TREA

with a principal constituent of the material being a non metallic, non metalloid inorganic material

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Industry

  • CPC
  • H01L2224/45386
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/45386with a principal constituent of the material being a non metallic, non metalloid inorganic material
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Method and system for composite bond wires
    • Patent number 8,134,073
    • Issue date Mar 13, 2012
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chris Wyland
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Grant

    Bonding wire and bonded connection
    • Patent number 7,319,196
    • Issue date Jan 15, 2008
    • EUPEC Europaeische Gesellschaft fur Leistungshalbleiter mbH
    • Guy LeFranc
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    METHOD AND SYSTEM FOR COMPOSITE BOND WIRES
    • Publication number 20090301757
    • Publication date Dec 10, 2009
    • Chris Wyland
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Bonding wire and bonded connection
    • Publication number 20060055041
    • Publication date Mar 16, 2006
    • Eupec Europaische Gesellschaft fur Leistungshalbleiter mbH
    • Guy LeFranc
    • H01 - BASIC ELECTRIC ELEMENTS