- Issue date Mar 13, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chris Wyland
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
TECHNOLOGIES FOR RADIO FREQUENCY OPTIMIZED INTERCONNECTS FOR A QUAN...
- Publication number 20230210023
- Publication date Jun 29, 2023
- Intel Corporation
- Hubert C. George
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20220108971
- Publication date Apr 7, 2022
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20180374816
- Publication date Dec 27, 2018
- Nippon Micrometal Corporation
- Daizo ODA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
WIRE STRUCTURE AND SEMICONDUCTOR DEVICE HAVING THE SAME, AND METHOD...
- Publication number 20150061161
- Publication date Mar 5, 2015
- SUNGKYUNKWAN UNIVERSITY FOUNDATION FOR CORPORATE COLLABORATION
- Eun-kyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PALLADIUM PRECURSOR COMPOSITION
- Publication number 20140079954
- Publication date Mar 20, 2014
- Xerox Corporation
- Yiliang Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND SYSTEM FOR COMPOSITE BOND WIRES
- Publication number 20090301757
- Publication date Dec 10, 2009
- Chris Wyland
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

with a principal constituent of the material being a non metallic, non metalloid inorganic material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding wire for semiconductor devices

Wire structure and semiconductor device having the same, and method...

Method and system for composite bond wires

Patents Applicationslast 30 patents

TECHNOLOGIES FOR RADIO FREQUENCY OPTIMIZED INTERCONNECTS FOR A QUAN...

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

WIRE STRUCTURE AND SEMICONDUCTOR DEVICE HAVING THE SAME, AND METHOD...

PALLADIUM PRECURSOR COMPOSITION

METHOD AND SYSTEM FOR COMPOSITE BOND WIRES