with a principal constituent of the material being a polymer

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H01L2224/8049

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/8049with a principal constituent of the material being a polymer

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Patents Grantslast 30 patents

Information Patent Grant
Method of liquid assisted micro cold binding
- Patent number 10,672,736
- Issue date Jun 2, 2020
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterostructure comprising a carbon nanomembrane
- Patent number 9,735,366
- Issue date Aug 15, 2017
- CNM TECHNOLOGIES GMBH
- Andrey Turchanin
- C01 - INORGANIC CHEMISTRY

Patents Applicationslast 30 patents

Information Patent Application
TECHNOLOGIES FOR DIE RECYCLING FOR HIGH YIELD PACKAGING
- Publication number 20240222298
- Publication date Jul 4, 2024
- Intel Corporation
- Jeremy D. Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING A DIE TO A SUBSTRATE WITH VIAS CONNECTING METAL PADS...
- Publication number 20230317653
- Publication date Oct 5, 2023
- Intel Corporation
- Hongxia FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20230154877
- Publication date May 18, 2023
- Industrial Technology Research Institute
- Yu-Ming Peng
- H01 - BASIC ELECTRIC ELEMENTS