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with a principal constituent of the material being a non metallic, non metalloid inorganic material
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H01L2224/80486
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/80486
with a principal constituent of the material being a non metallic, non metalloid inorganic material
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last 30 patents
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Patent Grant
Electronic device and method of manufacturing electronic device
Patent number
12,211,811
Issue date
Jan 28, 2025
Industrial Technology Research Institute
Yu-Ming Peng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedded cooling systems and methods of manufacturing embedded cool...
Patent number
12,191,233
Issue date
Jan 7, 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Embedded cooling assemblies for advanced device packaging and metho...
Patent number
12,183,659
Issue date
Dec 31, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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Patent Application
OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20250044510
Publication date
Feb 6, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Ming-Fa Chen
G02 - OPTICS
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Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING
Publication number
20240379564
Publication date
Nov 14, 2024
Taiwan Semiconductor Manufacturing Company Limited
Yi-Chu WU
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240250039
Publication date
Jul 25, 2024
NANYA TECHNOLOGY CORPORATION
Wu-Der Yang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240250038
Publication date
Jul 25, 2024
NANYA TECHNOLOGY CORPORATION
Wu-Der Yang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHO...
Publication number
20240222226
Publication date
Jul 4, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240128147
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Sey-Ping SUN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...
Publication number
20240038633
Publication date
Feb 1, 2024
INVENSAS BONDING TECHNOLOGIES, INC.
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240006301
Publication date
Jan 4, 2024
nD-HI Technologies Lab, Inc.
Ho-Ming TONG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
Publication number
20230154877
Publication date
May 18, 2023
Industrial Technology Research Institute
Yu-Ming Peng
H01 - BASIC ELECTRIC ELEMENTS