with a principal constituent of the material being a polymer

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H01L2224/4569

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4569with a principal constituent of the material being a polymer

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Chip package, method of forming a chip package and method of formin...
- Patent number 12,033,972
- Issue date Jul 9, 2024
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding insulated coating wire, connection structure, me...
- Patent number 11,791,304
- Issue date Oct 17, 2023
- Kaijo Corporation
- Akio Sugito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an electrical contact and method of forming a chi...
- Patent number 10,978,418
- Issue date Apr 13, 2021
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate-less stackable package with wire-bond interconnect
- Patent number 10,510,659
- Issue date Dec 17, 2019
- Invensas Corporation
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming a chip package with a metal cont...
- Patent number 10,461,056
- Issue date Oct 29, 2019
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods for forming semiconductor package
- Patent number 10,381,280
- Issue date Aug 13, 2019
- UTAC HEADQUARTERS PTE. LTD.
- Nathapong Suthiwongsunthorn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Mixed impedance leads for die packages and method of making the same
- Patent number 10,340,209
- Issue date Jul 2, 2019
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate-less stackable package with wire-bond interconnect
- Patent number 10,170,412
- Issue date Jan 1, 2019
- Invensas Corporation
- Ilyas Mohammed
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coated bond wires for die packages and methods of manufacturing sai...
- Patent number 9,997,489
- Issue date Jun 12, 2018
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate-less stackable package with wire-bond interconnect
- Patent number 9,953,914
- Issue date Apr 24, 2018
- Invensas Corporation
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat isolation structures for high bandwidth interconnects
- Patent number 9,859,188
- Issue date Jan 2, 2018
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die package with low electromagnetic interference interconnection
- Patent number 9,824,997
- Issue date Nov 21, 2017
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die packaging with fully or partially fused dielectric leads
- Patent number 9,812,420
- Issue date Nov 7, 2017
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate less die package having wires with dielectric and metal c...
- Patent number 9,711,479
- Issue date Jul 18, 2017
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 9,704,768
- Issue date Jul 11, 2017
- Mitsubishi Electric Corporation
- Yasuto Kawaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having a lead with selectively modified electrica...
- Patent number 9,673,137
- Issue date Jun 6, 2017
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing printed circuit boards
- Patent number 9,648,720
- Issue date May 9, 2017
- Semblant Global Limited
- Frank Ferdinandi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods for forming semiconductor package
- Patent number 9,613,877
- Issue date Apr 4, 2017
- UTAC HEADQUARTERS PTE. LTD.
- Nathapong Suthiwongsunthorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combined QFN and QFP semiconductor package
- Patent number 9,589,928
- Issue date Mar 7, 2017
- NXP USA, INC.
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire structure and semiconductor device having the same, and method...
- Patent number 9,373,602
- Issue date Jun 21, 2016
- Samsung Electronics Co., Ltd.
- Eun-kyung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for reducing corrosion in wire bonds
- Patent number 9,324,675
- Issue date Apr 26, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Burton J. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable wire method
- Patent number 9,245,670
- Issue date Jan 26, 2016
- Tessera, Inc.
- Cyprian Uzoh
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Aluminum coated copper ribbon
- Patent number 9,214,444
- Issue date Dec 15, 2015
- Heraeus Deutschland GmbH & Co. KG
- Eugen Milke
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Semiconductor module system having encapsulated through wire interc...
- Patent number 9,018,751
- Issue date Apr 28, 2015
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Method of direct tiling of an image sensor array
- Patent number 9,012,262
- Issue date Apr 21, 2015
- Teledyne Rad-icon Imaging Corp.
- Farrier Michael George
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with die stack arrangement including staggered...
- Patent number 8,853,863
- Issue date Oct 7, 2014
- SanDisk Technologies Inc.
- Chin-Chin Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a layer including niobium, and/or tantalu...
- Patent number 8,836,120
- Issue date Sep 16, 2014
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor
- Patent number 8,815,019
- Issue date Aug 26, 2014
- Nippon Steel & Sumikin Materials., Ltd.
- Tomohiro Uno
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Semiconductor device
- Patent number 8,766,420
- Issue date Jul 1, 2014
- Sumitomo Bakelite Co., Ltd.
- Shingo Itoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a through wire interconnect (TWI) on a semic...
- Patent number 8,741,667
- Issue date Jun 3, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING BONDING COVERS
- Publication number 20230343739
- Publication date Oct 26, 2023
- Semiconductor Components Industries, LLC
- Wuxing Xia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE-STABLE COMPOSITE OF A STRANDED WIRE HAVING A CONTACT PAD
- Publication number 20230318207
- Publication date Oct 5, 2023
- Heraeus Nexensos GmbH
- Matthias MUZIOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD FOR MANUF...
- Publication number 20220336402
- Publication date Oct 20, 2022
- Mitsubishi Electric Corporation
- Haruko HITOMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING INSULATED COATING WIRE, CONNECTION STRUCTURE, ME...
- Publication number 20210358881
- Publication date Nov 18, 2021
- KAIJO CORPORATION
- Akio SUGITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...
- Publication number 20210082861
- Publication date Mar 18, 2021
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL WIRE
- Publication number 20190385969
- Publication date Dec 19, 2019
- The Charles Stark Draper Laboratory, Inc.
- Caprice Gray Haley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-LESS STACKABLE PACKAGE WITH WIRE-BOND INTERCONNECT
- Publication number 20190096803
- Publication date Mar 28, 2019
- Invensas Corporation
- Ilyas Mohammed
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING SYSTEMS AND RELATED METHODS
- Publication number 20190013290
- Publication date Jan 10, 2019
- Semiconductor Components Industries, LLC
- Wentao QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate-Less Stackable Package With Wire-Bond Interconnect
- Publication number 20180233448
- Publication date Aug 16, 2018
- Invensas Corporation
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING SEMICONDUCTOR PACKAGE
- Publication number 20170294401
- Publication date Oct 12, 2017
- UTAC Headquarters Pte. Ltd.
- Nathapong SUTHIWONGSUNTHORN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COATED BOND WIRES FOR DIE PACKAGES AND METHODS OF MANUFACTURING SAI...
- Publication number 20170271296
- Publication date Sep 21, 2017
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED BOND WIRES FOR DIE PACKAGES AND METHODS OF MANUFACTURING SAI...
- Publication number 20170125370
- Publication date May 4, 2017
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PACKAGING WITH FULLY OR PARTIALLY FUSED DIELECTRIC LEADS
- Publication number 20160379952
- Publication date Dec 29, 2016
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A SUBSTRATE LESS DIE PACKAGE HAVING WIRES WITH DIELECTRIC AND METAL...
- Publication number 20160372440
- Publication date Dec 22, 2016
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXED IMPEDANCE LEADS FOR DIE PACKAGES AND METHOD OF MAKING THE SAME
- Publication number 20160372402
- Publication date Dec 22, 2016
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR REDUCING CORROSION IN WIRE BONDS
- Publication number 20150311173
- Publication date Oct 29, 2015
- BURTON J. CARPENTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE STRUCTURE AND SEMICONDUCTOR DEVICE HAVING THE SAME, AND METHOD...
- Publication number 20150061161
- Publication date Mar 5, 2015
- SUNGKYUNKWAN UNIVERSITY FOUNDATION FOR CORPORATE COLLABORATION
- Eun-kyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS AND METHOD
- Publication number 20140263584
- Publication date Sep 18, 2014
- Jia Lin Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE SYSTEM HAVING ENCAPSULATED THROUGH WIRE INTERC...
- Publication number 20140225259
- Publication date Aug 14, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
RELIABLE WIRE STRUCTURE AND METHOD
- Publication number 20140157592
- Publication date Jun 12, 2014
- Tessera, Inc.
- Cyprian Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A THROUGH WIRE INTERCONNECT (TWI) ON A SEMIC...
- Publication number 20140038406
- Publication date Feb 6, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF DIRECT TILING OF AN IMAGE SENSOR ARRAY
- Publication number 20140035084
- Publication date Feb 6, 2014
- Teledyne Rad-lcon Imaging Corporation
- Farrier Michael George
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed Circuit Boards
- Publication number 20130334292
- Publication date Dec 19, 2013
- Frank Ferdinandi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CORE WIRE
- Publication number 20130319726
- Publication date Dec 5, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Chin Teck Siong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH DIE STACK ARRANGEMENT INCLUDING STAGGERED...
- Publication number 20130207280
- Publication date Aug 15, 2013
- SANDISK TECHNOLOGIES INC.
- Chih-Chin Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE WIRE STRUCTURE AND METHOD
- Publication number 20120325517
- Publication date Dec 27, 2012
- Tessera, Inc.
- Cyprian Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING STACKED SEMICONDUCTOR SYSTEM WITH ENCAPSULAT...
- Publication number 20120288997
- Publication date Nov 15, 2012
- Micron Technology, Inc.
- DAVID R. HEMBREE
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor Device and Bonding Wire
- Publication number 20120267784
- Publication date Oct 25, 2012
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING INTERCONNECTION OF DUAL PARALLEL WIRES
- Publication number 20120228759
- Publication date Sep 13, 2012
- Wen-Jeng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120168927
- Publication date Jul 5, 2012
- Shingo Itoh
- H01 - BASIC ELECTRIC ELEMENTS

with a principal constituent of the material being a polymer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip package, method of forming a chip package and method of formin...

Method for bonding insulated coating wire, connection structure, me...

Method of forming an electrical contact and method of forming a chi...

Substrate-less stackable package with wire-bond interconnect

Chip package and method of forming a chip package with a metal cont...

Semiconductor packages and methods for forming semiconductor package

Mixed impedance leads for die packages and method of making the same

Substrate-less stackable package with wire-bond interconnect

Coated bond wires for die packages and methods of manufacturing sai...

Substrate-less stackable package with wire-bond interconnect

Heat isolation structures for high bandwidth interconnects

Die package with low electromagnetic interference interconnection

Die packaging with fully or partially fused dielectric leads

Substrate less die package having wires with dielectric and metal c...

Power semiconductor module

Electronic device having a lead with selectively modified electrica...

Method for manufacturing printed circuit boards

Semiconductor packages and methods for forming semiconductor package

Combined QFN and QFP semiconductor package

Wire structure and semiconductor device having the same, and method...

Structures for reducing corrosion in wire bonds

Reliable wire method

Aluminum coated copper ribbon

Semiconductor module system having encapsulated through wire interc...

Method of direct tiling of an image sensor array

Semiconductor device with die stack arrangement including staggered...

Semiconductor device with a layer including niobium, and/or tantalu...

Bonding wire for semiconductor

Semiconductor device

Method for fabricating a through wire interconnect (TWI) on a semic...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE INCLUDING BONDING COVERS

TEMPERATURE-STABLE COMPOSITE OF A STRANDED WIRE HAVING A CONTACT PAD

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD FOR MANUF...

METHOD FOR BONDING INSULATED COATING WIRE, CONNECTION STRUCTURE, ME...

CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...

COAXIAL WIRE

SUBSTRATE-LESS STACKABLE PACKAGE WITH WIRE-BOND INTERCONNECT

WIRE BONDING SYSTEMS AND RELATED METHODS

Substrate-Less Stackable Package With Wire-Bond Interconnect

SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING SEMICONDUCTOR PACKAGE

COATED BOND WIRES FOR DIE PACKAGES AND METHODS OF MANUFACTURING SAI...

COATED BOND WIRES FOR DIE PACKAGES AND METHODS OF MANUFACTURING SAI...

DIE PACKAGING WITH FULLY OR PARTIALLY FUSED DIELECTRIC LEADS

A SUBSTRATE LESS DIE PACKAGE HAVING WIRES WITH DIELECTRIC AND METAL...

MIXED IMPEDANCE LEADS FOR DIE PACKAGES AND METHOD OF MAKING THE SAME

STRUCTURES AND METHODS FOR REDUCING CORROSION IN WIRE BONDS

WIRE STRUCTURE AND SEMICONDUCTOR DEVICE HAVING THE SAME, AND METHOD...

WIRE BONDING APPARATUS AND METHOD

SEMICONDUCTOR MODULE SYSTEM HAVING ENCAPSULATED THROUGH WIRE INTERC...

RELIABLE WIRE STRUCTURE AND METHOD

METHOD FOR FABRICATING A THROUGH WIRE INTERCONNECT (TWI) ON A SEMIC...

METHOD OF DIRECT TILING OF AN IMAGE SENSOR ARRAY

Printed Circuit Boards

MULTI-CORE WIRE

SEMICONDUCTOR DEVICE WITH DIE STACK ARRANGEMENT INCLUDING STAGGERED...

RELIABLE WIRE STRUCTURE AND METHOD

METHOD FOR FABRICATING STACKED SEMICONDUCTOR SYSTEM WITH ENCAPSULAT...

Semiconductor Device and Bonding Wire

SEMICONDUCTOR PACKAGE HAVING INTERCONNECTION OF DUAL PARALLEL WIRES

SEMICONDUCTOR DEVICE