with a principal constituent of the material being a polymer

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H01L2924/1659

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/1659with a principal constituent of the material being a polymer

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package aligning interposer and substrate
- Patent number 12,051,680
- Issue date Jul 30, 2024
- Samsung Electronics Co., Ltd.
- Tae Hwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 11,862,525
- Issue date Jan 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with partitioned logic and ass...
- Patent number 11,562,986
- Issue date Jan 24, 2023
- Micron Technology, Inc.
- Jian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 11,276,616
- Issue date Mar 15, 2022
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded package assemblies with integrated capacitor
- Patent number 11,049,819
- Issue date Jun 29, 2021
- International Business Machines Corporation
- Mark C. Lamorey
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Stacked semiconductor die assemblies with partitioned logic and ass...
- Patent number 10,978,427
- Issue date Apr 13, 2021
- Micron Technology, Inc.
- Jian Li
- G11 - INFORMATION STORAGE
Information Patent Grant
Thermal interface material on package
- Patent number 10,896,862
- Issue date Jan 19, 2021
- International Business Machines Corporation
- Isabel De Sousa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability wafer level semiconductor packaging
- Patent number 10,790,208
- Issue date Sep 29, 2020
- Semiconductor Components Industries, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 10,658,255
- Issue date May 19, 2020
- ADVANCED SEMSCONDUCTOR ENGINEERING, INC.
- Tsung-Yu Lin
- G01 - MEASURING TESTING
Information Patent Grant
Shielded package assemblies with integrated capacitor
- Patent number 10,553,544
- Issue date Feb 4, 2020
- International Business Machines Corporation
- Mark C. Lamorey
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
High reliability wafer level semiconductor packaging
- Patent number 10,290,556
- Issue date May 14, 2019
- Semiconductor Components Industries, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical package including bimetal lid
- Patent number 10,090,257
- Issue date Oct 2, 2018
- International Business Machines Corporation
- Keiji Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses and methods for heat transfer from packaged semiconduct...
- Patent number 10,068,875
- Issue date Sep 4, 2018
- Micron Technology, Inc.
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Limiting electronic package warpage
- Patent number 10,056,268
- Issue date Aug 21, 2018
- International Business Machines Corporation
- Shidong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical package including bimetal lid
- Patent number 10,032,727
- Issue date Jul 24, 2018
- International Business Machines Corporation
- Keiji Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 10,032,692
- Issue date Jul 24, 2018
- NVIDIA Corporation
- Shantanu Kalchuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material on package
- Patent number 9,941,184
- Issue date Apr 10, 2018
- International Business Machines Corporation
- Isabel De Sousa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Limiting electronic package warpage with semiconductor chip lid and...
- Patent number 9,892,935
- Issue date Feb 13, 2018
- International Business Machines Corporation
- Shidong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material on package
- Patent number 9,881,848
- Issue date Jan 30, 2018
- International Business Machines Corporation
- Isabel De Sousa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability wafer level semiconductor packaging
- Patent number 9,859,180
- Issue date Jan 2, 2018
- Semiconductor Components Industries, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages
- Patent number 9,837,328
- Issue date Dec 5, 2017
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming semiconductor device packages
- Patent number 9,837,327
- Issue date Dec 5, 2017
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus and method for fabricating the same
- Patent number 9,812,418
- Issue date Nov 7, 2017
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus and method for fabricating the same
- Patent number 9,761,552
- Issue date Sep 12, 2017
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal interface material on package
- Patent number 9,761,505
- Issue date Sep 12, 2017
- International Business Machines Corporation
- Isabel De Sousa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packages and methods of manufacture thereof
- Patent number 9,735,130
- Issue date Aug 15, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having multiple bonded heat sinks
- Patent number 9,721,866
- Issue date Aug 1, 2017
- SOCIONEXT INC.
- Takeshi Imamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 9,716,049
- Issue date Jul 25, 2017
- SOCIONEXT INC.
- Kazuyuki Urago
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 9,693,462
- Issue date Jun 27, 2017
- Mitsubishi Electric Corporation
- Takeshi Hosomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material on package
- Patent number 9,646,913
- Issue date May 9, 2017
- International Business Machines Corporation
- Isabel De Sousa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device Package with Thermal Module
- Publication number 20240395663
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sing-Da JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312947
- Publication date Sep 19, 2024
- Kabushiki Kaisha Toshiba
- Tomohiro IGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20240145319
- Publication date May 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240120252
- Publication date Apr 11, 2024
- RENESAS ELECTRONICS CORPORATION
- Nobuhiro KINOSHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE SEALANT FOR CHIP PACKAGING AND PACKAGING STRUCTURE
- Publication number 20240030075
- Publication date Jan 25, 2024
- Wuhan Choice Technology Co,Ltd
- De WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Sensing External Condition in H...
- Publication number 20240003768
- Publication date Jan 4, 2024
- UTAC Headquarters Pte. Ltd.
- Paweena Phatto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230402398
- Publication date Dec 14, 2023
- Siliconware Precision Industries Co., Ltd.
- Che-Chi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method Forming Same
- Publication number 20230395461
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20230378024
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Warpage Compensation for BGA Package
- Publication number 20230147273
- Publication date May 11, 2023
- Apple Inc.
- Brett W. Degner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ALIGNING INTERPOSER AND SUBSTRATE
- Publication number 20230120252
- Publication date Apr 20, 2023
- Samsung Electronics Co., Ltd.
- TAE HWAN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20220208623
- Publication date Jun 30, 2022
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH PARTITIONED LOGIC AND ASS...
- Publication number 20210217734
- Publication date Jul 15, 2021
- Micron Technology, Inc.
- Jian Li
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20200243408
- Publication date Jul 30, 2020
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu LIN
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR MOUNTING COMPONENT
- Publication number 20200196433
- Publication date Jun 18, 2020
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED PACKAGE ASSEMBLIES WITH INTEGRATED CAPACITOR
- Publication number 20200083177
- Publication date Mar 12, 2020
- International Business Machines Corporation
- Mark C. Lamorey
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING
- Publication number 20190229025
- Publication date Jul 25, 2019
- Semiconductor Components Industries, LLC
- Yu-Te HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL ON PACKAGE
- Publication number 20180190565
- Publication date Jul 5, 2018
- International Business Machines Corporation
- Isabel DE SOUSA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING
- Publication number 20180082913
- Publication date Mar 22, 2018
- Semiconductor Components Industries, LLC
- Yu-Te HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL ON PACKAGE
- Publication number 20180047655
- Publication date Feb 15, 2018
- International Business Machines Corporation
- Isabel DE SOUSA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIMITING ELECTRONIC PACKAGE WARPAGE
- Publication number 20180047590
- Publication date Feb 15, 2018
- International Business Machines Corporation
- Shidong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING
- Publication number 20170236761
- Publication date Aug 17, 2017
- Semiconductor Components Industries, LLC
- Yu-Te HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MICROPHONE
- Publication number 20140367808
- Publication date Dec 18, 2014
- Omron Corporation
- Naoto Kuratani
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20140264816
- Publication date Sep 18, 2014
- NVIDIA Corporation
- Shantanu Kalchuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20140197533
- Publication date Jul 17, 2014
- FUJITSU SEMICONDUCTOR LIMITED
- Takeshi Imamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140167246
- Publication date Jun 19, 2014
- FUJITSU SEMICONDUCTOR LIMITED
- Takumi Ihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20140131886
- Publication date May 15, 2014
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE INCLUDING WIRE BOND AND ELECTRICALLY CON...
- Publication number 20140124962
- Publication date May 8, 2014
- Honeywell International Inc.
- David Scheid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PROCESS FOR FABRICATING PHOTOELECTRIC MODULES
- Publication number 20130309801
- Publication date Nov 21, 2013
- CENTERA PHOTONICS INC.
- Hsu-Liang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAMELESS HERMETIC CIRCUIT PACKAGE
- Publication number 20130187286
- Publication date Jul 25, 2013
- Richard Schneider
- H01 - BASIC ELECTRIC ELEMENTS

with a principal constituent of the material being a polymer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package aligning interposer and substrate

Semiconductor device package and a method of manufacturing the same

Stacked semiconductor die assemblies with partitioned logic and ass...

Semiconductor device package and a method of manufacturing the same

Shielded package assemblies with integrated capacitor

Stacked semiconductor die assemblies with partitioned logic and ass...

Thermal interface material on package

High reliability wafer level semiconductor packaging

Semiconductor device package and a method of manufacturing the same

Shielded package assemblies with integrated capacitor

High reliability wafer level semiconductor packaging

Electrical package including bimetal lid

Apparatuses and methods for heat transfer from packaged semiconduct...

Limiting electronic package warpage

Electrical package including bimetal lid

Semiconductor package structure

Thermal interface material on package

Limiting electronic package warpage with semiconductor chip lid and...

Thermal interface material on package

High reliability wafer level semiconductor packaging

Semiconductor device packages

Methods for forming semiconductor device packages

Electronic apparatus and method for fabricating the same

Electronic apparatus and method for fabricating the same

Thermal interface material on package

Chip packages and methods of manufacture thereof

Semiconductor device having multiple bonded heat sinks

Semiconductor device and manufacturing method of semiconductor device

Printed circuit board

Thermal interface material on package

Patents Applicationslast 30 patents

Semiconductor Device Package with Thermal Module

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

DIE SEALANT FOR CHIP PACKAGING AND PACKAGING STRUCTURE

Semiconductor Device and Method for Sensing External Condition in H...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor Device and Method Forming Same

SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF FORMING THE SAME

Warpage Compensation for BGA Package

SEMICONDUCTOR PACKAGE ALIGNING INTERPOSER AND SUBSTRATE

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH PARTITIONED LOGIC AND ASS...

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

METHOD FOR MOUNTING COMPONENT

SHIELDED PACKAGE ASSEMBLIES WITH INTEGRATED CAPACITOR

HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING

THERMAL INTERFACE MATERIAL ON PACKAGE

HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING

THERMAL INTERFACE MATERIAL ON PACKAGE

LIMITING ELECTRONIC PACKAGE WARPAGE

HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING

SEMICONDUCTOR DEVICE AND MICROPHONE

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT PACKAGE INCLUDING WIRE BOND AND ELECTRICALLY CON...

WAFER-LEVEL PROCESS FOR FABRICATING PHOTOELECTRIC MODULES

LEAD FRAMELESS HERMETIC CIRCUIT PACKAGE