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with a principal constituent of the material being a polymer
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/2929
with a principal constituent of the material being a polymer
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Patents Grants
last 30 patents
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Patent Grant
Package structure
Patent number
12,347,739
Issue date
Jul 1, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Wei Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Tip connection portion of terminal member and associated semiconduc...
Patent number
12,347,750
Issue date
Jul 1, 2025
Shindengen Electric Manufacturing Co., Ltd.
Soichiro Umeda
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Electronic device
Patent number
12,340,759
Issue date
Jun 24, 2025
Samsung Display Co., Ltd.
Sujeong Kim
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semifinished product for populating with components and, method for...
Patent number
12,341,127
Issue date
Jun 24, 2025
Siemens Aktiengesellschaft
Nora Jeske
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package
Patent number
12,315,785
Issue date
May 27, 2025
Advanced Semiconductor Engineering, Inc.
Yu-Ying Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a packaged semiconductor device having enhanced w...
Patent number
12,300,582
Issue date
May 13, 2025
Amkor Technology Singapore Holding Pte Ltd.
Pedro Joel Rivera-Marty
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for packaging stacking flip chip
Patent number
12,293,984
Issue date
May 6, 2025
Hebei Beixin Semiconductor Technology Co., Ltd.
Honglei Ran
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and method for manufacturing the same
Patent number
12,288,739
Issue date
Apr 29, 2025
Rohm Co., Ltd.
Motoharu Haga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages
Patent number
12,283,555
Issue date
Apr 22, 2025
Analog Devices International Unlimited Company
Bilge Bayrakci
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Alumina-based thermally conductive oxide and method for producing same
Patent number
12,281,254
Issue date
Apr 22, 2025
Dainichiseika Color & Chemicals Mfg. Co., Ltd.
Akira Nishio
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Thermal structure for semiconductor device and method of forming th...
Patent number
12,272,613
Issue date
Apr 8, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Wei-Ming Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device arrangement with compressible adhesive
Patent number
12,249,561
Issue date
Mar 11, 2025
Infineon Technologies AG
Thorsten Scharf
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Display device and method of manufacturing the same
Patent number
12,243,844
Issue date
Mar 4, 2025
Samsung Display Co., Ltd.
Byoungyong Kim
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Circuit board with bridge chiplets
Patent number
12,238,872
Issue date
Feb 25, 2025
Advanced Micro Devices, Inc.
Robert N. McLellan
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of manufacturing semiconductor package, and semiconductor pa...
Patent number
12,230,580
Issue date
Feb 18, 2025
Samsung Electronics Co., Ltd.
Junghoon Kang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Thermal conductive film
Patent number
12,183,653
Issue date
Dec 31, 2024
Samsung Electronics Co., Ltd.
Joungphil Lee
H01 - BASIC ELECTRIC ELEMENTS
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Method of manufacturing an electronic device
Patent number
12,173,207
Issue date
Dec 24, 2024
Celanese Mercury Holdings Inc.
Yumi Matsuura
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Patent Grant
Resin particles, electrically conductive particles, electrically co...
Patent number
12,122,885
Issue date
Oct 22, 2024
Sekisui Chemical Co., Ltd.
Kouki Ookura
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and a method of manufacturing thereof
Patent number
12,119,321
Issue date
Oct 15, 2024
Epistar Corporation
Shih-An Liao
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Low pressure sintering powder
Patent number
12,113,039
Issue date
Oct 8, 2024
Alpha Assembly Solutions Inc.
Shamik Ghoshal
B22 - CASTING POWDER METALLURGY
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Method for permanent connection of two metal surfaces
Patent number
12,107,057
Issue date
Oct 1, 2024
EV Group E. Thallner GmbH
Viorel Dragoi
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device with a semiconductor die embedded between an e...
Patent number
12,107,035
Issue date
Oct 1, 2024
Amkor Technology Singapore Holdings Pte. Ltd.
Jae Yun Kim
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Connection structure and manufacturing method therefor
Patent number
12,100,923
Issue date
Sep 24, 2024
Resonac Corporation
Kunihiko Akai
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Electronic package, heat dissipation structure and manufacturing me...
Patent number
12,080,618
Issue date
Sep 3, 2024
Siliconware Precision Industries Co., Ltd.
Yu-Lung Huang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Multichip packaged semiconductor device
Patent number
12,057,377
Issue date
Aug 6, 2024
MagnaChip Semiconductor, Ltd.
Hyun Dong Kim
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Silver sintering composition containing copper alloy for metal bonding
Patent number
12,051,522
Issue date
Jul 30, 2024
Henkel AG & Co. KGaA
Wei Yao
B22 - CASTING POWDER METALLURGY
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Patent Grant
Methods and systems for attaching detectors to electronic readout s...
Patent number
12,043,016
Issue date
Jul 23, 2024
Rapiscan Systems, Inc.
Evgeniy Kuksin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding sheet and bonded structure
Patent number
12,046,572
Issue date
Jul 23, 2024
Mitsui Mining & Smelting Co., Ltd.
Kei Anai
B22 - CASTING POWDER METALLURGY
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Patent Grant
Pressure sintering device and method for manufacturing an electroni...
Patent number
12,046,576
Issue date
Jul 23, 2024
Danfoss Silicon Power GmbH
Martin Becker
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Thermal interface material, an integrated circuit formed therewith,...
Patent number
12,027,442
Issue date
Jul 2, 2024
ARIECA INC.
Jeffrey Gelorme
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20250226296
Publication date
Jul 10, 2025
ROHM CO., LTD.
Motoharu Haga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADHESIVE FILM FOR SEMICONDUCTORS, DICING DIE BONDING FILM, AND METH...
Publication number
20250226347
Publication date
Jul 10, 2025
Resonac Corporation
Takaaki NIWA
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
ADHESIVE FILM FOR SEMICONDUCTORS, DICING/DIE-BONDING FILM, AND METH...
Publication number
20250226348
Publication date
Jul 10, 2025
Resonac Corporation
Takahiro KURODA
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
CONNECTING STRUCTURE
Publication number
20250219004
Publication date
Jul 3, 2025
NITTO DENKO CORPORATION
Masatoshi KATO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME
Publication number
20250210440
Publication date
Jun 26, 2025
Samsung Electronics Co., Ltd.
Minjung KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE ATTACH FILM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20250210448
Publication date
Jun 26, 2025
Samsung Electronics Co., Ltd.
Myoungchul Eum
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
FILM-SHAPED SINTERING MATERIAL FOR HEATING AND PRESSURIZATION, AND...
Publication number
20250206989
Publication date
Jun 26, 2025
Lintec Corporation
Taku NEMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL SINTERING PREPARATION AND THE USE THEREOF FOR THE CONNECTING...
Publication number
20250210573
Publication date
Jun 26, 2025
Heraeus Electronics GmbH & Co. KG
Wolfgang SCHMITT
B22 - CASTING POWDER METALLURGY
Information
Patent Application
STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTERPOSER CHIP
Publication number
20250210610
Publication date
Jun 26, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Po-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Methods of Manufacturing a Semiconductor D...
Publication number
20250210447
Publication date
Jun 26, 2025
Celanese Mercury Holdings Inc.
Shufang Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH HIGH CAPA...
Publication number
20250201768
Publication date
Jun 19, 2025
Intel Corporation
Sagar Suthram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20250201658
Publication date
Jun 19, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Kuan-Min Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Sintering Methods
Publication number
20250203784
Publication date
Jun 19, 2025
Celanese Mercury Holdings Inc.
Kazutaka Ozawa
B22 - CASTING POWDER METALLURGY
Information
Patent Application
Thermal Structure for Semiconductor Device and Method of Forming th...
Publication number
20250201649
Publication date
Jun 19, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Wei-Ming Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE STRUCTURE WITH LID AND METHOD FOR FORMING THE SAME
Publication number
20250201652
Publication date
Jun 19, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Kuan-Min Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HEAT-SPREADING LID
Publication number
20250201668
Publication date
Jun 19, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Ching Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20250183224
Publication date
Jun 5, 2025
Samsung Electronics Co., Ltd.
JIN-WOO PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPPER MICROPARTICLE DISPERSION
Publication number
20250183215
Publication date
Jun 5, 2025
KAO CORPORATION
Takaaki EYAMA
B22 - CASTING POWDER METALLURGY
Information
Patent Application
MICRO LED ARRAY ELECTRONIC DEVICE AND ITS TRANSFER METHOD
Publication number
20250176343
Publication date
May 29, 2025
Seoul National University R&DB Foundation
Yong Taek HONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...
Publication number
20250167080
Publication date
May 22, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Pedro Joel Rivera-Marty
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LASER TRANSFER OF MICROELECTRONIC DEVICE AND ASSOCIATED CONDUCTIVE PAD
Publication number
20250167170
Publication date
May 22, 2025
COHERENT LASERSYSTEMS GMBH & CO. KG
Muhammad FATAHILAH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
Publication number
20250157985
Publication date
May 15, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Michael Kelly
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FILM-LIKE ADHESIVE AND METHOD FOR PRODUCING SAME, INTEGRATED DICING...
Publication number
20250157976
Publication date
May 15, 2025
Resonac Corporation
Tomoyo KANEKO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE ATTACH ADHESIVES WITH TAILORABLE CHARACTERISTICS USING SELECTIV...
Publication number
20250154378
Publication date
May 15, 2025
Micron Technology, Inc.
Ankur Harish Shah
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Publication number
20250157975
Publication date
May 15, 2025
NITTO DENKO CORPORATION
Tsubasa OMURA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROMECHANICAL COMPONENT AND CORRESPONDING PRODUCTION METHOD
Publication number
20250157998
Publication date
May 15, 2025
ROBERT BOSCH GmbH
Dorothea Papathanassiou
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
PACKAGE STRUCTURE INCLUDING A REDISTRIBUTION LAYER (RDL) STRUCTURE...
Publication number
20250149524
Publication date
May 8, 2025
Taiwan Semiconductor Manufacturing Company Limited
Chun-Sheng Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20250149494
Publication date
May 8, 2025
Samsung Electronics Co., Ltd.
Jaekyung Yoo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
UNDERFILL MATERIAL, SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING...
Publication number
20250140732
Publication date
May 1, 2025
Resonac Corporation
Tomoya MASUDA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PA...
Publication number
20250140709
Publication date
May 1, 2025
Samsung Electronics Co., Ltd.
Junghoon Kang
H01 - BASIC ELECTRIC ELEMENTS