with a principal constituent of the material being a polymer

Industry

CPC
H01L2224/2939

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/2939with a principal constituent of the material being a polymer

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Multi-layer sheet for mold underfill encapsulation, method for mold...
- Patent number 12,362,310
- Issue date Jul 15, 2025
- Nagase Chemtex Corporation
- Daisuke Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,340,759
- Issue date Jun 24, 2025
- Samsung Display Co., Ltd.
- Sujeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal structure for semiconductor device and method of forming th...
- Patent number 12,272,613
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive member, display device, and manufacturing method of displa...
- Patent number 12,272,667
- Issue date Apr 8, 2025
- Samsung Display Co., Ltd.
- Jung Hoon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 12,243,844
- Issue date Mar 4, 2025
- Samsung Display Co., Ltd.
- Byoungyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro LED display and manufacturing method therefor
- Patent number 12,218,295
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Byunghoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and temperature measurement method
- Patent number 12,163,845
- Issue date Dec 10, 2024
- Fuji Electric Co., Ltd.
- Shinichi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabrcating the same
- Patent number 12,148,732
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin particles, electrically conductive particles, electrically co...
- Patent number 12,122,885
- Issue date Oct 22, 2024
- Sekisui Chemical Co., Ltd.
- Kouki Ookura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Energy augmentation structures, energy emitters or energy collector...
- Patent number 12,121,746
- Issue date Oct 22, 2024
- Immunolight, LLC
- Frederic A Bourke
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 12,119,321
- Issue date Oct 15, 2024
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Bonding structure production method and bonding structure
- Patent number 12,094,850
- Issue date Sep 17, 2024
- Osaka University
- Katsuaki Suganuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Energy augmentation structures in adhesive bonding compositions
- Patent number 12,076,579
- Issue date Sep 3, 2024
- Immunolight, LLC
- Frederic A Bourke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package, heat dissipation structure and manufacturing me...
- Patent number 12,080,618
- Issue date Sep 3, 2024
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compressible foamed thermal interface materials and methods of maki...
- Patent number 12,033,971
- Issue date Jul 9, 2024
- Laird Technologies, Inc.
- Vijayaraghavan Rajagopal
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Integration and bonding of micro-devices into system substrate
- Patent number 12,014,999
- Issue date Jun 18, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Energy augmentation structures and their use in solar cells and oth...
- Patent number 11,998,760
- Issue date Jun 4, 2024
- Immunolight, LLC
- Frederic A. Bourke
- F21 - LIGHTING
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,990,435
- Issue date May 21, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Energy augmentation structures, and their use in adhesive bonding
- Patent number 11,964,166
- Issue date Apr 23, 2024
- Immunolight, LLC
- Frederic A Bourke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Energy augmentation structures for use with energy emitters and col...
- Patent number 11,964,167
- Issue date Apr 23, 2024
- Immunolight, LLC
- Frederic A Bourke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and connected structure
- Patent number 11,923,335
- Issue date Mar 5, 2024
- Dexerials Corporation
- Seiichiro Shinohara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive member, display device, and manufacturing method of displa...
- Patent number 11,923,330
- Issue date Mar 5, 2024
- Samsung Display Co., Ltd.
- Jung Hoon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with routing patch and conductive interconnec...
- Patent number 11,901,335
- Issue date Feb 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal transfer structures for semiconductor die assemblies
- Patent number 11,862,611
- Issue date Jan 2, 2024
- Micron Technology, Inc.
- Ed A. Schrock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure comprising heat dissipation member
- Patent number 11,804,417
- Issue date Oct 31, 2023
- TECAT TECHNOLOGIES (SUZHOU) LIMITED
- Choon Leong Lou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermosetting resin composition, semiconductor device, and electric...
- Patent number 11,784,153
- Issue date Oct 10, 2023
- Kyocera Corporation
- Masakazu Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and method of producing the same
- Patent number 11,784,154
- Issue date Oct 10, 2023
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing stacked semiconductor die assemblies with...
- Patent number 11,776,877
- Issue date Oct 3, 2023
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compressible foamed thermal interface materials and methods of maki...
- Patent number 11,776,928
- Issue date Oct 3, 2023
- Laird Technologies, Inc.
- Vijayaraghavan Rajagopal
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
DIE ATTACH FILM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250210448
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Myoungchul Eum
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH HIGH CAPA...
- Publication number 20250201768
- Publication date Jun 19, 2025
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Structure for Semiconductor Device and Method of Forming th...
- Publication number 20250201649
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HEAT-SPREADING LID
- Publication number 20250201668
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
- Publication number 20250157985
- Publication date May 15, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE
- Publication number 20250140670
- Publication date May 1, 2025
- HYPERTAC S.P.A.
- Alessandro Bosca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ATTACH FILM, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND MET...
- Publication number 20250132280
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Hansol Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE CONNECTIONS FOR INTERCONNECT BRIDGES AND REL...
- Publication number 20250112165
- Publication date Apr 3, 2025
- Intel Corporation
- Brandon Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE COMPRISING DAM AND MULTI-LAYERED UNDER-FILL L...
- Publication number 20250070072
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Seongyo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED WCSP WITH THERMAL PAD FOR EFFICIENT HEAT DISSIPATION
- Publication number 20250046668
- Publication date Feb 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Gail Edselle S. REYES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Dissipating Structure and Methods of Forming The Same
- Publication number 20250046667
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL
- Publication number 20250014965
- Publication date Jan 9, 2025
- Henkel AG & Co. KGaA
- Yong Joon Lee
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LOW PRESSURE SINTERING POWDER
- Publication number 20240413117
- Publication date Dec 12, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Application
REDISTRIBUTION STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240387450
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL INCLUDING A MULTI-LAYER STRUCTURE AND ME...
- Publication number 20240371722
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Chien Pan
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240347012
- Publication date Oct 17, 2024
- SAMSUNG DISPLAY CO., LTD.
- SUJEONG KIM
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240304577
- Publication date Sep 12, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CONDUCTIVE ADHESIVE FILM AND FABRICATION METHOD THEREFOR, ELECTRONI...
- Publication number 20240304586
- Publication date Sep 12, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Shaopeng LI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
- Publication number 20240297133
- Publication date Sep 5, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
- Publication number 20240266324
- Publication date Aug 8, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENERGY AUGMENTATION STRUCTURES FOR USE WITH ENERGY EMITTERS AND COL...
- Publication number 20240216713
- Publication date Jul 4, 2024
- Immunolight, LLC
- Frederic A. BOURKE
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT...
- Publication number 20240203754
- Publication date Jun 20, 2024
- Arieca Inc.
- Navid Kazem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...
- Publication number 20240128224
- Publication date Apr 18, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jung Hoon SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENERGY AUGMENTATION STRUCTURES, ENERGY EMITTERS OR ENERGY COLLECTOR...
- Publication number 20240115878
- Publication date Apr 11, 2024
- Immunolight, LLC
- Frederic A. BOURKE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THERMALLY-CONDUCTIVE SHEET AND ELECTRONIC DEVICE
- Publication number 20240120254
- Publication date Apr 11, 2024
- DEXERIALS CORPORATION
- Keisuke ARAMAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPRESSIBLE FOAMED THERMAL INTERFACE MATERIALS AND METHODS OF MAKI...
- Publication number 20240105663
- Publication date Mar 28, 2024
- Laird Technologies, Inc.
- Vijayaraghavan RAJAGOPAL
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
STACKED SEMICONDUCTOR METHOD AND APPARATUS
- Publication number 20240096745
- Publication date Mar 21, 2024
- Mayank Mayukh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID ALLOY THERMAL PASTE AND FABRICATION METHOD THEREOF
- Publication number 20240067855
- Publication date Feb 29, 2024
- COOLER MATERIALS TECHNOLOGY INC.
- Po-Wen CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TANTALUM DOPED RUTHENIUM LAYERS FOR INTERCONNECTS
- Publication number 20240071927
- Publication date Feb 29, 2024
- Applied Materials, Inc.
- Shinjae Hwang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CO-PACKAGE FOR QUBITS AND PARAMETRIC JOSEPHSON DEVICES
- Publication number 20240038723
- Publication date Feb 1, 2024
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS

with a principal constituent of the material being a polymer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multi-layer sheet for mold underfill encapsulation, method for mold...

Electronic device

Thermal structure for semiconductor device and method of forming th...

Adhesive member, display device, and manufacturing method of displa...

Display device and method of manufacturing the same

Micro LED display and manufacturing method therefor

Semiconductor device and temperature measurement method

Package structure and method of fabrcating the same

Resin particles, electrically conductive particles, electrically co...

Energy augmentation structures, energy emitters or energy collector...

Semiconductor device and a method of manufacturing thereof

Low pressure sintering powder

Bonding structure production method and bonding structure

Energy augmentation structures in adhesive bonding compositions

Electronic package, heat dissipation structure and manufacturing me...

Compressible foamed thermal interface materials and methods of maki...

Integration and bonding of micro-devices into system substrate

Energy augmentation structures and their use in solar cells and oth...

Fingerprint sensor and manufacturing method thereof

Energy augmentation structures, and their use in adhesive bonding

Energy augmentation structures for use with energy emitters and col...

Anisotropic conductive film and connected structure

Adhesive member, display device, and manufacturing method of displa...

Semiconductor package with routing patch and conductive interconnec...

Thermal transfer structures for semiconductor die assemblies

Semiconductor structure comprising heat dissipation member

Thermosetting resin composition, semiconductor device, and electric...

Anisotropic conductive film and method of producing the same

Methods of manufacturing stacked semiconductor die assemblies with...

Compressible foamed thermal interface materials and methods of maki...

Patents Applicationslast 30 patents

DIE ATTACH FILM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH HIGH CAPA...

Thermal Structure for Semiconductor Device and Method of Forming th...

STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HEAT-SPREADING LID

SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH

OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE

CHIP ATTACH FILM, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND MET...

ANISOTROPIC CONDUCTIVE CONNECTIONS FOR INTERCONNECT BRIDGES AND REL...

SEMICONDUCTOR PACKAGE COMPRISING DAM AND MULTI-LAYERED UNDER-FILL L...

ENCAPSULATED WCSP WITH THERMAL PAD FOR EFFICIENT HEAT DISSIPATION

Heat Dissipating Structure and Methods of Forming The Same

THERMAL INTERFACE MATERIAL

LOW PRESSURE SINTERING POWDER

REDISTRIBUTION STRUCTURE AND METHOD OF FORMING THE SAME

THERMAL INTERFACE MATERIAL INCLUDING A MULTI-LAYER STRUCTURE AND ME...

ELECTRONIC DEVICE

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

CONDUCTIVE ADHESIVE FILM AND FABRICATION METHOD THEREFOR, ELECTRONI...

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH

ENERGY AUGMENTATION STRUCTURES FOR USE WITH ENERGY EMITTERS AND COL...

METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT...

ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...

ENERGY AUGMENTATION STRUCTURES, ENERGY EMITTERS OR ENERGY COLLECTOR...

THERMALLY-CONDUCTIVE SHEET AND ELECTRONIC DEVICE

COMPRESSIBLE FOAMED THERMAL INTERFACE MATERIALS AND METHODS OF MAKI...

STACKED SEMICONDUCTOR METHOD AND APPARATUS

LIQUID ALLOY THERMAL PASTE AND FABRICATION METHOD THEREOF

TANTALUM DOPED RUTHENIUM LAYERS FOR INTERCONNECTS

CO-PACKAGE FOR QUBITS AND PARAMETRIC JOSEPHSON DEVICES