with a principal constituent of the material being a polymer

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H01L2224/4519

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4519with a principal constituent of the material being a polymer

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 11,342,299
- Issue date May 24, 2022
- Nippon Micrometal Corporation
- Daizo Oda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method for processing an ultra-high density space interconnect lead...
- Patent number 11,211,357
- Issue date Dec 28, 2021
- GUANGDONG UNIVERSITY OF TECHNOLOGY
- Yun Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding methods and systems incorporating metal nanoparticles
- Patent number 10,283,482
- Issue date May 7, 2019
- Lockheed Martin Corporation
- Randall Mark Stoltenberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Binding wire and semiconductor package structure using the same
- Patent number 9,960,141
- Issue date May 1, 2018
- Beijing FUNATE Innovation Technology Co., Ltd.
- Yu-Quan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire structure and semiconductor device having the same, and method...
- Patent number 9,373,602
- Issue date Jun 21, 2016
- Samsung Electronics Co., Ltd.
- Eun-kyung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly of radiofrequency chips
- Patent number 8,471,773
- Issue date Jun 25, 2013
- Commissariat a l'Energie Atomique
- Dominique Vicard
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for producing a set of chips mechanically interconnected by...
- Patent number 8,258,011
- Issue date Sep 4, 2012
- Commissariat a l'Energie Atomique
- Jean Brun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and system for composite bond wires
- Patent number 8,134,073
- Issue date Mar 13, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chris Wyland
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
On-chip magnetic components
- Patent number 7,719,112
- Issue date May 18, 2010
- University of Central Florida Research Foundation, Inc.
- Zheng John Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 7,417,324
- Issue date Aug 26, 2008
- NEC Electronics Corporation
- Tomochika Obiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire and bonded connection
- Patent number 7,319,196
- Issue date Jan 15, 2008
- EUPEC Europaeische Gesellschaft fur Leistungshalbleiter mbH
- Guy LeFranc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit interconnect
- Patent number 6,794,760
- Issue date Sep 21, 2004
- Intel Corporation
- Edward Jaeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus of bonding insulated and coated wire
- Patent number 4,950,866
- Issue date Aug 21, 1990
- Hitachi, Ltd.
- Toosaku Kojima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BOND WIRE HAVING A RECYCLED THERMOPLASTIC CORE WITH CONDUCTIVE FILLERS
- Publication number 20240404980
- Publication date Dec 5, 2024
- Western Digital Technologies, Inc.
- MUHAMAD RIDHWAN HAFIZ BIN ROSDI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20220108971
- Publication date Apr 7, 2022
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHOD FOR PROCESSING AN ULTRA-HIGH DENSITY SPACE INTERCONNECT LEAD...
- Publication number 20210210461
- Publication date Jul 8, 2021
- Guangdong University of Technology
- Yun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20180374816
- Publication date Dec 27, 2018
- Nippon Micrometal Corporation
- Daizo ODA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
THERMOELECTRIC BONDING FOR INTEGRATED CIRCUITS
- Publication number 20180226322
- Publication date Aug 9, 2018
- Intel Corporation
- Chwee Lin Choong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BINDING WIRE AND SEMICONDUCTOR PACKAGE STRUCTURE USING THE SAME
- Publication number 20150311174
- Publication date Oct 29, 2015
- BEIJING FUNATE INNOVATION TECHNOLOGY CO., LTD.
- YU-QUAN WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE STRUCTURE AND SEMICONDUCTOR DEVICE HAVING THE SAME, AND METHOD...
- Publication number 20150061161
- Publication date Mar 5, 2015
- SUNGKYUNKWAN UNIVERSITY FOUNDATION FOR CORPORATE COLLABORATION
- Eun-kyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR CONNECTING PLANAR POWER ELECTRONICS DEVICES
- Publication number 20130294042
- Publication date Nov 7, 2013
- Guo-Quan LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMER CORE WIRE
- Publication number 20120073859
- Publication date Mar 29, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assembly of Radiofrequency Chips
- Publication number 20100245182
- Publication date Sep 30, 2010
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Dominique Vicard
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR PRODUCING A SET OF CHIPS MECHANICALLY INTERCONNECTED BY...
- Publication number 20100136746
- Publication date Jun 3, 2010
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Jean Brun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND SYSTEM FOR COMPOSITE BOND WIRES
- Publication number 20090301757
- Publication date Dec 10, 2009
- Chris Wyland
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
On-Chip Magnetic Components
- Publication number 20080029845
- Publication date Feb 7, 2008
- UNIVERSITY OF CENTRAL FLORIDA RESEARCH FOUNDATION
- Zheng John Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding wire and bonded connection
- Publication number 20060055041
- Publication date Mar 16, 2006
- Eupec Europaische Gesellschaft fur Leistungshalbleiter mbH
- Guy LeFranc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20050200015
- Publication date Sep 15, 2005
- NEC Electronics Corporation
- Tomochika Obiya
- H01 - BASIC ELECTRIC ELEMENTS

with a principal constituent of the material being a polymer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding wire for semiconductor devices

Method for processing an ultra-high density space interconnect lead...

Wire bonding methods and systems incorporating metal nanoparticles

Binding wire and semiconductor package structure using the same

Wire structure and semiconductor device having the same, and method...

Assembly of radiofrequency chips

Method for producing a set of chips mechanically interconnected by...

Method and system for composite bond wires

On-chip magnetic components

Semiconductor device and method for manufacturing the same

Bonding wire and bonded connection

Integrated circuit interconnect

Method and apparatus of bonding insulated and coated wire

Patents Applicationslast 30 patents

BOND WIRE HAVING A RECYCLED THERMOPLASTIC CORE WITH CONDUCTIVE FILLERS

BONDING WIRE FOR SEMICONDUCTOR DEVICES

METHOD FOR PROCESSING AN ULTRA-HIGH DENSITY SPACE INTERCONNECT LEAD...

BONDING WIRE FOR SEMICONDUCTOR DEVICES

THERMOELECTRIC BONDING FOR INTEGRATED CIRCUITS

BINDING WIRE AND SEMICONDUCTOR PACKAGE STRUCTURE USING THE SAME

WIRE STRUCTURE AND SEMICONDUCTOR DEVICE HAVING THE SAME, AND METHOD...

METHODS AND APPARATUS FOR CONNECTING PLANAR POWER ELECTRONICS DEVICES

POLYMER CORE WIRE

Assembly of Radiofrequency Chips

METHOD FOR PRODUCING A SET OF CHIPS MECHANICALLY INTERCONNECTED BY...

METHOD AND SYSTEM FOR COMPOSITE BOND WIRES

On-Chip Magnetic Components

Bonding wire and bonded connection

Semiconductor device and method for manufacturing the same